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    • 3. 发明申请
    • ARC ION PLATING APPARATUS
    • ARC离子镀设备
    • US20110067631A1
    • 2011-03-24
    • US12953926
    • 2010-11-24
    • Hiroshi TamagakiHirofumi FujiiTadao OkimotoRyoji Miyamoto
    • Hiroshi TamagakiHirofumi FujiiTadao OkimotoRyoji Miyamoto
    • C23C14/48
    • C23C14/325H01J37/32055H01J37/3266H01J37/32761H01J2237/0206
    • An arc ion plating apparatus comprises a vacuum chamber, a rotary table for moving a substrate within the vacuum chamber vertically relative to its height direction, an arc evaporation source for bombardment for cleaning the surface of the substrate with metal ions, and an arc evaporation source for deposition group for depositing metal ions on the surface of the substrate. The arc evaporation source for deposition group is composed of a plurality of evaporation sources arranged so as to be opposite to the substrate set on the rotary table, and the arc evaporation source for bombardment is arranged so as to be opposite to the substrate, and formed so that its length in the height direction of the vacuum chamber is equal to the length between the upper and lower ends of the arc evaporation source for deposition group. According to such a structure, over temperature rise or abnormal discharge is hardly caused in the substrate at the time of bombardment, and process controllability is consequently enhanced.
    • 电弧离子镀装置包括真空室,用于使真空室内的基板相对于其高度方向垂直移动的旋转台,用于用金属离子清洗基板的表面的电弧蒸发源,以及电弧蒸发源 用于在基底表面上沉积金属离子的沉积组。 用于沉积组的电弧蒸发源由多个蒸发源构成,多个蒸发源被布置为与设置在旋转台上的基板相对,并且用于轰击的电弧蒸发源被布置成与基板相对,并形成 使得其在真空室的高度方向上的长度等于用于沉积组的电弧蒸发源的上端和下端之间的长度。 根据这样的结构,在轰击时在基板上几乎不发生过度升温或异常放电,从而提高了工艺控制性。
    • 4. 发明申请
    • ARC ION PLATING APPARATUS
    • ARC离子镀设备
    • US20070240982A1
    • 2007-10-18
    • US11532778
    • 2006-09-18
    • Hiroshi TamagakiHirofumi FujiiTadao OkimotoRyoji Miyamoto
    • Hiroshi TamagakiHirofumi FujiiTadao OkimotoRyoji Miyamoto
    • C23C14/00
    • C23C14/325H01J37/32055H01J37/3266H01J37/32761H01J2237/0206
    • An arc ion plating apparatus comprises a vacuum chamber, a rotary table for moving a substrate within the vacuum chamber vertically relative to its height direction, an arc evaporation source for bombardment for cleaning the surface of the substrate with metal ions, and an arc evaporation source for deposition group for depositing metal ions on the surface of the substrate. The arc evaporation source for deposition group is composed of a plurality of evaporation sources arranged so as to be opposite to the substrate set on the rotary table, and the arc evaporation source for bombardment is arranged so as to be opposite to the substrate, and formed so that its length in the height direction of the vacuum chamber is equal to the length between the upper and lower ends of the arc evaporation source for deposition group. According to such a structure, over temperature rise or abnormal discharge is hardly caused in the substrate at the time of bombardment, and process controllability is consequently enhanced.
    • 电弧离子镀装置包括真空室,用于使真空室内的基板相对于其高度方向垂直移动的旋转台,用于用金属离子清洗基板的表面的电弧蒸发源,以及电弧蒸发源 用于在基底表面上沉积金属离子的沉积组。 用于沉积组的电弧蒸发源由多个蒸发源构成,多个蒸发源被布置为与设置在旋转台上的基板相对,并且用于轰击的电弧蒸发源被布置成与基板相对,并形成 使得其在真空室的高度方向上的长度等于用于沉积组的电弧蒸发源的上端和下端之间的长度。 根据这样的结构,在轰击时在基板上几乎不发生过度升温或异常放电,从而提高了工艺控制性。
    • 5. 发明授权
    • Arc ion plating apparatus
    • 电弧离子镀设备
    • US08261693B2
    • 2012-09-11
    • US12953926
    • 2010-11-24
    • Hiroshi TamagakiHirofumi FujiiTadao OkimotoRyoji Miyamoto
    • Hiroshi TamagakiHirofumi FujiiTadao OkimotoRyoji Miyamoto
    • C23C14/48
    • C23C14/325H01J37/32055H01J37/3266H01J37/32761H01J2237/0206
    • An arc ion plating apparatus comprises a vacuum chamber, a rotary table for moving a substrate within the vacuum chamber vertically relative to its height direction, an arc evaporation source for bombardment for cleaning the surface of the substrate with metal ions, and an arc evaporation source for deposition group for depositing metal ions on the surface of the substrate. The arc evaporation source for deposition group is composed of a plurality of evaporation sources arranged so as to be opposite to the substrate set on the rotary table, and the arc evaporation source for bombardment is arranged so as to be opposite to the substrate, and formed so that its length in the height direction of the vacuum chamber is equal to the length between the upper and lower ends of the arc evaporation source for deposition group. According to such a structure, over temperature rise or abnormal discharge is hardly caused in the substrate at the time of bombardment, and process controllability is consequently enhanced.
    • 电弧离子镀装置包括真空室,用于使真空室内的基板相对于其高度方向垂直移动的旋转台,用于用金属离子清洗基板的表面的电弧蒸发源,以及电弧蒸发源 用于在基底表面上沉积金属离子的沉积组。 用于沉积组的电弧蒸发源由多个蒸发源构成,多个蒸发源被布置为与设置在旋转台上的基板相对,并且用于轰击的电弧蒸发源被布置成与基板相对,并形成 使得其在真空室的高度方向上的长度等于用于沉积组的电弧蒸发源的上端和下端之间的长度。 根据这样的结构,在轰击时在基板上几乎不发生过度升温或异常放电,从而提高了工艺控制性。
    • 6. 发明授权
    • Vacuum evaporator
    • 真空蒸发器
    • US07131392B2
    • 2006-11-07
    • US10879584
    • 2004-06-30
    • Katuhiko ShimojimaHirofumi FujiiHiroshi Kawaguchi
    • Katuhiko ShimojimaHirofumi FujiiHiroshi Kawaguchi
    • C23C14/32C23C14/24C23C14/56
    • H01J37/32055C23C14/505C23C14/56H01J37/32458
    • A vacuum evaporator according to the present invention comprises a vacuum chamber, a rod-like evaporation source provided to be liftable into and out of the vacuum chamber, and a work support means for supporting, relative to the evaporation source lowered into the vacuum chamber, works W arranged to surround the evaporation source. The vacuum chamber is formed of a fixed chamber part and a movable chamber part provided connectably to and disconnectably from the fixed chamber part and mounted with the work support means. Either one movable chamber part is horizontally moved and connected to the fixed chamber part in the state where the evaporation source is raised and retreated out of the vacuum chamber to perform vacuum evaporation treatment. According to such a structure, the maintenance of the vacuum evaporator can be performed without raising or lowering the lower plate or taking out the work support means from the vacuum chamber.
    • 根据本发明的真空蒸发器包括真空室,设置成能够进出真空室的棒状蒸发源,以及用于相对于下降到真空室中的蒸发源支撑的工件支撑装置, 工作W布置成围绕蒸发源。 真空室由固定室部分和与固定室部分可连接并可断开地设置并安装在工件支承装置上的活动室部分构成。 在蒸发源升高并退出真空室的状态下,任一个活动室部分水平移动并连接到固定室部分,以进行真空蒸发处理。 根据这样的结构,可以在不升降下板的情况下进行真空蒸发器的维护,或从真空室取出工作支承机构。
    • 7. 发明申请
    • Vacuum evaporator
    • 真空蒸发器
    • US20050005860A1
    • 2005-01-13
    • US10879584
    • 2004-06-30
    • Katuhiko ShimojimaHirofumi FujiiHiroshi Kawaguchi
    • Katuhiko ShimojimaHirofumi FujiiHiroshi Kawaguchi
    • C23C14/24C23C14/50C23C14/56H01J37/32C23C16/00
    • H01J37/32055C23C14/505C23C14/56H01J37/32458
    • A vacuum evaporator according to the present invention comprises a vacuum chamber, a rod-like evaporation source provided to be liftable into and out of the vacuum chamber, and a work support means for supporting, relative to the evaporation source lowered into the vacuum chamber, works W arranged to surround the evaporation source. The vacuum chamber is formed of a fixed chamber part and a movable chamber part provided connectably to and disconnectably from the fixed chamber part and mounted with the work support means. Either one movable chamber part is horizontally moved and connected to the fixed chamber part in the state where the evaporation source is raised and retreated out of the vacuum chamber to perform vacuum evaporation treatment. According to such a structure, the maintenance of the vacuum evaporator can be performed without raising or lowering the lower plate or taking out the work support means from the vacuum chamber.
    • 根据本发明的真空蒸发器包括真空室,设置成能够进出真空室的棒状蒸发源,以及用于相对于下降到真空室中的蒸发源支撑的工件支撑装置, 工作W布置成围绕蒸发源。 真空室由固定室部分和与固定室部分可连接并可断开地设置并安装在工件支承装置上的活动室部分构成。 在蒸发源升高并退出真空室的状态下,任一个活动室部分水平移动并连接到固定室部分,以进行真空蒸发处理。 根据这样的结构,可以在不升降下板的情况下进行真空蒸发器的维护,或从真空室取出工作支承机构。