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1. 发明授权

US06207272B1 Peelable heat-conductive and pressure-sensitive adhesive and adhesive sheet containing the same 失效
标题翻译：可剥离的导热和压敏粘合剂和含有它的粘合片
公开(公告)号：US06207272B1
公开(公告)日：2001-03-27
申请号：US09079195
申请日：1998-05-15
申请人： Hitoshi Takahira , Masahiro Oura , Kazuyuki Kitakura , Takao Yoshikawa , Shigeki Muta
发明人： Hitoshi Takahira , Masahiro Oura , Kazuyuki Kitakura , Takao Yoshikawa , Shigeki Muta
IPC分类号： C09J702
CPC分类号： C09J133/08 , C08L2666/28 , C08L2666/54 , C09J7/28 , C09J7/385 , C09J2433/00 , Y10T428/2804 , Y10T428/2891
摘要： A peelable heat-conductive and pressure-sensitive adhesive is disclosed, which comprises: (a) 100 parts by weight of a polymer produced from a monomer mixture comprising from 70 to 100% by weight of one or more alkyl (meth)acrylates in which the alkyl groups on the average have 2 to 14 carbon atoms and from 0 to 30% by weight of one or more monoethylenic monomers copolymerizable therewith, each based on the amount of the monomer mixture; (b) from 20 to 400 parts by weight of a plasticizer having a boiling point of 150° C. or higher; and (c) from 10 to 1,000 parts by weight of a heat-conductive filler. Also disclosed is an adhesive sheet comprising a substrate and, formed on one or each side thereof, a layer of the adhesive. The pressure-sensitive adhesive can exhibit tight adhesion during use and easy peeling after use.
摘要翻译：公开了一种可剥离的导热和压敏粘合剂，其包括：（a）100重量份由包含70至100重量％的一种或多种（甲基）丙烯酸烷基酯的单体混合物制备的聚合物，其中烷基平均具有2至14个碳原子和0至30重量％的一种或多种可与其共聚的单烯属单体，各自基于单体混合物的量; （b）20〜400重量份的沸点为150℃以上的增塑剂; 和（c）10〜1,000重量份的导热填料。还公开了一种粘合片，其包括基底，并且在其一侧或两侧上形成粘合剂层。压敏粘合剂在使用过程中表现出紧密的粘合性，使用后容易剥离。

2. 发明授权

US6086994A Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating member using the same 失效
标题翻译：导热性和压敏粘合片以及使用其的散热构件将电子部件固定的方法
公开(公告)号：US6086994A
公开(公告)日：2000-07-11
申请号：US61142
申请日：1998-04-16
申请人： Masahiro Oura , Kazuyuki Kitakura , Shigeki Muta , Takao Yoshikawa
发明人： Masahiro Oura , Kazuyuki Kitakura , Shigeki Muta , Takao Yoshikawa
IPC分类号： B32B7/12 , C08L79/08 , C09J5/00 , C09J7/02 , C09J133/06 , H01L21/58 , H01L23/373 , B32B15/04
CPC分类号： H01L24/83 , C09J7/0246 , C09J7/026 , H01L23/3737 , H01L24/28 , C08L79/08 , C09J2201/122 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01074 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/19043 , Y10T428/2809 , Y10T428/2891
摘要： Heat-conductive and pressure-sensitive adhesive sheets which are excellent in heat resistance, scarcely undergo anchoring fracture between the base material and the adhesive layer and, therefore, are usable in fixing electronic parts to heat-radiating members or fixing members in various fields including constructive materials, vehicles, aircrafts and ships. the heat-conductive and pressure-sensitive adhesive sheets are in the form of sheets, tapes, etc. wherein a layer of a heat-conductive and pressure-sensitive adhesive composition, which contains an alkyl (meth)acrylate polymer having hydrophilic groups, is formed on the high frequency sputter-etched surface(s) of a plastic film containing 2 to 50% by volume of a heat-conductive, electrical insulating filler.
摘要翻译：耐热性优异的导热性和压敏性粘合片几乎不会在基材和粘合剂层之间发生锚固断裂，因此可用于将电子部件固定在各种领域的散热构件或固定构件中，包括建筑材料，车辆，飞机和船舶。导热性和压敏粘合片是片状，带状等形式，其中含有具有亲水基团的（甲基）丙烯酸烷基酯聚合物的导热和压敏粘合剂组合物层是形成在包含2至50体积％的导热电绝缘填料的塑料膜的高频溅射蚀刻表面上。

3. 发明授权

US06194063B1 Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same 有权
标题翻译：导热性和压敏粘合片以及使用其将电子部件固定到散热构件的方法
公开(公告)号：US06194063B1
公开(公告)日：2001-02-27
申请号：US09225360
申请日：1999-01-05
申请人： Masahiro Oura , Kazuyuki Kitakura , Takao Yoshikawa
发明人： Masahiro Oura , Kazuyuki Kitakura , Takao Yoshikawa
IPC分类号： B32B712
CPC分类号： H01L23/3737 , H01L2924/0002 , Y10T428/28 , Y10T428/2848 , Y10T428/31725 , H01L2924/00
摘要： The present invention provides a heat-conductive and pressure-sensitive adhesive sheet comprising an electrical insulating plastic film having formed on one or both of the surfaces thereof (1) at least one thin layer composed of an inorganic material selected from the group consisting of ceramics, metals and metal oxides other than ceramics, and (2) a pressure-sensitive adhesive composition layer formed on the thin layer. The heat-conductive and pressure-sensitive adhesive sheet is excellent in heat-conductivity and pressure-sensitivity, results in no trouble such as complicated procedures in the production process or worsened working environment, exhibits good adhesion between the base material and the pressure-sensitive adhesive composition layer, scarcely undergoes anchoring fracture between the base material even after allowing to stand at high temperatures for a long time, and has good heat resistance.
摘要翻译：本发明提供了一种导热性和压敏粘合片，其包括在其一个或两个表面上形成的电绝缘塑料膜（1），至少一个由选自以下的无机材料构成的薄层：陶瓷，除了陶瓷之外的金属和金属氧化物，和（2）形成在薄层上的压敏粘合剂组合物层。导热性和压敏粘合片的导热性和压敏性优异，不会产生生产过程中的复杂程序或恶化的工作环境等问题，在基材和压敏粘合剂之间表现出良好的粘附性粘合剂组合物层，即使在高温下长时间放置之后也几乎不会在基材之间发生锚固断裂，并且具有良好的耐热性。

4. 发明授权

US6130269A Pressure-sensitive adhesive of (meth)acrylate, unsaturated acid, poly(meth)acrylate and epoxy resin 有权
标题翻译：（甲基）丙烯酸酯，不饱和酸，聚（甲基）丙烯酸酯和环氧树脂的压敏粘合剂
公开(公告)号：US6130269A
公开(公告)日：2000-10-10
申请号：US194340
申请日：1998-11-24
申请人： Kazuhito Hosokawa , Shigeki Muta , Hitoshi Takahira , Takao Yoshikawa
发明人： Kazuhito Hosokawa , Shigeki Muta , Hitoshi Takahira , Takao Yoshikawa
IPC分类号： C09J7/02 , C09J4/00 , C09J4/02 , C09J4/06 , C09J133/06 , C09J163/00 , C08F2/48 , C08G59/17 , C08J3/28
CPC分类号： C09J4/00 , C09J4/06
摘要： A thermosetting pressure-sensitive adhesive comprising a photopolymerization product of a composition containing a) 100 parts by weight of a (meth) acrylic acid alkyl ester wherein the average carbon atom number of the alkyl group is from 2 to 14 and from 30 to 1% by weight of a monoethylenically unsaturated acid copolymerizable with the ester, b) from 0.02 to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, c) from 0.01 to 4 parts by weight of a photopolymerization initiator, and d) from 5 to 30 parts by weight of an epoxy resin, and not substantially containing a curing agent for the epoxy resin, and an adhesive sheet using the thermosetting type pressure-sensitive adhesive.
摘要翻译： PCT No.PCT / JP97 / 01811 Sec。 371日期：1998年11月24日 102（e）1998年11月24日PCT PCT 1997年5月28日PCT公布。 WO97 / 45500 PCT公开号日本公报1997年12月4日一种热固性压敏粘合剂，其包含组合物的光聚合产物，其含有a）100重量份的（甲基）丙烯酸烷基酯，其中烷基的平均碳原子数为2〜14，可与酯共聚的单烯属不饱和酸30〜1重量％，b）0.02〜5重量份作为交联剂的多官能（甲基）丙烯酸酯，c）0.01〜4重量份的光聚合引发剂，以及d）5〜30重量份的环氧树脂，并且基本上不含有用于环氧树脂的固化剂，以及使用该热固性型压敏粘合剂的粘合片。

5. 发明授权

US06284368B1 Photopolymerizable composition, pressure-sensitive flame-retardant adhesive, and adhesive sheets 失效
公开(公告)号：US06284368B1
公开(公告)日：2001-09-04
申请号：US09155075
申请日：1998-09-21
申请人： Shigeki Muta , Takao Yoshikawa , Masahiro Oura
发明人： Shigeki Muta , Takao Yoshikawa , Masahiro Oura
IPC分类号： C08F244
摘要： Adhesive sheets using an acrylic pressure-sensitive flame-retardant adhesive having excellent properties such as adhesive force and holding power at high temperature and also having a self fire-extinguishing property which instantaneously extinguishes fire, i.e., a flame-retardance, are provided. A photopolymerizable composition comprising a) 100 parts by weight of a monomer (or the oligomer thereof) comprising 70 to 100% by weight of a (meth)acrylic acid alkyl ester having on the average a carbon number of 2 to 14 in the alkyl group and 30 to 0% by weight of a monoethylenically unsaturated monomer copolymerizable with the ester, b) 0.02 to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, c) 0.01 to 5 parts by weight of a photopolymerization initiator, and d) 10 to 180 parts by weight of a flame retardant having a melting point of at least 60° C. is prepared, a pressure-sensitive flame-retardant adhesive is prepared from the photopolymerized product of the composition, and the adhesive is formed on one or both surfaces of a substrate.

6. 发明授权

US06299975B1 Pressure-sensitive adhesive sheets comprising photo-polymerization product and production method thereof 有权
标题翻译：包含光聚合产物的压敏粘合片及其制备方法
公开(公告)号：US06299975B1
公开(公告)日：2001-10-09
申请号：US09234126
申请日：1999-01-19
申请人： Hitoshi Takahira , Masahiro Oura , Takao Yoshikawa , Hiroaki Kishioka
发明人： Hitoshi Takahira , Masahiro Oura , Takao Yoshikawa , Hiroaki Kishioka
IPC分类号： B32B712
CPC分类号： C09J133/06 , C08F220/12 , C08L33/06 , C08L2666/44 , C09J7/10 , C09J2201/606 , Y10T428/28 , Y10T428/31504
摘要： A pressure-sensitive adhesive sheet prepared by coating a composition containing a) 100 parts by weight of monomers composed of from 70 to 100% by weight of a (meth)acrylic acid alkyl ester, said alkyl group having from 2 to 14 carbon atoms, and from 0 to 30% by weight of a monoethylenically unsaturated monomer copolymerizing therewith, b) from 0.1 to 5 parts by weight of a radical chain inhibitor, c) from 0.02 to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, d) from 0.005 to 1 part by weight of a photopolymerization initiator, and e) from 0.01 to 10 parts by weight of a silane coupling agent, on a releasing-treated film having a good surface smoothness and photopolymerizing the coated layer to form a pressure-sensitive adhesive layer having a haze value of 1% or lower and a total light transmission of at least 90%. The pressure-sensitive adhesive sheet is excellent in the transparency, the foaming resistance, the low out-gas property, and the discoloring resistance (heat resistance and weather resistance).
摘要翻译：一种压敏粘合片，其通过涂布组合物制备，所述组合物含有：100重量份由70至100重量％的（甲基）丙烯酸烷基酯，所述具有2至14个碳原子的烷基，和0至30重量％的与其共聚的单烯属不饱和单体，b）0.1至5重量份的自由基链抑制剂，c）0.02至5重量份作为交联的多官能（甲基）丙烯酸酯试剂，d）0.005〜1重量份的光聚合引发剂，以及e）0.01〜10重量份的硅烷偶联剂，在具有良好表面光滑度的脱模处理膜和光聚合涂层上形成雾度值为1％以下，总透光率为90％以上的粘合剂层。粘合片的透明性，耐发泡性，低气体性，耐褪色性（耐热性和耐候性）优异。

7. 发明授权

US6162319A Pressure-sensitive adhesive having excellent heat resistance and heat conductivity, adhesive sheets, and method of securing electronic component to heat-radiating member therewith 有权
标题翻译：具有优异的耐热性和导热性的压敏粘合剂，粘合片以及将电子部件固定到散热构件的方法
公开(公告)号：US6162319A
公开(公告)日：2000-12-19
申请号：US194180
申请日：1998-11-24
申请人： Masahiro Ohura , Shigeki Muta , Takao Yoshikawa
发明人： Masahiro Ohura , Shigeki Muta , Takao Yoshikawa
IPC分类号： C09J7/02 , C08F220/18 , C09D133/06 , C09J4/00 , C09J4/02 , C09J133/04 , C09J133/06 , C09J133/08 , H01L21/58 , H01L23/373 , H05K3/30 , B32B31/00
CPC分类号： C09J133/08 , C08F220/18 , C08L2666/54 , C09J4/00 , H01L23/3737 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/29298 , H01L2224/8319 , H01L2224/8385 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/07802 , H01L2924/14 , H01L2924/19043 , H01L2924/3025 , Y10T428/2809 , C08F220/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A pressure-sensitive adhesive excellent in the heat resistance and the heat-conductivity comprising a photopolymerization product of a composition containing a) 100 parts by weight of an acrylic monomer mixture or the partial polymerized product thereof, b) from 0.01 to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, c) from 10 to 300 parts by weight of a ceramic powder made up of a covalent bond substance having the total valence electron number of 8 and having a wurtzite type or zincblende type crystal structure or a substance of a hexagonal system or a graphite structure, and d) from 0.01 to 5 parts by weight of a photopolymerization initiator; an adhesive sheet using the pressure-sensitive adhesive; and a fixing method of electronic parts and heat-radiating members using them. By using the adhesive materials, electronic parts and heat-radiating members can be easily fixed by adhesion without requiring much time and large labor, and there is no fear that peeling and deterioration occur, even when they are subjected to a heat cycle of quick heating and quick cooling.
摘要翻译： PCT No.PCT / JP97 / 01812 Sec。 371日期：1998年11月24日 102（e）1998年11月24日PCT PCT 1997年5月28日PCT公布。第WO97 / 45499号公报日期1997年12月4日一种耐热性和导热性优异的压敏粘合剂，其包含含有a）100重量份丙烯酸单体混合物或其部分聚合产物的组合物的光聚合产物，b）0.01 至5重量份作为交联剂的多官能（甲基）丙烯酸酯，c）10至300重量份由总价电子数为8并具有纤锌矿型共价键的物质组成的陶瓷粉末或锌辉石型晶体结构或六方晶系或石墨结构物，d）0.01〜5重量份的光聚合引发剂; 使用该压敏粘合剂的粘合片; 以及使用它们的电子部件和散热构件的固定方法。通过使用粘合剂材料，电子部件和散热构件可以通过粘合而容易地固定，而不需要大量的时间和大量的劳动，即使在经受快速加热的热循环时也不会发生剥离和劣化并快速冷却。

8. 发明授权

US06228965B1 Thermally conductive pressure-sensitive adhesive and adhesive sheet containing the same 有权
标题翻译：导热压敏粘合剂和含有它的粘合片
公开(公告)号：US06228965B1
公开(公告)日：2001-05-08
申请号：US09319105
申请日：1999-06-01
申请人： Shigeki Muta , Masahiro Ohura , Takao Yoshikawa
发明人： Shigeki Muta , Masahiro Ohura , Takao Yoshikawa
IPC分类号： C08F22010
CPC分类号： C09J9/00 , C08L33/06 , C08L2666/54 , C09J7/22 , C09J7/38 , C09J133/06 , C09J2201/122 , C09J2201/128 , C09J2201/606 , Y10T428/31692 , Y10T428/31721 , Y10T428/31743 , Y10T428/3175 , Y10T428/31797
摘要： An adhesive sheet (2) in which heat-conductive and pressure-sensitive adhesive layers (22, 23) which comprise a) a copolymer of a monomer mixture containing main monomers comprising as main component an alkyl (meth)acrylate carrying an alkyl group having from 2 to 14 carbon atoms on average and from 1 to 30% by weight, based on the above main monomers, of a polar monomer having a glass transition point, as a homo-polymer, of ° C. or lower; and b) from 10 to 300 parts by weight, per 100 parts by weight of the copolymer, of a heat-conductive filler are formed on both surfaces of a heat-conductive base material (21) is inserted between an electronic part (1) and a heat-radiating member (3) to thereby adhere and fix the heat-radiating member (3) to the electronic part (1) while providing a high heat-conductivity with the heat-conductive and pressure-sensitive adhesive layers (22, 23).
摘要翻译：一种粘合片（2），其中导热和压敏粘合剂层（22,23）包括a）含有主要单体的单体混合物的共聚物，所述单体混合物含有作为主要组分的带有烷基的（甲基）丙烯酸烷基酯，平均为2至14个碳原子，1至30重量％，基于上述主要单体，具有℃或更低的均聚物的具有玻璃化转变点的极性单体; 和b）在导电性基材（21）的两面上形成有10〜300重量份/ 100重量份的共聚物，导电性填料形成在电子部件（1）和散热构件（3），从而将散热构件（3）粘附并固定到电子部件（1）上，同时向导电和压敏粘合剂层（22,22）提供高的导热性， 23）。

9. 发明授权

US06123799A Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same 失效
标题翻译：导热性粘合剂，含有该粘合片的粘合片，以及将电子部件固定于散热部件的方法
公开(公告)号：US06123799A
公开(公告)日：2000-09-26
申请号：US319229
申请日：1999-06-03
申请人： Masahiro Ohura , Shigeki Muta , Takao Yoshikawa
发明人： Masahiro Ohura , Shigeki Muta , Takao Yoshikawa
IPC分类号： C09J7/00 , C09J7/02 , C09J9/00 , C09J133/06 , H01L21/58 , H05K3/32 , H01L23/02 , B65C9/20
CPC分类号： H01L24/28 , C09J133/06 , C09J133/062 , C09J7/0217 , C09J7/0246 , C09J7/026 , C09J9/00 , H01L24/83 , C09J2201/122 , C09J2201/606 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/0665 , H01L2924/07802 , H01L2924/14
摘要： In order to provide a heat-conductive pressure-sensitive adhesive which is excellent in heat conductivity and adhesive property, in particular, shows a large adhesive force in a high temperature (heat resisting shear retention force), does not show an extreme viscosity increase during or after the preparation thereof, and is excellent in the stability, the present invention provides a heat-conductive pressure-sensitive adhesive comprising a) 100 parts by weight of a copolymer of a monomer mixture comprising from 70 to 99% by weight of a monomer made up of a (meth) acrylic acid alkyl ester having an alkyl group having from 2 to 14 carbon atoms on an average as the main constituent and from 30 to 1% by weight of a copolymerizable monomer having an acidic or basic polar group in the molecule and b) from 10 to 300 parts by weight of a heat-conductive filler having the same polarity as the polar group of the above-described copolymerizable monomer and having a purity of at least 95% by weight, an adhesive sheet comprising the layer of the heat-conductive pressure-sensitive adhesive on a substrate, and a method of fixing by adhesion an electronic part and a heat-radiating member which comprises fixing by adhering an electronic part and a heat-radiating member by the use of the heat-conductive pressure-sensitive adhesive or the adhesive sheet.
摘要翻译： PCT No.PCT / JP97 / 04320 Sec。 371日期1999年6月3日 102（e）日期1999年6月3日PCT 1997年11月26日PCT公布。公开号WO98 / 24860 日期1998年6月11日为了提供导热性和粘合性优异的导热性粘合剂，特别是在高温下显示出大的粘合力（耐热剪切保持力），不显示在制备期间或之后极端粘度增加，并且稳定性优异，本发明提供一种导热压敏粘合剂，其包含：a）100重量份的单体混合物的共聚物，其包含70至99重量％的由具有平均为2〜14个碳原子的烷基的（甲基）丙烯酸烷基酯作为主要成分的单体和30〜1重量％的具有酸性或碱性极性基团，b）10〜300重量份具有与上述可共聚单体的极性基团相同极性的导电填料，其纯度为至少95重量％的粘合片，包括在基底上的导热压敏粘合剂层的粘合片，以及通过粘合固定电子部件和散热构件的方法，所述电子部件和散热构件包括通过粘附电子部件和通过使用导热压敏粘合剂或粘合片的散热构件。

10. 发明授权

US07119437B2 Electronic substrate, power module and motor driver 有权
标题翻译：电子基板，电源模块和电机驱动器
公开(公告)号：US07119437B2
公开(公告)日：2006-10-10
申请号：US10737122
申请日：2003-12-17
申请人： Koji Morita , Takao Yoshikawa , Takayuki Murai
发明人： Koji Morita , Takao Yoshikawa , Takayuki Murai
IPC分类号： H01L23/34
CPC分类号： H01L25/072 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/48699 , H01L2224/48747 , H01L2224/49 , H01L2224/73265 , H01L2224/85447 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1306 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon.
摘要翻译：电子基板用于在其上安装多个半导体芯片。衬底包括第一导电构件，第二导电构件和绝缘层。第一导电构件电连接到半导体芯片之一。第二导电构件电连接到另一个半导体芯片。绝缘层被布置成将第二导电构件与第一导电构件电隔离。第一导电构件是在其上支撑绝缘层，半导体芯片和第二导电构件的导电基底。

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