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1. 发明授权

US5304819A Light-activated semiconductor device having light-emitting elements, light-receiving elements and output elements 失效
标题翻译：具有发光元件，光接收元件和输出元件的光激活半导体器件
公开(公告)号：US5304819A
公开(公告)日：1994-04-19
申请号：US81124
申请日：1993-06-25
申请人： Hiroyasu Torazawa , Kenji Mizuuchi , Kazuo Hagimura
发明人： Hiroyasu Torazawa , Kenji Mizuuchi , Kazuo Hagimura
IPC分类号： H01L31/12 , H01L31/167 , H01L31/16
CPC分类号： H01L31/167 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/13091
摘要： The present invention relates to a light-activated semiconductor device comprising light-emitting elements for emitting light respectively, light-receiving elements for producing driving voltages in response to the light respectively and output elements activated in response to the driving voltages respectively. The light-receiving elements are disposed on two planes opposed to each other. The output elements are disposed on their corresponding planes in opposing relationship.
摘要翻译：本发明涉及分别用于发光的发光元件的光激活半导体器件，分别响应于该光产生驱动电压的光接收元件和分别响应于驱动电压而激活的输出元件。光接收元件设置在彼此相对的两个平面上。输出元件以相对的关系设置在它们对应的平面上。

2. 发明授权

US6037187A Method of manufacturing photosensitive semiconductor device 失效
标题翻译：光敏半导体器件的制造方法
公开(公告)号：US6037187A
公开(公告)日：2000-03-14
申请号：US296380
申请日：1999-04-23
申请人： Kenji Mizuuchi
发明人： Kenji Mizuuchi
IPC分类号： H01L23/02 , H01L23/04 , H01L31/0203 , H01L31/0232 , H01L31/12 , H01L31/167 , H01L21/00
CPC分类号： H01L31/0232 , H01L31/0203 , H01L31/167 , H01L2224/48091 , H01L2224/48247
摘要： In order to prevent deterioration of adhesion between a molding resin and a lead frame and a light transmission characteristic due to the attachment of a translucent resin to an upper surface of the lead frame upon charging a photocoupler with the translucent resin, a concave portion is provided in an island of a lead frame to which the smallest semiconductor device is attached. The filling of the translucent resin between opposed semiconductor devices includes filling through the concave portion. The provision of the concave portion prevents the translucent resin from contacting the upper surface, resulting in a more stable configuration.
摘要翻译：为了防止模塑树脂和引线框架之间的粘附性的劣化以及由于在将半透明树脂充电到光电耦合器时将半透明树脂附着到引线框架的上表面上的透光特性，在最小的半导体器件附着的引线框的岛中。半透明树脂在相对的半导体器件之间的填充包括通过凹部填充。设置凹部防止半透明树脂与上表面接触，形成更稳定的结构。

3. 发明授权

US06194238B1 Method of manufacturing photosensitive semiconductor device 失效
标题翻译：光敏半导体器件的制造方法
公开(公告)号：US06194238B1
公开(公告)日：2001-02-27
申请号：US09489013
申请日：2000-01-21
申请人： Kenji Mizuuchi
发明人： Kenji Mizuuchi
IPC分类号： H01L2100
CPC分类号： H01L31/167 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： In order to prevent deterioration of adhesion between a molding resin and a lead frame and a light transmission characteristic due to the attachment of a translucent resin to an upper surface of the lead frame upon charging a photocoupler with the translucent resin, a concave portion is provided in an island of a lead frame to which the smallest semiconductor device is attached. The filling of the translucent resin between opposed semiconductor devices includes filling through the concave portion. The provision of the concave portion prevents the translucent resin from contacting the upper surface, resulting in a more stable configuration.
摘要翻译：为了防止模塑树脂和引线框架之间的粘附性的劣化以及由于在将半透明树脂充电到光电耦合器时将半透明树脂附着到引线框架的上表面上的透光特性，在最小的半导体器件附着的引线框的岛中。半透明树脂在相对的半导体器件之间的填充包括通过凹部填充。设置凹部防止半透明树脂与上表面接触，形成更稳定的结构。

4. 发明授权

US06080999A Photosensitive semiconductor device 失效
标题翻译：感光半导体器件
公开(公告)号：US06080999A
公开(公告)日：2000-06-27
申请号：US64039
申请日：1998-04-22
申请人： Kenji Mizuuchi
发明人： Kenji Mizuuchi
IPC分类号： H01L23/02 , H01L23/04 , H01L31/0203 , H01L31/0232 , H01L31/12 , H01L31/167 , H01L27/15
CPC分类号： H01L31/0232 , H01L31/0203 , H01L31/167 , H01L2224/48091 , H01L2224/48247
摘要： An object of the present invention is to prevent deterioration of adhesion between a molding resin and lead frame and a light transmission characteristic due to the attachment of a translucent resin to an upper surface of the lead frame upon charging a photocoupler with the translucent resin.A concave portion is defined in an island of a lead frame to which a photosensitive semiconductor device is fixed.
摘要翻译：本发明的目的是防止在将光电耦合器与半透明树脂充电时，由于将半透明树脂附着到引线框架的上表面，防止模制树脂和引线框架之间的粘附性劣化和透光特性。在引导框架的岛上限定凹部，光敏半导体器件固定到该引线框架。

5. 发明授权

US06201263B1 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US06201263B1
公开(公告)日：2001-03-13
申请号：US09213421
申请日：1998-12-17
申请人： Kenji Mizuuchi
发明人： Kenji Mizuuchi
IPC分类号： H01L3112
CPC分类号： H01L31/167 , H01L2224/48091 , H01L2224/48137 , H01L2224/49113 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： First and second MOS transistor elements, each having two source pads respectively arranged in the vicinity of two opposite corners and a gate pad arranged in the vicinity of a corner between these two corners, and a light receiving element arranged on a second terminal. In this way, wires respectively connecting gate pads of the first and second MOS transistor elements and the light receiving element are shortened. A source pad of the first MOS transistor element adjacent to the second terminal and the second terminal can be connected by a wire, so this wire can be shortened. A source pad of the second MOS transistor element adjacent to the second terminal and the second terminal can be connected by a wire, so this wire also can be shortened.
摘要翻译：第一和第二MOS晶体管元件，每个具有分别布置在两个相对角附近的两个源极焊盘和布置在这两个拐角之间的拐角附近的栅极焊盘以及布置在第二端子上的光接收元件。以这种方式，分别连接第一和第二MOS晶体管元件的栅极焊盘和光接收元件的导线被缩短。与第二端子和第二端子相邻的第一MOS晶体管元件的源极焊盘可以通过导线连接，从而可以缩短该导线。与第二端子和第二端子相邻的第二MOS晶体管元件的源极焊盘可以通过导线连接，因此也可以缩短该导线。

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