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1. 发明授权

US4505980A Insulated wire 失效
标题翻译：绝缘电线
公开(公告)号：US4505980A
公开(公告)日：1985-03-19
申请号：US439199
申请日：1982-11-04
申请人： Hiroshi Nishizawa , Yoshiyuki Mukoyama , Shozo Kasai , Yasunori Okada
发明人： Hiroshi Nishizawa , Yoshiyuki Mukoyama , Shozo Kasai , Yasunori Okada
IPC分类号： H01B7/29 , C08G73/14 , H01B3/30 , B32B27/00 , H01B7/00
CPC分类号： H01B3/306 , C08G73/14 , Y10T428/2947
摘要： An insulated wire having excellent heat resistance, abrasion resistance and flexibility can be prepared by coating on an electric conductor directly or via another insulating material a polyamide-imide resin composition prepared by reacting an aromatic diisocyanate and a tricarboxylic acid anhydride in the presence of a basic solvent while adjusting the resin content at 40% by weight or more, and adding to the reaction system a lactam in an amount of 0.1 to 1.0 mole per mole of the aromatic diisocyanate, and if necessary, an alcohol and/or an oxime in an amount of 0.01 to 0.5 mole per mole of the aromatic diisocyanate before, during or after the above-mentioned reaction to mask terminal functional groups and to make the reduced viscosity of the composition 0.1 to 0.27, and baking the resin composition.
摘要翻译：具有优异的耐热性，耐磨性和柔韧性的绝缘线可以通过在电导体上直接或通过另一种绝缘材料涂覆聚酰胺酰亚胺树脂组合物来制备，所述聚酰胺酰亚胺树脂组合物通过芳基二异氰酸酯和三羧酸酐在碱存在下反应制备溶剂，同时将树脂含量调节至40重量％以上，并且向反应体系中加入每摩尔芳族二异氰酸酯为0.1至1.0摩尔量的内酰胺，如果需要，将其中的醇和/或肟在上述掩蔽末端官能团的反应之前，期间或之后，使组合物的比浓对数为0.1〜0.27，并将该树脂组合物烘烤，每摩尔芳族二异氰酸酯的量为0.01〜0.5摩尔。

2. 发明授权

US4448844A Heat resistant resin and process for producing the same 失效
标题翻译：耐热树脂及其制造方法
公开(公告)号：US4448844A
公开(公告)日：1984-05-15
申请号：US518109
申请日：1983-07-28
申请人： Yuichi Osada , Shozo Kasai , Yasunori Okada , Isao Uchigasaki , Toyoji Oshima , Yoshiyuki Mukoyama , Hiroshi Nishizawa
发明人： Yuichi Osada , Shozo Kasai , Yasunori Okada , Isao Uchigasaki , Toyoji Oshima , Yoshiyuki Mukoyama , Hiroshi Nishizawa
IPC分类号： C08G18/00 , C08G18/28 , C08G18/34 , C08G18/79 , C08G73/00 , C08G73/14 , C08L67/00 , C08L79/08 , C09D5/25 , C09D179/08 , H01B3/30 , D02G3/00 , B32B15/08 , H01B7/00
CPC分类号： C08G18/2855 , C08G18/343 , C08G73/14 , C08L79/08 , H01B3/306 , H01B3/308 , Y10T428/2933 , Y10T428/294 , Y10T428/31681
摘要： A heat resistant resin produced by reacting (A) a polyamideimide resin with (B) an alcohol component and (C) an acid component with heating is soluble in a cresol type solvent and gives coatings excellent in heat resistance, thermal shock resistance, wear resistance, resistance to hydrolysis, etc., suitable for enamelled wire.
摘要翻译：通过（A）聚酰胺酰亚胺树脂与（B）醇组分和（C）酸组分的加热反应制得的耐热树脂可溶于甲酚型溶剂中，得到耐热性，耐热冲击性，耐磨性优异的涂料，耐水解等，适用于漆包线。

3. 发明授权

US4431758A Heat resistant resin composition comprising reaction product of polyamideimide resin, alcohol and acid component. 失效
标题翻译：耐热树脂组合物，其包含聚酰胺酰亚胺树脂，醇和酸组分的反应产物。
公开(公告)号：US4431758A
公开(公告)日：1984-02-14
申请号：US363799
申请日：1982-03-31
申请人： Yuichi Osada , Shozo Kasai , Yasunori Okada , Isao Uchigasaki , Toyoji Oshima , Yoshiyuki Mukoyama , Hiroshi Nishizawa
发明人： Yuichi Osada , Shozo Kasai , Yasunori Okada , Isao Uchigasaki , Toyoji Oshima , Yoshiyuki Mukoyama , Hiroshi Nishizawa
IPC分类号： C08G18/00 , C08G18/28 , C08G18/34 , C08G18/79 , C08G73/00 , C08G73/14 , C08L67/00 , C08L79/08 , C09D5/25 , C09D179/08 , H01B3/30 , C08G18/60 , C08G18/83 , C08G69/48
CPC分类号： C08G18/2855 , C08G18/343 , C08G73/14 , C08L79/08 , H01B3/306 , H01B3/308 , Y10T428/2933 , Y10T428/294 , Y10T428/31681
摘要： A heat resistant resin produced by reacting (A) a polyamideimide resin with (B) an alcohol component and (C) an acid component with heating is soluble in a cresol type solvent and gives coatings excellent in heat resistance, thermal shock resistance, wear resistance, resistance to hydrolysis, etc., suitable for enamelled wire.
摘要翻译：通过（A）聚酰胺酰亚胺树脂与（B）醇组分和（C）酸组分的加热反应制得的耐热树脂可溶于甲酚型溶剂中，得到耐热性，耐热冲击性，耐磨性优异的涂料，耐水解等，适用于漆包线。

4. 发明授权

US4614782A Heat resistant resin composition 失效
标题翻译：耐热树脂组合物
公开(公告)号：US4614782A
公开(公告)日：1986-09-30
申请号：US674309
申请日：1984-11-23
申请人： Hiroshi Nishizawa , Shozo Kasai , Yasunori Okada , Yuichi Osada , Yoshiyuki Mukoyama
发明人： Hiroshi Nishizawa , Shozo Kasai , Yasunori Okada , Yuichi Osada , Yoshiyuki Mukoyama
IPC分类号： C08G18/28 , C08G18/34 , C08G18/46 , C08G18/79 , C08G73/10 , C08L79/08 , H01B3/30 , H01B3/42 , C08F283/04 , C08L71/00
CPC分类号： H01B3/42 , C08G18/2855 , C08G18/343 , C08G18/4661 , C08G18/791 , C08G73/1035 , C08L79/08 , H01B3/306
摘要： A heat resistant resin composition comprising (A) a polyamideimide resin soluble in a cresol type solvent obtained by using a lactam as a reactant, and (B) at least one member selected from the group consisting of a polyester resin, a polyesteramide resin, a polyesterimide resin and a polyesteramideimide resin, preferably heated for conducting a reaction, gives coatings excellent in heat resistance, thermal shock resistance, wear resistance, resistance to hydrolysis, crazing resistance, etc., suitable for enamelled wire.
摘要翻译：一种耐热树脂组合物，其包含（A）可溶于通过使用内酰胺作为反应物得到的甲酚型溶剂的聚酰胺酰亚胺树脂，和（B）选自聚酯树脂，聚酯酰胺树脂，聚酯酰亚胺树脂和优选加热以进行反应的聚酯酰胺酰亚胺树脂，得到适用于漆包线的耐热性，耐热冲击性，耐磨性，耐水解性，耐龟裂性等优异的涂层。

5. 发明授权

US4447589A Method for preparing polyamide-imide resin 失效
标题翻译：聚酰胺酰亚胺树脂的制备方法
公开(公告)号：US4447589A
公开(公告)日：1984-05-08
申请号：US439198
申请日：1982-11-04
申请人： Hiroshi Nishizawa , Yoshiyuki Mukoyama , Shozo Kasai
发明人： Hiroshi Nishizawa , Yoshiyuki Mukoyama , Shozo Kasai
IPC分类号： C08G18/00 , C08G18/34 , C08G73/14 , C09D175/00 , H01B3/30 , C08G18/80
CPC分类号： C08G73/14 , H01B3/306
摘要： A polyamide-imide resin which can give a varnish having a high resin content, excellent in storage stability and heat resistant final products can be produced by reacting an aromatic diisocyanate with a tricarboxylic acid anhydride in the presence of a basic solvent while adjusting the resin content at 40% by weight or more, and adding a specific amount of lactam and a specific amount of an alcohol and/or an oxime separately before, during or after the above-mentioned reaction so as to adjust the reduced viscosity of the resin to 0.10 to 0.27.
摘要翻译：能够提供具有高树脂含量，优异储存稳定性和耐热成品的清漆的聚酰胺 - 酰亚胺树脂可以通过在碱性溶剂的存在下使芳族二异氰酸酯与三羧酸酐反应同时调节树脂含量 40重量％以上，在上述反应之前，之中或之后分别加入特定量的内酰胺和特定量的醇和/或肟，以将树脂的比浓粘度调节至0.10 至0.27。

6. 发明授权

US4954612A Solvent-soluble polyimide and production thereof 失效
标题翻译：溶剂型聚酰亚胺及其制备方法
公开(公告)号：US4954612A
公开(公告)日：1990-09-04
申请号：US309878
申请日：1989-02-14
申请人： Yoshihiro Nomura , Kazuhito Hanabusa , Hiroshi Minamisawa , Takashi Morinaga , Toichi Sakata , Yoshiyuki Mukoyama , Hiroshi Nishizawa , Hiromu Miyajima
发明人： Yoshihiro Nomura , Kazuhito Hanabusa , Hiroshi Minamisawa , Takashi Morinaga , Toichi Sakata , Yoshiyuki Mukoyama , Hiroshi Nishizawa , Hiromu Miyajima
IPC分类号： C07K5/02 , C08G73/10
CPC分类号： C07K5/0202 , C08G73/1042 , C08G73/1064
摘要： A solvent-soluble polyimide obtained from an exo-form dicarboxylic acid anhydride with an aromatic diamine, e.g. 2,2,-bis[4-(4-aminophenoxy)phenyl]propane is improved in film-forming properties and transparency, and particularly suitable for producing an orientation controlling film in a liquid crystal display device.

7. 发明授权

US5087658A Heat-resistant resin paste and integrated circuit device produced by using the heat-resistant resin paste 失效
标题翻译：使用耐热树脂生产的耐热树脂胶浆和集成电路设备
公开(公告)号：US5087658A
公开(公告)日：1992-02-11
申请号：US452520
申请日：1989-12-18
申请人： Hiroshi Nishizawa , Kenji Suzuki , Yoshiyuki Mukoyama , Tohru Kikuchi , Hidetaka Sato
发明人： Hiroshi Nishizawa , Kenji Suzuki , Yoshiyuki Mukoyama , Tohru Kikuchi , Hidetaka Sato
IPC分类号： H01B3/30 , H01L23/29 , H01L23/31 , H01L23/498 , H01L23/532 , H05K1/00 , H05K3/28 , H05K3/46
CPC分类号： H01B3/303 , H01L23/293 , H01L23/3135 , H01L23/49894 , H01L23/5329 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H05K3/285 , H05K3/4664 , H05K3/4676
摘要： A heat-resistant resin paste consisting essentially of a first organic liquid (A.sub.1), a second organic liquid (A.sub.2), a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting essentially of the first organic liquid (A.sub.1) and the second organic liquid (A.sub.2), and fine particles of a heat-resistant resin (C) which are soluble in the first organic liquid (A.sub.1), but insoluble in the second organic liquid (A.sub.2). The first organic liquid (A.sub.1), the second organic liquid (A.sub.2), and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed. The heat-resistant resin paste may be suitably used for screen process printing to provide integrated circuit devices with insulator layers or surface protecting layers. The heat-resistant resin paste is suitable for forming insulator layers or surface protecting layers in integrated circuit devices by employing screen process printing.

8. 发明授权

US4791157A Polyetheramide-imide polymer composition 失效
标题翻译：聚酰胺酰亚胺聚合物组合物
公开(公告)号：US4791157A
公开(公告)日：1988-12-13
申请号：US020885
申请日：1987-03-02
申请人： Hiroshi Nishizawa , Touichi Sakata , Yoshiyuki Mukoyama
发明人： Hiroshi Nishizawa , Touichi Sakata , Yoshiyuki Mukoyama
IPC分类号： C08L77/00 , C08G73/14 , C08J3/09 , C08L79/08 , C08K5/15
CPC分类号： C08J3/095 , C08G73/14 , C08J2379/08
摘要： A polyetheramide-imide polymer composition comprising an aromatic polyetheramide-imide polymer obtained by reacting trimellitic acid or a derivative thereof with a special aromatic diamine having ether linkages, and an ether compound and/or an alicyclic ketone compound as a solvent is excellent in film-forming properties at low temperatures.
摘要翻译：包含通过偏苯三酸或其衍生物与具有醚键的特殊芳族二胺反应获得的芳族聚醚酰胺 - 酰亚胺聚合物和醚化合物和/或脂环族酮化合物作为溶剂获得的聚醚酰胺 - 酰亚胺聚合物组合物具有优异的膜 - 在低温下形成性能。

9. 发明授权

US5164816A Integrated circuit device produced with a resin layer produced from a heat-resistant resin paste 失效
标题翻译：由耐热树脂浆料制成的树脂层制成的集成电路装置
公开(公告)号：US5164816A
公开(公告)日：1992-11-17
申请号：US739829
申请日：1991-08-02
申请人： Hiroshi Nishizawa , Kenji Suzuki , Yoshiyuki Mukoyama , Tohru Kikuchi , Hidetaka Sato
发明人： Hiroshi Nishizawa , Kenji Suzuki , Yoshiyuki Mukoyama , Tohru Kikuchi , Hidetaka Sato
IPC分类号： H01B3/30 , H01L23/29 , H01L23/31 , H01L23/498 , H01L23/532 , H05K1/00 , H05K3/28 , H05K3/46
CPC分类号： H01B3/303 , H01L23/293 , H01L23/3135 , H01L23/49894 , H01L23/5329 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H05K3/285 , H05K3/4664 , H05K3/4676
摘要： An integrated circuit device wherein layer insulation is attained by at least one of (i) an insulator layer interposed between two adjacent conductor layers, and (ii) a surface protecting layer fixedly covering the surface of the semiconductor chip, each of the insulator layer and the surface protecting layer being made of a heat-resistant resin obtainable by heating a heat-resistant resin paste. Said paste consists essentially of a first organic liquid, a second organic liquid, a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting of the first organic liquid and the second organic liquid, and fine particles of a heat-resistant resin (C) which is soluble in the first organic liquid but insoluble in the second organic liquid. The first organic liquid, the second organic liquid and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed.
摘要翻译：一种集成电路器件，其中通过以下中的至少一个获得层间绝缘：（i）插入在两个相邻的导体层之间的绝缘体层，以及（ii）固定地覆盖半导体芯片的表面的表面保护层，绝缘体层和表面保护层由耐热树脂浆料加热得到的耐热树脂制成。所述糊基本上由第一有机液体，第二有机液体，可溶于由第一有机液体和第二有机液体组成的有机液体混合物中的耐热树脂（B）可溶于第一有机液体但不溶于第二有机液体的耐热树脂（C）。将第一有机液体，第二有机液体和耐热性树脂（B）置于分散有耐热性树脂（C）的微粒子的溶液中。

10. 发明授权

US5037862A Polyamide-imide resin pastes 失效
标题翻译：聚酰胺酰亚胺树脂浆料
公开(公告)号：US5037862A
公开(公告)日：1991-08-06
申请号：US204190
申请日：1988-06-08
申请人： Hiroshi Nishizawa , Kenji Suzuki , Yoshiyuki Mukoyama
发明人： Hiroshi Nishizawa , Kenji Suzuki , Yoshiyuki Mukoyama
IPC分类号： C08J3/09 , C08L79/08 , C09D11/10 , H05K1/00 , H05K1/03
CPC分类号： C08J3/091 , C08L79/08 , C09D11/102 , C08J2379/08 , H05K1/0346 , H05K1/0373 , H05K3/4676
摘要： Disclosed is a polyamide-imide resin paste which comprises polyamide-imide resin solution dissolved in a non-nitrogen-containing solvent, wherein resin fine particles are dispersed in the solution in an amount of 1 to 50% by weight relative to the resulting polyamide-imide resin paste.According to the present invention, there can be provided a paste which does not cause any clogging of screen due to adhesion of the paste even in repeated printings over a long period of time and shows an excellent mechanical stability of a paste in printing.
摘要翻译：公开了一种聚酰胺酰亚胺树脂浆料，其包含溶解在不含氮的溶剂中的聚酰胺 - 酰亚胺树脂溶液，其中树脂细颗粒相对于所得的聚酰胺 - 酰亚胺树脂浆以1至50重量％的量分散在溶液中，酰亚胺树脂糊。根据本发明，可以提供一种糊剂，即使在长时间的反复印刷中也不会由于糊剂的粘附而导致屏幕堵塞，并且在印刷中显示出优异的糊剂的机械稳定性。

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