会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 8. 发明授权
    • Method and apparatus for charging a valve-regulated lead acid battery
    • 用于对阀控铅酸蓄电池充电的方法和装置
    • US06211651B1
    • 2001-04-03
    • US09526062
    • 2000-03-15
    • Seiji Nemoto
    • Seiji Nemoto
    • H02J700
    • H02J7/0091
    • A charging method and a charging apparatus which can be used particularly for charging a valve-regulated lead acid battery using a Pb-Sb alloy grid as a positive electrode grid. Primary constant-current charging is performed with a predetermined current value. The primary constant-current charging is further continued for an extension time ta after the battery voltage reaches a change-over voltage Vc. After the extension time has passed, the charging is changed over to secondary constant-current charging using a current value smaller than that of the primary constant-current charging. The extension time for continuing the primary constant-current charging is preferably set so as to be shorter as the battery temperature is higher. Also a secondary charging time for executing the secondary constant-current charging is preferably set so as to be shorter as the battery temperature is higher.
    • 一种充电方法和充电装置,其可以特别用于使用Pb-Sb合金栅极作为正极栅极对阀控铅酸蓄电池进行充电。 以预定电流值进行初级恒流充电。 在电池电压达到转换电压Vc之后,延长时间ta进一步继续进行初级恒流充电。 扩展时间过后,使用比初级恒流充电小的电流值将充电切换为次级恒流充电。 延长一次恒流充电的延长时间优选设定为随着电池温度越高而越短。 此外,用于执行次级恒流充电的二次充电时间优选地设定为随着电池温度较高而更短。
    • 9. 发明授权
    • Substrate grinding method and device
    • 基材研磨方法及装置
    • US07848844B2
    • 2010-12-07
    • US12099424
    • 2008-04-08
    • Seiji Nemoto
    • Seiji Nemoto
    • G06F19/00G05B11/01G05D3/00G01C25/00
    • B24B7/228B24B49/02B24B49/16
    • A grinding method wherein the correlation between the amount of inertial grinding occurring in performing spark-out by a grinding unit and the maximum load current in a motor of the grinding unit is grasped, and a correction value for the amount of inertial grinding corresponding to the maximum load current is preliminarily obtained. When the wafer thickness measured by a thickness measuring gauge has reached the sum of a desired value and the correction value (=the amount of inertial grinding) corresponding to the maximum load current, the spark-out is started. Accordingly, the wafer thickness becomes the desired value after the inertial grinding in performing the spark-out.
    • 一种研磨方法,其中,掌握在研磨单元中进行火花发生时发生的惯性磨削量与研磨单元的电动机中的最大负载电流之间的相关性,以及对应于磨削单元的惯性磨削量的校正值 预先获得最大负载电流。 当通过厚度测量计测量的晶片厚度达到与最大负载电流相对应的期望值和修正值(=惯性磨削量)之和时,开始火花发射。 因此,在进行火花发射的惯性磨削之后,晶片厚度成为期望值。