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    • 7. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US08063488B2
    • 2011-11-22
    • US12382992
    • 2009-03-27
    • Yoshio ItohYoshimasa KushimaHirokazu Uchida
    • Yoshio ItohYoshimasa KushimaHirokazu Uchida
    • H01L23/498H01L23/28
    • H01L24/11H01L21/561H01L23/3114H01L23/3135H01L24/12H01L2224/05001H01L2224/05008H01L2224/05022H01L2224/05024H01L2224/274H01L2924/01078H01L2924/10157H01L2924/14H01L2924/181H01L2924/00
    • The semiconductor device comprises a first area and a second area positioned adjacent to the outside of the first area, the semiconductor substrate having a main surface and side surfaces and disposed in such a manner that the main surface is positioned in the first area and each of the side surfaces is positioned at a boundary between the first area and the second area, a plurality of pads formed over the main surface of the semiconductor substrate and a plurality of external connecting terminals formed thereon, which are respectively electrically connected to the pads, a first resin portion which is formed over the main surface of the semiconductor substrate so as to cover the pads and has a main surface and side surfaces, and which is formed in such a manner that the external connecting terminals are exposed from the main surface and each of the side surfaces is positioned at the boundary, and a second resin portion which is positioned in the second area and formed so as to cover the side surfaces of the semiconductor substrate and the side surfaces of the first resin portion and which is different in composition from the first resin portion.
    • 半导体器件包括与第一区域的外部相邻定位的第一区域和第二区域,半导体衬底具有主表面和侧表面,并且以这样的方式设置,使得主表面位于第一区域中,并且每个 侧表面位于第一区域和第二区域之间的边界处,形成在半导体衬底的主表面上的多个焊盘和形成在其上的多个外部连接端子,其分别电连接到焊盘, 第一树脂部分,其形成在半导体衬底的主表面上以覆盖焊盘并且具有主表面和侧表面,并且形成为使得外部连接端子从主表面暴露并且每个 所述侧表面位于所述边界处,并且所述第二树脂部分位于所述第二区域中并形成为覆盖所述第二区域 所述半导体衬底的侧表面和所述第一树脂部分的侧表面与所述第一树脂部分的组成不同。
    • 9. 发明申请
    • DOPPLER FREQUENCY ESTIMATING DEVICE, RECEIVING DEVICE, RECORDING MEDIUM AND DOPPLER FREQUENCY ESTIMATING METHOD
    • 多普勒频率估计装置,接收装置,记录介质和多普勒频率估计方法
    • US20100128823A1
    • 2010-05-27
    • US12622259
    • 2009-11-19
    • Naoto SasaokaYoshio Itoh
    • Naoto SasaokaYoshio Itoh
    • H04L27/06
    • H04L27/2657H04B7/01H04L27/2672H04L27/2679H04L27/2695
    • A device of an example of the invention comprises a first section which performs IFFT for a channel estimation value obtained by channel estimation to obtain a channel impulse response, a second section which selects paths that belong to a group having a large element based on elements of paths for the channel impulse response, a third section which calculates autocorrelation values by time averaging for each of the paths selected by the second section, a fourth section which obtains an ensemble average value of the autocorrelation values by time averaging obtained by the third section, and a fifth section which obtains a Doppler frequency associated with the ensemble average value based on a characteristic of a relationship between an autocorrelation value and an Doppler frequency and the ensemble average value.
    • 本发明实施例的装置包括对通过信道估计获得的信道估计值执行IFFT以获得信道脉冲响应的第一部分,第二部分,其基于元素的元素选择属于具有大元素的组的路径 用于信道脉冲响应的路径,第三部分,其通过对由第二部分选择的每个路径进行时间平均来计算自相关值;第四部分,通过由第三部分获得的时间平均获得自相关值的整体平均值; 以及第五部分,其基于自相关值和多普勒频率与总体平均值之间的关系的特性来获得与所述整体平均值相关联的多普勒频率。
    • 10. 发明授权
    • Method of making a semiconductor device
    • 制造半导体器件的方法
    • US06489234B1
    • 2002-12-03
    • US09664764
    • 2000-09-19
    • Yoshio Itoh
    • Yoshio Itoh
    • H01L21306
    • H01L21/31144
    • A method of making a semiconductor device includes the steps of etching, with a resist pattern (3) used as a mask, a contact pattern (4) in at least one interlayer insulation film (2) made on a silicon substrate (1); forming on the contact pattern an insulation film (5) containing silicon as a main component; and oxidizing by heat treatment the insulation film to provide an oxide film (6) including a side wall oxide film on an inside wall of the contact pattern.
    • 制造半导体器件的方法包括以下步骤:利用用作掩模的抗蚀剂图案(3),在至少一个在硅衬底(1)上形成的层间绝缘膜(2)中的接触图案(4)进行蚀刻; 在所述接触图形上形成以硅为主要成分的绝缘膜(5); 并通过热处理绝缘膜进行氧化,以在接触图案的内壁上提供包括侧壁氧化膜的氧化物膜(6)。