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1. 发明申请

US20070092646A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20070092646A1
公开(公告)日：2007-04-26
申请号：US11614310
申请日：2006-12-21
申请人： Hiroyuki SHINOZAKI , Yasushi KOJIMA , Shunichi AIYOSHIZAWA , Kiwamu TSUKAMOTO
发明人： Hiroyuki SHINOZAKI , Yasushi KOJIMA , Shunichi AIYOSHIZAWA , Kiwamu TSUKAMOTO
IPC分类号： C23C16/00
CPC分类号： G03F7/7075 , G03F7/70808 , G03F7/70991 , G03F9/7003 , G03F9/7011 , H01L21/67017 , H01L21/67225 , H01L21/67248 , H01L21/67748 , H01L21/68 , H01L21/681
摘要： A substrate treatment apparatus that treats a substrate under treatment has an interface section, a substrate loading/unloading section, a reduced pressure atmosphere conveyance chamber, and an exposure treatment chamber. The interface section has a conveyance mechanism that can freely load and unload the substrate under treatment from another device into the apparatus or vice versa. The substrate under treatment can be loaded and unloaded into and from the substrate loading/unloading section in one direction by the conveyance mechanism of the interface section. The reduced pressure atmosphere conveyance chamber is disposed adjacent to and perpendicular to the direction of the substrate loading/unloading section and has a conveyance mechanism that conveys the substrate under treatment under a reduced pressure atmosphere. The exposure treatment chamber is disposed adjacent to and in parallel with the direction of the reduced pressure atmosphere conveyance chamber and performs an exposure treatment for the substrate under treatment.
摘要翻译：处理基板的基板处理装置具有界面部，基板装载部，减压气体输送室，曝光处理室。接口部分具有能够将处理中的基板自由地装载和卸载到设备中的输送机构，反之亦然。处理后的基板可以通过界面部分的输送机构沿一个方向装载和卸载基板装载/卸载部分。减压气氛输送室与基板装载/卸载部的方向相邻且垂直的方向配置，具有在减压气氛下处理基板的输送机构。暴露处理室与减压气体输送室的方向相邻且平行地配置，对被处理基板进行曝光处理。

2. 发明申请

US20120309267A1 METHOD AND APPARATUS FOR MONITORING A POLISHING SURFACE OF A POLISHING PAD USED IN POLISHING APPARATUS 有权
标题翻译：用于监测抛光装置中使用的抛光垫的抛光表面的方法和装置
公开(公告)号：US20120309267A1
公开(公告)日：2012-12-06
申请号：US13479575
申请日：2012-05-24
申请人： Hiroyuki SHINOZAKI , Takahiro SHIMANO , Akira IMAMURA , Akira NAKAMURA
发明人： Hiroyuki SHINOZAKI , Takahiro SHIMANO , Akira IMAMURA , Akira NAKAMURA
IPC分类号： B24B1/00 , B24B53/02 , B24B49/00
CPC分类号： B24B37/005 , B24B37/042 , B24B49/02 , B24B49/04 , B24B49/18 , B24B49/186 , B24B53/005 , B24B53/017 , B24B53/08
摘要： The present invention provides a method capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface.
摘要翻译：本发明提供一种能够在不从研磨台移除抛光垫的情况下监测抛光垫的抛光表面的方法。该方法包括：通过使旋转的修整器在抛光表面上振荡来调节抛光垫的抛光表面; 当执行抛光表面的调理时，测量抛光表面的高度; 计算在所述抛光表面上限定的二维表面上的所述高度的测量点的位置; 并且重复测量抛光表面的高度和计算测量点的位置以在抛光表面中产生高度分布。

3. 发明申请

US20070107656A1 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD 审中-公开
公开(公告)号：US20070107656A1
公开(公告)日：2007-05-17
申请号：US11615621
申请日：2006-12-22
申请人： Hiroyuki SHINOZAKI , Norihiro Yamaguchi , Katsuhide Watanabe
发明人： Hiroyuki SHINOZAKI , Norihiro Yamaguchi , Katsuhide Watanabe
IPC分类号： C23C14/00 , B05C11/00
CPC分类号： H01L21/6831 , H01L21/67259
摘要： A substrate treatment apparatus is disclosed. The substrate treatment apparatus has an electrostatic chuck mechanism, a grounding mechanism, and an electron beam radiating mechanism. The electrostatic chuck mechanism electrostatically sucks and holds a substrate under treatment. The grounding mechanism freely contacts a predetermined film of a plurality of films formed on a treatment surface of the substrate under treatment sucked and held by the electrostatic chuck mechanism. The electron beam radiating mechanism radiates a resist film formed on the treatment surface side of the substrate under treatment with an electron beam.

4. 发明申请

US20100311309A1 DRESSING APPARATUS, DRESSING METHOD, AND POLISHING APPARATUS 有权
标题翻译：连接装置，连接方法和抛光装置
公开(公告)号：US20100311309A1
公开(公告)日：2010-12-09
申请号：US12791979
申请日：2010-06-02
申请人： Hiroyuki SHINOZAKI
发明人： Hiroyuki SHINOZAKI
IPC分类号： B24B49/00 , B24B55/00 , B24B5/00 , B24B1/00
CPC分类号： B24B53/017 , B24B49/08 , B24B49/16
摘要： A dressing apparatus for use in a polishing apparatus for polishing a substrate to planarize a surface of the substrate is disclosed. The dressing apparatus includes a dresser disk, a dresser drive shaft coupled to the dresser disk, a pneumatic cylinder configured to press the dresser disk against the polishing pad through the dresser drive shaft, a pressure-measuring device configured to measure pressure of the gas supplied to the pneumatic cylinder, a load-measuring device configured to measure a load acting on the dresser drive shaft, and a pressure controller configured to control the pressure of the gas supplied to the pneumatic cylinder. The pressure controller is configured to establish a relationship between the pressure of the gas and a pressing force of the dresser disk against the polishing pad, based on measurement values of the pressure-measuring device and the load-measuring device.
摘要翻译：公开了一种用于抛光衬底以平面化衬底表面的抛光设备中的敷料装置。修整装置包括修整器盘，联接到修整器盘的修整器驱动轴，气动缸，构造成通过修整器驱动轴将修整器盘压靠在抛光垫上;压力测量装置，被配置为测量供应的气体的压力一个负载测量装置，被配置为测量作用在修整器驱动轴上的负载;以及压力控制器，被配置为控制供应到气缸的气体的压力。压力控制器被配置为基于压力测量装置和负载测量装置的测量值来建立气体的压力和修整器盘对抛光垫的按压力之间的关系。

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