专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US6040620A Lead frame for LOC having a regulating lead to prevent variation in adhesive coverage 失效
标题翻译： LOC的引线框架具有调节引线以防止粘合剂覆盖的变化
公开(公告)号：US6040620A
公开(公告)日：2000-03-21
申请号：US888121
申请日：1997-07-03
申请人： Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Takaharu Yonemoto , Osamu Yoshioka
发明人： Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Takaharu Yonemoto , Osamu Yoshioka
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L2924/0002
摘要： A lead frame for LOC is provided which can reduce a variation in coverage of an insulating adhesive, permitting the fixation of a semiconductor chip and wire bonding to be stably performed. In a lead frame for LOC 10 wherein an insulating adhesive for fixing a semiconductor chip is applied to inner leads 11 in their semiconductor chip mounting region, a coverage regulating lead 14 is provided outside the semiconductor chip mounting region and adjacent to inner leads 11a, 11b located at the end of the semiconductor chip mounting region, permitting the insulting adhesive to be homogeneously applied to each of the inner leads 11 without creating any variation in coverage of the adhesive.
摘要翻译：提供了一种用于LOC的引线框架，其可以减少绝缘粘合剂的覆盖范围的变化，从而允许半导体芯片的固定和引线键合被稳定地执行。在用于LOC 10的引线框架中，其中用于固定半导体芯片的绝缘粘合剂被施加到其半导体芯片安装区域中的内部引线11，覆盖调节引线14设置在半导体芯片安装区域的外部并且与内部引线11a，11b相邻位于半导体芯片安装区域的端部，允许绝缘粘合剂均匀地施加到每个内引线11，而不产生粘合剂的覆盖范围的任何变化。

2. 发明授权

US06246106B1 Lead frame 失效
标题翻译：引线架
公开(公告)号：US06246106B1
公开(公告)日：2001-06-12
申请号：US08886976
申请日：1997-07-03
申请人： Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Takaharu Yonemoto , Osamu Yoshioka
发明人： Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Takaharu Yonemoto , Osamu Yoshioka
IPC分类号： H01L23495
CPC分类号： H01L23/4951 , H01L2924/0002 , H01L2924/00
摘要： A lead frame is provided which enables a coating of an insulating adhesive for fixing a semiconductor chip to be evenly and thickly foamed on inner leads. In a lead frame wherein an insulating adhesive for fixing a semiconductor chip is applied to a semiconductor chip mounting region, inner leads 1 are set to a value of w/s of not more than 1 wherein w represents the lead width and s represents the lead spacing.
摘要翻译：提供了一种引线框架，其能够使用于将半导体芯片固定的绝缘粘合剂的涂层在内引线上均匀且发泡。在半导体芯片安装区域中施加用于固定半导体芯片的绝缘粘合剂的引线框架中，将内引线1设定为不大于1的w / s的值，其中w表示引线宽度，s表示引线间距。

3. 发明授权

US5880522A Stamped lead frame with adhesive layer for fixing to semiconductor device 失效
标题翻译：冲压引线框架，具有用于固定到半导体器件的粘合剂层
公开(公告)号：US5880522A
公开(公告)日：1999-03-09
申请号：US897828
申请日：1997-07-21
申请人： Takaharu Yonemoto , Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Osamu Yoshioka
发明人： Takaharu Yonemoto , Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Osamu Yoshioka
IPC分类号： B21D28/00 , H01L21/52 , H01L23/495 , H01L23/50
CPC分类号： H01L23/4951 , H01L2224/32245
摘要： A lead frame for LOC is provided which, even when an adhesive is applied to a lead prepared by stamping, can ensure insulation of a semiconductor element mounted from the lead. In applying an adhesive to a predetermined position of an inner lead 1 in a lead frame prepared by stamping to form an adhesive layer 4, the adhesive layer 4 is provided on the droop face of the inner lead 1. The droop face has no burr and a bulged center portion, permitting contact, derived from the burr, between a lead face and a semiconductor element, to be avoided, which ensures satisfactory insulation of the semiconductor element mounted from the lead.
摘要翻译：提供了一种用于LOC的引线框架，即使当将粘合剂施加到通过冲压制备的引线上时，可以确保安装在引线上的半导体元件的绝缘。在通过冲压制成的引线框架中的内引线1的预定位置施加粘合剂以形成粘合剂层4时，粘合剂层4设置在内引线1的下垂面上。下垂面没有毛刺，避免了引线面和半导体元件之间产生从毛刺导出的凸起的中心部分，这确保了安装在引线上的半导体元件的令人满意的绝缘。

4. 发明授权

US06268646B1 Lead frame for lead on chip 失效
标题翻译：芯片引线框架
公开(公告)号：US06268646B1
公开(公告)日：2001-07-31
申请号：US08917916
申请日：1997-08-27
申请人： Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Takaharu Yonemoto , Osamu Yoshioka
发明人： Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Takaharu Yonemoto , Osamu Yoshioka
IPC分类号： H01L2350
CPC分类号： H01L23/4951 , H01L24/48 , H01L2224/05639 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2924/00014 , H01L2924/07802 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/85399
摘要： A lead frame for LOC to which a semiconductor chip is fixed within a semiconductor chip-mounting region. In addition to applying insulative adhesives to the conventional portions or spots which are on the bottom surfaces of the leading edges of respective inner leads for wire bonding to the pads for the semiconductor ship, the insulative adhesives are applied to other portions of the inner leads in the vicinity of the semiconductor chip-mounting region. Accordingly, the area for bonding the semiconductor chip can be enlarged resulting in improvements in the stability of adhesion between the leads and the semiconductor chip, and in the stabilities of wire bonding and resin molding.
摘要翻译：半导体芯片安装区域内固定有半导体芯片的LOC引线框架。除了将绝缘粘合剂施加到用于与半导体船的焊盘引线接合的各内引线的前缘的底表面上的常规部分或点之外，绝缘粘合剂被施加到内引线的其它部分半导体芯片安装区域附近。因此，可以扩大用于接合半导体芯片的区域，从而提高引线与半导体芯片之间的粘附稳定性，以及引线接合和树脂成型的稳定性。

5. 发明授权

US6107675A Lead frame 失效
标题翻译：引线框架，制造方法以及使用其的半导体器件
公开(公告)号：US6107675A
公开(公告)日：2000-08-22
申请号：US873704
申请日：1997-06-12
申请人： Hiroshi Sugimoto , Hiroki Tanaka , Shigeo Hagiya , Takaharu Yonemoto
发明人： Hiroshi Sugimoto , Hiroki Tanaka , Shigeo Hagiya , Takaharu Yonemoto
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L24/27 , H01L24/743 , H01L2224/05599 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/85399 , H01L2224/92147 , H01L24/48 , H01L2924/00014 , H01L2924/07802 , H01L2924/181
摘要： A lead frame for semiconductor device comprises first inner leads 21-2, 21-3 and 21-4 each having a region 22-2, 22-3, 22-4 on which a predetermined quantity of adhesive is applied, and second inner leads 21-1 and 21-5 each having a region 22-1, 22-5 which is wider than those of the first inner leads. The first inner leads 21-2, 21-3 and 21-4 have a width W.sub.1, while the second inner leads 21-1 and 21-5 have a width W.sub.2 which is wider than W1. The second inner leads 21-1 and 21-5 are arranged at the positions where one successive application of varnish-like adhesive to the inner leads begins and ends, respectively. The ratio of W.sub.1 to W.sub.2 is preferably 1 to 1.3 (i.e., W.sub.1 :W.sub.2 =1:1.3) or more. Even if an excessive quantity of varnish-like adhesive is applied to the beginning inner lead 21-1 or the ending inner lead 21-5, it is spread over the region 22-1 or 22-5, then adhesive layers having uniform thickness are formed.
摘要翻译：用于半导体器件的引线框架包括第一内引线21-2,21-3和21-4，每个引线具有施加预定量粘合剂的区域22-2,22-3,22-4，第二内引线 21-1和21-5各自具有比第一内引线宽的区域22-1,22-5。第一内引线21-2,21-3和21-4具有宽度W1，而第二内引线21-1和21-5具有宽于W1的宽度W2。第二内引线21-1和21-5分别布置在连续施加清漆状粘合剂到内引线开始和结束的位置处。 W1与W2的比优选为1〜1.3（W1：W2 = 1：1.3）以上。即使过量的清漆状粘合剂施加到起始内引线21-1或端部内引线21-5上，它分布在区域22-1或22-5上，然后具有均匀厚度的粘合剂层是形成。

6. 发明申请

US20130299808A1 ORGANIC EL DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：有机EL显示装置及其制造方法
公开(公告)号：US20130299808A1
公开(公告)日：2013-11-14
申请号：US13980310
申请日：2012-01-31
申请人： Hiroshi Sugimoto , Tohru Sonoda
发明人： Hiroshi Sugimoto , Tohru Sonoda
IPC分类号： H01L51/52 , H01L51/56
CPC分类号： H01L51/5203 , H01L27/3258 , H01L51/5271 , H01L51/56 , H01L2251/5323
摘要： In an organic EL display device (100), an insulating layer (113) includes a first insulating film (113a) and a second insulating film (113b) provided thereabove, a plurality of upper electrodes (115c) are each provided to cover a corresponding one of a plurality of organic EL layers (115b), and a reflection film (114) is provided between the first insulating film (113a) and the second insulating film (113b), corresponding to a region N other than the a light emission region. The reflection film (114) reflects toward a sealing substrate (120) a portion of light generated in each organic EL layer (115b) which is diffused into the region N other than the light emission region so that the portion of the light is transmitted through a separation wall portion (116) and the sealing substrate (120) to be viewed as an image on the sealing substrate.
摘要翻译：在有机EL显示装置（100）中，绝缘层（113）包括设置在其上方的第一绝缘膜（113a）和第二绝缘膜（113b），多个上电极（115c）分别设置成覆盖相应的在第一绝缘膜（113a）和第二绝缘膜（113b）之间设置有多个有机EL层（115b）中的一个和反射膜（114），对应于除了发光区域。反射膜（114）朝向密封基板（120）反射在每个有机EL层（115b）中产生的一部分光，其被扩散到除了发光区域之外的区域N中，使得该部分光被透过分隔壁部分（116）和密封基板（120），以被视为密封基板上的图像。

7. 发明授权

US08284300B2 Electronic camera 有权
标题翻译：电子相机
公开(公告)号：US08284300B2
公开(公告)日：2012-10-09
申请号：US12541740
申请日：2009-08-14
申请人： Hiroshi Sugimoto , Takanori Sato
发明人： Hiroshi Sugimoto , Takanori Sato
IPC分类号： H04N5/235
CPC分类号： H04N5/23212 , H04N5/23219 , H04N5/23245 , H04N5/2628
摘要： An electronic camera includes an imaging device. The imaging device has an imaging surface irradiated with an optical image of an object scene. A CPU executes an AF process based on output of an AF evaluating circuit to adjust a position of a focus lens to a position to be optically converged on a specific object present in an object scene. Upon completion of the AF process, the CPU detects a distance from a lens distal end to the specific object by referencing a current position of the focus lens, and further detects brightness information of the object scene based on output of an AE/AWB evaluating circuit. Moreover, the CPU adjusts an imaging parameter by determining whether or not an object scene attribute including the detected distance and brightness information satisfies a predetermined condition.
摘要翻译：电子照相机包括成像装置。成像装置具有用物体场景的光学图像照射的成像表面。 CPU基于AF评估电路的输出执行AF处理，以将聚焦透镜的位置调整到光学会聚在存在于对象场景中的特定对象上的位置。在完成AF处理后，CPU通过参照聚焦透镜的当前位置来检测从透镜远端到特定物体的距离，并且还基于AE / AWB评估电路的输出来检测物体场景的亮度信息。此外，CPU通过确定包括检测到的距离和亮度信息的对象场景属性是否满足预定条件来调整成像参数。

8. 发明授权

US08257730B2 Steroid-containing sustained release intraocular implants and related methods 有权
标题翻译：类固醇持续释放眼内植入物及相关方法
公开(公告)号：US08257730B2
公开(公告)日：2012-09-04
申请号：US11118288
申请日：2005-04-29
申请人： Glenn T. Huang , Thierry Nivaggioli , Lon T. Spada , Hiroshi Sugimoto , Wendy M Blanda , James N. Chang , Orest Olejnik
发明人： Glenn T. Huang , Thierry Nivaggioli , Lon T. Spada , Hiroshi Sugimoto , Wendy M Blanda , James N. Chang , Orest Olejnik
IPC分类号： A61F2/00
CPC分类号： A61K9/0051 , A61K9/0092 , A61K31/573 , A61K31/58 , A61K45/06 , A61K2300/00
摘要： Biocompatible intraocular implants include a steroid and a polymer associated with each other to facilitate release of the steroid into an eye for a period of time greater than about two months. The steroid may be associated with a biodegradable polymer matrix, such as a matrix of a two biodegradable polymers. Or, the steroid may be associated with a polymeric coating having one or more openings effective to permit the steroid to be released into an external environment. The implants may be placed in an eye to treat one or more ocular conditions. The steroid is released from the implant for more than about two months, and may be release for more than several years.
摘要翻译：生物相容性眼内植入物包括彼此相关的类固醇和聚合物，以促进类固醇进入眼睛大于约两个月的时间。类固醇可以与可生物降解的聚合物基质相关联，例如两种可生物降解聚合物的基质。或者，类固醇可以与具有一个或多个开口有效以允许类固醇释放到外部环境中的聚合物涂层相关联。植入物可以放置在眼睛中以治疗一种或多种眼睛状况。类固醇从植入物中释放超过约两个月，可能会释放超过几年。

9. 发明授权

US08179450B2 Electronic camera 失效
标题翻译：电子相机
公开(公告)号：US08179450B2
公开(公告)日：2012-05-15
申请号：US12576947
申请日：2009-10-09
申请人： Hiroshi Sugimoto
发明人： Hiroshi Sugimoto
IPC分类号： H04N5/228 , H04N5/222 , H04N5/232 , G06K9/00 , G06K9/46 , G06K9/62
CPC分类号： H04N5/232 , G06K9/00228 , H04N5/23219
摘要： An electronic camera includes an imager. The imager, having an imaging surface capturing an object scene, outputs an object scene image. A CPU searches a face portion of a person from the object scene based on the object scene image outputted from the imager. Moreover, the CPU sets to the imaging surface a cross area having a shape different depending on each attitude of the discovered face portion, in a manner to correspond to the discovered face portion. The CPU refers to an image of the cross area thus set so as to adjust imaging parameters such as a focus and an exposure amount.
摘要翻译：电子照相机包括成像器。具有拍摄对象场景的成像表面的成像器输出对象场景图像。基于从成像器输出的对象场景图像，CPU从对象场景搜索人脸部分。此外，CPU以对应于所发现的脸部部分的方式，将具有取决于所发现的面部的每个姿态的形状的横截面设置到成像表面。 CPU是指如此设置的交叉区域的图像，以便调整诸如焦点和曝光量的成像参数。

10. 发明申请

US20110292249A1 ELECTRONIC CAMERA 审中-公开
标题翻译：电子相机
公开(公告)号：US20110292249A1
公开(公告)日：2011-12-01
申请号：US13115375
申请日：2011-05-25
申请人： Hiroshi Sugimoto , Naoki Yonetani
发明人： Hiroshi Sugimoto , Naoki Yonetani
IPC分类号： H04N9/68 , H04N5/228
CPC分类号： H04N5/23212
摘要： An electronic camera includes an imager. An imager, having an imaging surface capturing a scene, outputs an image. A specific key is transitioned among a non-operated state, a first operated state and a second operated state. A sensor senses the specific key being transitioned from the non-operated state to another state. A setter sets a reference indicating a magnitude different depending on a state of the specific key, in response to a sensing of the sensor. An adjuster adjusts an imaging condition based on the image outputted from the imager. A controller determines whether or not a variation of the scene captured by the imaging surface exceeds the reference set by the setter, so as to permit an adjusting process of the adjuster corresponding to a positive determined result while restrict the adjusting process of the adjuster corresponding to a negative determined result.
摘要翻译：电子照相机包括成像器。具有捕获场景的成像表面的成像器输出图像。特定键在非操作状态，第一操作状态和第二操作状态之间转变。传感器感测到从非操作状态转换到另一状态的特定键。响应于传感器的感测，设定器设置指示取决于特定键的状态而不同的幅度的参考。调整器基于从成像器输出的图像来调整成像条件。控制器确定由成像表面拍摄的场景的变化是否超过由设定者设定的参考，以便允许调节器对应于肯定确定结果的调整处理，同时限制对应于否定确定结果。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式