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    • 10. 发明申请
    • LIGHT EMITTING DEVICE (LED), MANUFACTURING METHOD THEREOF, AND LED MODULE USING THE SAME
    • 发光装置(LED)及其制造方法及其使用的LED模块
    • US20130092962A1
    • 2013-04-18
    • US13655100
    • 2012-10-18
    • Ho Sun PaekHak Hwan KimIll Heung ChoiKyung Mi Moon
    • Ho Sun PaekHak Hwan KimIll Heung ChoiKyung Mi Moon
    • H01L33/08H01L33/62
    • H01L33/62H01L33/44H01L2224/16225
    • A light emitting device (LED), a manufacturing method thereof, and an LED module using the same. The LED may include a first semiconductor layer, an active layer, and a second semiconductor layer formed sequentially on a light-transmitting substrate, a first electrode formed in a region exposed by removing a part of the first semiconductor layer, a second electrode formed on the second semiconductor layer, a passivation layer formed on the first electrode and the second electrode to expose a region of the first electrode and a region of the second electrode, a first bump formed in a first region including the first electrode exposed through the passivation layer, and extended to another region of the second electrode on which the passivation layer is formed, and a second bump formed in a second region including the second electrode exposed through the passivation layer.
    • 发光装置(LED)及其制造方法以及使用其的LED模块。 LED可以包括在透光性基板上依次形成的第一半导体层,有源层和第二半导体层,形成在通过去除第一半导体层的一部分而露出的区域中的第一电极,形成在 所述第二半导体层,形成在所述第一电极和所述第二电极上以钝化所述第一电极的区域和所述第二电极的区域的钝化层,形成在包括通过所述钝化层暴露的所述第一电极的第一区域中的第一凸起 并且延伸到其上形成有钝化层的第二电极的另一区域,以及形成在包括通过钝化层暴露的第二电极的第二区域中的第二凸块。