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    • 4. 发明授权
    • Method for fabricating semiconductor device
    • 制造半导体器件的方法
    • US06562686B2
    • 2003-05-13
    • US10083187
    • 2002-02-26
    • Hi Deok Lee
    • Hi Deok Lee
    • H01L21336
    • H01L29/6659H01L29/665H01L29/66628H01L29/7834Y10S438/918
    • A method for fabricating a semiconductor device employing a salicide (self-aligned silicide) structure is disclosed. The method prevents a junction leakage current from being increased at a portion of a source/drain region which is adjacent to an field oxide, by forming the source/drain region comprised of a relatively deep SID region and a relatively shallow SID region, wherein the deep SID region is formed adjacent to the field oxide and the shallow SID region is formed adjacent to the insulating film spacer. The method comprises the steps of forming a field oxide in a semiconductor substrate, forming a gate oxide and a gate electrode on the semiconductor substrate, forming an LDD region in the semiconductor substrate along a side of the gate electrode, forming a sidewall spacer on each sidewall of the gate electrode, forming a protection layer pattern covering the field oxide and a portion of the LDD region, forming a SEG layer where the protection layer pattern is not covered, removing the protection layer pattern to expose the portion of the LDD region, forming a source/drain region comprised of a deep SID region and a shallow SID region, forming a silicide layer on the gate electrode, the SEG layer and the deep SID region.
    • 公开了一种制造采用硅化物(自对准硅化物)结构的半导体器件的方法。 该方法通过形成由相对较深的SID区域和相对较浅的SID区域构成的源极/漏极区域来防止在与场氧化物相邻的源极/漏极区域的部分处增加结漏电流,其中, 形成与场氧化物相邻的深SID区域,并且与绝缘膜间隔物相邻形成浅的SID区域。 该方法包括以下步骤:在半导体衬底中形成场氧化物,在半导体衬底上形成栅极氧化物和栅电极,沿半导体衬底沿着栅电极侧形成LDD区, 形成覆盖场氧化物的保护层图案和LDD区域的一部分,形成保护层图案未被覆盖的SEG层,去除保护层图案以露出LDD区域的部分, 形成由深SID区域和浅SID区域构成的源极/漏极区域,在栅电极,SEG层和深SID区域上形成硅化物层。
    • 6. 发明授权
    • Method for fabricating semiconductor device
    • 制造半导体器件的方法
    • US06709939B2
    • 2004-03-23
    • US10409964
    • 2003-04-09
    • Hi Deok LeeSeong Hyung Park
    • Hi Deok LeeSeong Hyung Park
    • H01L21336
    • H01L29/6659H01L29/665H01L29/7833
    • A method for fabricating a semiconductor device is disclosed. In a high speed device structure consisting of a salicide, in order to fabricate a device having at least two gate oxide structures in the identical chip, an LDD region of a core device region is formed, and an ion implant process for forming the LDD region of an input/output device region having a thick gate oxide and a process for forming a source/drain region at the rim of a field oxide of the core device region having a thin gate oxide are performed at the same time, thereby increasing a depth of a junction region. Thus, the junction leakage current is decreased in the junction region of the peripheral circuit region, and the process is simplified. As a result, a process yield and reliability of the device are improved.
    • 公开了一种制造半导体器件的方法。 在由自对准硅化物组成的高速装置结构中,为了制造在同一芯片中具有至少两个栅极氧化物结构的器件,形成芯部器件区域的LDD区域,形成LDD区域的离子注入工艺 具有厚栅极氧化物的输入/输出器件区域和用于在具有薄栅极氧化物的芯器件区域的场氧化物的边缘处形成源极/漏极区域的工艺同时进行,从而增加深度 的连接区域。 因此,在外围电路区域的结区域中结漏电流减小,并且处理简化。 结果,改善了设备的工艺成品率和可靠性。
    • 7. 发明授权
    • Semiconductor device having a silicide layer and manufacturing method thereof
    • 具有硅化物层的半导体器件及其制造方法
    • US07605068B2
    • 2009-10-20
    • US11345265
    • 2006-01-31
    • Chel Jong ChoiYong Jin KimHi Deok Lee
    • Chel Jong ChoiYong Jin KimHi Deok Lee
    • H01L21/3205H01L21/44
    • H01L29/7833H01L21/28518H01L29/665H01L29/6659
    • Provided is a semiconductor device and a manufacturing method thereof. The method includes the steps of: forming a thin film transistor including a substrate having a semiconductor layer and silicon, a gate insulation layer formed on the semiconductor layer, a gate electrode formed on the gate insulation layer, and source and drain regions formed in the semiconductor layer; forming a first metal layer on the substrate having the semiconductor layer and the gate electrode; forming a second metal layer on the first metal layer; forming a third metal layer on the second metal layer; forming a nitride layer on the third metal layer; and annealing the substrate having the nitride layer, and forming a silicide layer on the gate electrode and the source and drain regions.
    • 提供一种半导体器件及其制造方法。 该方法包括以下步骤:形成薄膜晶体管,其包括具有半导体层和硅的衬底,形成在半导体层上的栅极绝缘层,形成在栅极绝缘层上的栅极电极以及形成在栅极绝缘层中的源极和漏极区域 半导体层; 在具有半导体层和栅电极的基板上形成第一金属层; 在所述第一金属层上形成第二金属层; 在所述第二金属层上形成第三金属层; 在所述第三金属层上形成氮化物层; 以及使具有氮化物层的衬底退火,以及在栅电极和源极和漏极区上形成硅化物层。