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    • 2. 发明申请
    • Nb3Sn superconducting wire, precursor or same, and method for producing precursor
    • Nb3Sn超导线,前驱体等,以及前体的制造方法
    • US20080287303A1
    • 2008-11-20
    • US12081475
    • 2008-04-16
    • Hiroyuki KatoTakashi HaseKyoji Zaitsu
    • Hiroyuki KatoTakashi HaseKyoji Zaitsu
    • H01B12/10H01L39/24H01B12/00
    • H01L39/2409H01L39/14Y10T29/49014
    • A precursor for producing a Nb3Sn superconducting wire includes a bundle of single-element wires each including a Cu or Cu-based alloy matrix, Nb or Nb-based alloy filaments, at least one Sn or Sn-based alloy core, the Nb or Nb-based alloy filaments and at least one Sn or Sn-based alloy core being arranged in the Cu or Cu-based alloy matrix, an diffusion barrier layer around the periphery of the Cu or Cu-based alloy matrix, the inner diffusion barrier layer being composed of Nb or a Nb-based alloy, and a Cu or Cu-based alloy layer around the periphery of the diffusion barrier layer; an outer diffusion barrier layer around the periphery of the bundle of the single-element wires, the outer diffusion barrier layer being composed of Nb, a Nb-based alloy, Ta, a Ta-based alloy, or a combination thereof; and a stabilizing copper layer around the periphery of the outer diffusion barrier layer.
    • 用于制造Nb 3 Sn超导线的前体包括:包含Cu或Cu基合金基体,Nb或Nb基合金细丝,至少一种Sn或Sn的单元线束 基于Nb或Nb的合金芯,并且在Cu或Cu基合金基体中布置有至少一种Sn或Sn基合金芯,围绕Cu或Cu基合金芯的周围的扩散阻挡层 合金基体,内扩散阻挡层由Nb或Nb基合金构成,以及在扩散阻挡层周围的Cu或Cu基合金层; 所述外部扩散阻挡层围绕所述单个元件线束的周围,所述外部扩散阻挡层由Nb,Nb基合金,Ta,Ta基合金或其组合构成; 以及围绕外部扩散阻挡层的周边的稳定的铜层。
    • 6. 发明申请
    • SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREFOR
    • 半导体器件及其制造工艺
    • US20090267158A1
    • 2009-10-29
    • US12094755
    • 2006-11-21
    • Takashi Hase
    • Takashi Hase
    • H01L27/092H01L21/8238
    • H01L21/823842H01L21/28097H01L21/823871H01L29/4975H01L29/66545
    • There is provided a semiconductor device in which deviation in a work function is prevented by a gate electrode having a uniform composition and which has excellent operation properties by effectively controlling a Vth. The semiconductor device comprises an NMOS transistor and a PMOS transistor with a common line electrode, characterized in that the line electrode comprise an electrode section (A), an electrode section (B) and a diffusion barrier region formed in a part over an isolation region so that the electrode sections (A) and (B) are kept out of contact and the diffusion barrier region meets at least one of the following conditions (1) and (2). (1) The diffusion coefficient D1 in the above diffusion barrier region of the constituent element A′ of the above electrode section (A) is lower than the interdiffusion coefficient D2 of the constituent element A′ between electrode section (A) materials. (2) The diffusion coefficient D3 in the above diffusion barrier region of the constituent element B′ of the above electrode section (B) is lower than the interdiffusion coefficient D4 of the constituent element B′ between electrode section (B) materials.
    • 提供了一种半导体器件,通过有效地控制Vth,通过具有均匀组成的栅电极防止功函中的偏差,并且具有优异的操作特性。 半导体器件包括NMOS晶体管和具有公共线电极的PMOS晶体管,其特征在于,线电极包括电极部分(A),电极部分(B)和形成在隔离区域上的部分中的扩散阻挡区域 使得电极部分(A)和(B)保持不接触,并且扩散阻挡区域满足以下条件(1)和(2)中的至少一个。 (1)上述电极部(A)的构成元素A'的扩散阻挡区域的扩散系数D1低于电极部(A)材料之间的构成元素A'的相互扩散系数D2。 (2)上述电极部(B)的构成元件B'的扩散阻挡区域的扩散系数D3低于电极部(B)材料之间的构成元件B'的相互扩散系数D4。
    • 8. 发明授权
    • Method of producing a bismuth layer structured ferroelectric thin film
    • 生产铋层结构铁电薄膜的方法
    • US06194227B1
    • 2001-02-27
    • US09174393
    • 1998-10-14
    • Takashi Hase
    • Takashi Hase
    • H01L2100
    • H01L21/31691H01L28/56
    • The surface of a Si substrate is coated with a lower electrode of precious metal (Pt), then a buffer layer comprising an oxide thin film containing Bi is deposited. On the surface of the buffer layer, a thin film of a Bi layer structured ferroelectric substance is formed. Thus, reaction of the Bi layer structured ferroelectric substance with the precious metal coating the Si substrate is avoided during crystallization carried out at a low temperature. Therefore, deviation in composition of the thin film thus formed is suppressed to provide the thin film with a high density. When the thickness of the buffer layer is not greater than five percent of that of the Bi layer structured ferroelectric thin film, electrical characteristics of a capacitor are not deteriorated. When electrical connection is conducted by polycrystalline Si, production of oxide can be avoided by deposition at 650° C.
    • Si衬底的表面涂覆有贵金属(Pt)的下电极,然后沉积包含含有Bi的氧化物薄膜的缓冲层。 在缓冲层的表面形成有Bi层结构的铁电体的薄膜。 因此,在低温下进行结晶时避免了Bi层结构的铁电体与覆盖Si衬底的贵金属的反应。 因此,抑制如此形成的薄膜的组成偏差,从而提供高密度的薄膜。 当缓冲层的厚度不大于Bi层结构的铁电薄膜的厚度的5%时,电容器的电特性不会劣化。 当通过多晶硅进行电连接时,可以通过在650℃下沉积来避免生成氧化物。