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    • 1. 发明申请
    • REACTOR
    • 反应堆
    • US20120105190A1
    • 2012-05-03
    • US13381679
    • 2010-07-16
    • Hiroyuki MitaniKyoji ZaitsuKenichi InoueOsamu OzakiHiroshi HashimotoHirofumi HojoKoji InoueEiichiro YoshikawaNaoya Fujiwara
    • Hiroyuki MitaniKyoji ZaitsuKenichi InoueOsamu OzakiHiroshi HashimotoHirofumi HojoKoji InoueEiichiro YoshikawaNaoya Fujiwara
    • H01F27/00
    • H01F37/00H01F3/14H01F27/2847
    • Provided is a reactor that enables high inductance to be generated with stability in a wide current range, while minimizing noise, processing cost, and eddy-current loss. The reactor (D1) has the ratio (t/W) of the width (W) to the thickness (t) of a conductive member that composes an air-core coil configured to be 1 or less, and preferably, 1/10 or less. Furthermore, the reactor also has the absolute value of a value ((L1−L2)/L3) that has had: the difference (L1−L2) between; the space interval (L1) between an inner wall face of a first core member (3) and an inner wall face of a second core member (4), at the innermost circumference position of the air-core coil (1); and the space (L2) between the inner wall face of the first core member (3) and the inner wall face of the second core member (4), at the outermost circumference position of the air-core coil (1); divided by an average value (L3); configured to be 1/50 or less. The ratio (R/W) of the radius (R), from the axis-center (O) of the air-core coil (1) to the outer circumference of the air-core coil (1), to the width (W) of the air-core coil (1) (conductive member), is 2=R/W=4.
    • 提供了一种能够在宽电流范围内稳定地产生高电感的电抗器,同时最小化噪声,处理成本和涡流损耗。 反应器(D1)的宽度(W)与构成为1以下的空芯线圈的导电部件的厚度(t)的比率(t / W)优选为1/10, 减。 此外,反应器也具有以下的值((L1-L2)/ L3)的绝对值:其之间的差(L1-L2) 在空心线圈(1)的最内圆周位置处的第一芯构件(3)的内壁面与第二芯构件(4)的内壁面之间的空间间隔(L1); 和空心线圈(1)的最外圆周位置处的第一芯构件(3)的内壁面与第二芯构件(4)的内壁面之间的空间(L2)。 除以平均值(L3); 配置为1/50以下。 从空心线圈(1)的轴心(O)到空心线圈(1)的外周的半径(R)的比(R / W),宽度(W 空气芯线圈(1)(导电部件))为2 = R / W = 4。
    • 2. 发明授权
    • Reactor
    • 反应堆
    • US08614617B2
    • 2013-12-24
    • US13381679
    • 2010-07-16
    • Hiroyuki MitaniKyoji ZaitsuKenichi InoueOsamu OzakiHiroshi HashimotoHirofumi HojoKoji InoueEiichiro YoshikawaNaoya Fujiwara
    • Hiroyuki MitaniKyoji ZaitsuKenichi InoueOsamu OzakiHiroshi HashimotoHirofumi HojoKoji InoueEiichiro YoshikawaNaoya Fujiwara
    • H01F17/04H01F27/24
    • H01F37/00H01F3/14H01F27/2847
    • Provided is a reactor that enables high inductance to be generated with stability in a wide current range, while minimizing noise, processing cost, and eddy-current loss. The reactor (D1) has the ratio (t/W) of the width (W) to the thickness (t) of a conductive member that composes an air-core coil configured to be 1 or less, and preferably, 1/10 or less. Furthermore, the reactor also has the absolute value of a value ((L1−L2)/L3) that has had: the difference (L1−L2) between; the space interval (L1) between an inner wall face of a first core member (3) and an inner wall face of a second core member (4), at the innermost circumference position of the air-core coil (1); and the space (L2) between the inner wall face of the first core member (3) and the inner wall face of the second core member (4), at the outermost circumference position of the air-core coil (1); divided by an average value (L3); configured to be 1/50 or less. The ratio (R/W) of the radius (R), from the axis-center (O) of the air-core coil (1) to the outer circumference of the air-core coil (1), to the width (W) of the air-core coil (1) (conductive member), is 2=R/W=4.
    • 提供了一种能够在宽电流范围内稳定地产生高电感的电抗器,同时最小化噪声,处理成本和涡流损耗。 反应器(D1)的宽度(W)与构成为1以下的空芯线圈的导电部件的厚度(t)的比(t / W)优选为1/10, 减。 此外,反应器也具有以下的值((L1-L2)/ L3)的绝对值:其之间的差(L1-L2) 在空心线圈(1)的最内圆周位置处的第一芯构件(3)的内壁面与第二芯构件(4)的内壁面之间的空间间隔(L1); 和空心线圈(1)的最外圆周位置处的第一芯构件(3)的内壁面与第二芯构件(4)的内壁面之间的空间(L2)。 除以平均值(L3); 配置为1/50以下。 从空心线圈(1)的轴心(O)到空心线圈(1)的外周的半径(R)的比(R / W),宽度(W 空气芯线圈(1)(导电部件))为2 = R / W = 4。
    • 5. 发明授权
    • Resin-coated metal plate for use in perforating printed-wiring board
    • 用于穿孔印刷电路板的树脂涂层金属板
    • US07914898B2
    • 2011-03-29
    • US11003498
    • 2004-12-06
    • Eiichiro YoshikawaNaoya FujiwaraYasuhiro Okamura
    • Eiichiro YoshikawaNaoya FujiwaraYasuhiro Okamura
    • B32B15/04B32B27/00H05K3/10
    • H05K3/0047H05K2201/0129H05K2203/0152H05K2203/0156H05K2203/0214Y10T29/49155Y10T29/49156Y10T428/31678Y10T428/31692
    • The present invention provides a resin-coated metal plate suitable as a cover plate for use in perforating a printed-wiring board with a drill, capable of effectively preventing the heat generation of drill bits and the scattering of chips while sufficiently performing lubrication and discharging the chips, to highly efficiently form a high-quality perforated-hole with excellent smoothness of the inner wall thereof while reducing the risk of breakage of the drill and eliminating any surface tackiness to achieve excellent operating performance and storage stability. The resin-coated metal plate of the present invention comprising a metal base plate, and a film made of a thermoplastic resin and formed on at least one of the opposite surfaces of said metal base plate to cover thereover, said thermoplastic resin being substantially water-insoluble, wherein said thermoplastic resin has: a melting peak temperature measured according to JIS K7121 ranging from 60° C. to 120° C.; a melt viscosity ranging from 1×103 P to 1×104 P under a shear rate of 200 mm/sec, and from 5×102 P to 5×103 P under a shear rate of 3000 mm/sec, in the state when said thermoplastic resin is molten at 150° C.; and a durometer D hardness measured according to JIS K7215 ranging from 20 to 45.
    • 本发明提供一种适合作为覆盖板的树脂涂覆金属板,其用于对具有钻头的印刷电路板进行穿孔,能够有效地防止钻头的发热和芯片的飞散,同时充分地进行润滑和排出 高效地形成具有优异的内壁平滑度的高品质穿孔,同时降低钻头断裂的风险,消除任何表面粘性,达到优异的操作性能和储存稳定性。 本发明的树脂被覆金属板包括金属基板和由热塑性树脂制成的膜,并形成在所述金属基板的至少一个相对表面上以覆盖其上,所述热塑性树脂基本上是水溶性的, 其中所述热塑性树脂具有:根据JIS K7121测量的熔融峰值温度为60℃至120℃; 在剪切速率为200mm / sec的范围内为1×103P〜1×104P的熔体粘度,在3000mm / sec的剪切速度下为5×102P〜5×103P, 热塑性树脂在150℃下熔融。 根据JIS K7215测定的硬度D硬度为20〜45。
    • 6. 发明申请
    • Resin-coated metal plate for use in perforating printed-wiring board
    • 用于穿孔印刷电路板的树脂涂层金属板
    • US20050145123A1
    • 2005-07-07
    • US11003498
    • 2004-12-06
    • Eiichiro YoshikawaNaoya FujiwaraYasuhiro Okamura
    • Eiichiro YoshikawaNaoya FujiwaraYasuhiro Okamura
    • B23B45/14B23B49/00B32B15/08H05K3/00B41L13/00B05C17/06
    • H05K3/0047H05K2201/0129H05K2203/0152H05K2203/0156H05K2203/0214Y10T29/49155Y10T29/49156Y10T428/31678Y10T428/31692
    • The present invention provides a resin-coated metal plate suitable as a cover plate for use in perforating a printed-wiring board with a drill, capable of effectively preventing the heat generation of drill bits and the scattering of chips while sufficiently performing lubrication and discharging the chips, to highly efficiently form a high-quality perforated-hole with excellent smoothness of the inner wall thereof while reducing the risk of breakage of the drill and eliminating any surface tackiness to achieve excellent operating performance and storage stability. The resin-coated metal plate of the present invention comprising a metal base plate, and a film made of a thermoplastic resin and formed on at least one of the opposite surfaces of said metal base plate to cover thereover, said thermoplastic resin being substantially water-insoluble, wherein said thermoplastic resin has: a melting peak temperature measured according to JIS K7121 ranging from 60° C. to 120° C.; a melt viscosity ranging from 1×103 P to 1×104 P under a shear rate of 200 mm/sec, and from 5×102 P to 5×103 P under a shear rate of 3000 mm/sec, in the state when said thermoplastic resin is molten at 150° C.; and a durometer D hardness measured according to JIS K7215 ranging from 20 to 45.
    • 本发明提供一种适合作为覆盖板的树脂涂覆金属板,其用于对具有钻头的印刷电路板进行穿孔,能够有效地防止钻头的发热和芯片的飞散,同时充分地进行润滑和排出 高效地形成具有优异的内壁平滑度的高品质穿孔,同时降低钻头断裂的风险,消除任何表面粘性,达到优异的操作性能和储存稳定性。 本发明的树脂被覆金属板包括金属基板和由热塑性树脂制成的膜,并形成在所述金属基板的至少一个相对表面上以覆盖其上,所述热塑性树脂基本上是水溶性的, 其中所述热塑性树脂具有:根据JIS K7121测量的熔融峰值温度为60℃至120℃; 在200mm / sec的剪切速率下,熔体粘度范围为1×10 3至1×10 4 P,和5×10 2 P至5×10 6 在所述热塑性树脂在150℃下熔融的状态下,在剪切速率为3000mm / sec的条件下进行。 根据JIS K7215测定的硬度D硬度为20〜45。
    • 8. 发明授权
    • Fiber optic rod and production thereof
    • 光纤棒及其生产
    • US5363468A
    • 1994-11-08
    • US142074
    • 1993-10-28
    • Eiichiro YoshikawaKoji YamamotoHiroshi KawashimaMika Anzai
    • Eiichiro YoshikawaKoji YamamotoHiroshi KawashimaMika Anzai
    • C03C25/10G02B6/16
    • G02B6/02033C03C25/10
    • Disclosed herein is a fiber optic rod having good mechanical properties (such as tensile strength and tensile modulus) and good water resistance and a process for producing the same. The fiber optic rod is formed by impregnating, followed by curing, a fibrous reinforcement with a resin composition composed of epoxy (meth)acrylate oligomer and xylene-formaldehyde resin, or epoxy (meth)acrylate oligomer and acid anhydride-modified epoxy (meth)acrylate (which is obtained by modifying epoxy (meth)acrylate oligomer with an organic acid intramolecular anhydride) as curable components and a reactive diluent of monofunctional and/or multifunctional (meth)acrylate and ultraviolet-sensitive polymerization initiator as essential components.
    • 本文公开了具有良好的机械性能(例如拉伸强度和拉伸模量)和良好的耐水性的纤维棒及其制造方法。 光纤棒通过用由环氧(甲基)丙烯酸酯低聚物和二甲苯 - 甲醛树脂或环氧(甲基)丙烯酸酯低聚物和酸酐改性的环氧(甲基)丙烯酸酯低聚物组成的树脂组合物浸渍,然后固化, 丙烯酸酯(其通过用有机酸分子内酸酐改性环氧(甲基)丙烯酸酯低聚物而获得)作为可固化组分和单官能和/或多官能(甲基)丙烯酸酯和紫外线敏感聚合引发剂的反应性稀释剂作为必需组分。