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1. 发明申请

US20130098102A1 HEAT PUMP SYSTEM 有权
标题翻译：热泵系统
公开(公告)号：US20130098102A1
公开(公告)日：2013-04-25
申请号：US13807710
申请日：2011-07-13
申请人： Hiroshi Nakayama , Shuji Fujimoto
发明人： Hiroshi Nakayama , Shuji Fujimoto
IPC分类号： F25B30/02
CPC分类号： F25B30/02 , F24D3/18 , F24D17/02 , F24D19/1054 , F24D19/1087 , F25B1/10 , F25B40/00 , F25B2339/047 , F25B2400/072 , F25B2400/13
摘要： A heat pump system includes a heat pump circuit, a load distribution element, and a controller. The heat pump circuit includes low-stage and high-stage compression mechanisms having a fixed capacity ratio relationship. The load distribution element establishes a load distribution between first and second heat loads subjected to heating processes by heat exchange with refrigerant discharged from the low-stage and high-stage compression mechanisms, respectively. The controller performs distribution control to maintain a ratio of 1 between temperatures of the refrigerant discharged from the low-stage and high stage compression mechanisms and after heat exchange with the first and second heat loads, respectively. Alternatively, the controller performs distribution control to reduce a difference between the temperatures of the refrigerant discharged from the low-stage and high stage compression mechanisms and after heat exchange with the first and second heat loads, respectively.
摘要翻译：热泵系统包括热泵回路，负荷分配元件和控制器。热泵电路包括具有固定容量比关系的低级和高级压缩机构。负载分配元件通过与从低级和高级压缩机构排出的制冷剂进行热交换而分别在经受加热过程的第一和第二热负荷之间建立负载分布。控制器执行分配控制以分别保持从低级和高级压缩机构排出的制冷剂的温度与第一和第二热负荷热交换之后的温度之比1。或者，控制器执行分配控制，以分别减少从低级和高级压缩机构排出的制冷剂的温度与第一和第二热负荷热交换之后的温度差。

2. 发明授权

US09360241B2 Heat pump system 有权
标题翻译：热泵系统
公开(公告)号：US09360241B2
公开(公告)日：2016-06-07
申请号：US13807710
申请日：2011-07-13
申请人： Hiroshi Nakayama , Shuji Fujimoto
发明人： Hiroshi Nakayama , Shuji Fujimoto
IPC分类号： F25B30/02 , F25B1/10 , F24D17/02 , F24D3/18 , F25B40/00 , F24D19/10
CPC分类号： F25B30/02 , F24D3/18 , F24D17/02 , F24D19/1054 , F24D19/1087 , F25B1/10 , F25B40/00 , F25B2339/047 , F25B2400/072 , F25B2400/13
摘要： A heat pump system includes a heat pump circuit, a load distribution element, and a controller. The heat pump circuit includes low-stage and high-stage compression mechanisms having a fixed capacity ratio relationship. The load distribution element establishes a load distribution between first and second heat loads subjected to heating processes by heat exchange with refrigerant discharged from the low-stage and high-stage compression mechanisms, respectively. The controller performs distribution control to maintain a ratio of 1 between temperatures of the refrigerant discharged from the low-stage and high stage compression mechanisms and after heat exchange with the first and second heat loads, respectively. Alternatively, the controller performs distribution control to reduce a difference between the temperatures of the refrigerant discharged from the low-stage and high stage compression mechanisms and after heat exchange with the first and second heat loads, respectively.
摘要翻译：热泵系统包括热泵回路，负荷分配元件和控制器。热泵电路包括具有固定容量比关系的低级和高级压缩机构。负载分配元件通过与从低级和高级压缩机构排出的制冷剂进行热交换而分别在经受加热过程的第一和第二热负荷之间建立负载分布。控制器执行分配控制以分别保持从低级和高级压缩机构排出的制冷剂的温度与第一和第二热负荷热交换之后的温度之比1。或者，控制器执行分配控制，以分别减少从低级和高级压缩机构排出的制冷剂的温度与第一和第二热负荷热交换之后的温度差。

3. 发明授权

US09157654B2 Heat pump system 有权
标题翻译：热泵系统
公开(公告)号：US09157654B2
公开(公告)日：2015-10-13
申请号：US13807589
申请日：2011-07-12
申请人： Hiroshi Nakayama , Shuji Fujimoto
发明人： Hiroshi Nakayama , Shuji Fujimoto
IPC分类号： F24H4/02 , F24D11/02 , F25B1/10 , F25B30/02 , F25B40/00 , F24D17/02 , F24D19/10 , F24D3/18
CPC分类号： F24H4/02 , F24D3/18 , F24D11/0214 , F24D17/02 , F24D19/1039 , F24D19/1054 , F24D19/1087 , F25B1/10 , F25B30/02 , F25B40/00 , F25B2309/06 , F25B2309/061 , F25B2339/047 , F25B2400/072 , F25B2400/13 , Y02B30/12 , Y02B30/125
摘要： A heat pump system includes a heat pump circuit, a heat load circuit, first and second heat exchangers, a flow rate regulation mechanism and a controller. A first passage connects branching and converging portions of the heat load circuit. A second passage connects the branching and converging portions without converging with the first passage. The first and second heat exchanger perform heat exchange between discharge refrigerant from the low and high stage compression mechanisms and fluid in the first and second passages, respectively. The flow rate regulation mechanism regulates a ratio between flow rates through the first and second passages. The controller controls the flow rate regulation mechanism so that the fluid is allowed to flow to the first heat exchanger when a temperature of refrigerant flowing into the first heat exchanger is lower than a heating target temperature of converged fluid flowing through the heat load circuit.
摘要翻译：热泵系统包括热泵回路，热负荷回路，第一和第二热交换器，流量调节机构和控制器。第一通道连接热负荷电路的分支和会聚部分。第二通道连接分支和会聚部分而不与第一通道收敛。第一和第二热交换器分别执行来自低阶段和高阶段压缩机构的排出制冷剂与第一和第二通道中的流体之间的热交换。流量调节机构调节通过第一和第二通道的流速之间的比率。控制器控制流量调节机构，使得当流入第一热交换器的制冷剂的温度低于流过热负荷回路的会聚流体的加热目标温度时允许流体流向第一热交换器。

4. 发明申请

US20130098096A1 HEAT PUMP SYSTEM 有权
标题翻译：热泵系统
公开(公告)号：US20130098096A1
公开(公告)日：2013-04-25
申请号：US13807589
申请日：2011-07-12
申请人： Hiroshi Nakayama , Shuji Fujimoto
发明人： Hiroshi Nakayama , Shuji Fujimoto
IPC分类号： F24H4/02 , F25B30/02
CPC分类号： F24H4/02 , F24D3/18 , F24D11/0214 , F24D17/02 , F24D19/1039 , F24D19/1054 , F24D19/1087 , F25B1/10 , F25B30/02 , F25B40/00 , F25B2309/06 , F25B2309/061 , F25B2339/047 , F25B2400/072 , F25B2400/13 , Y02B30/12 , Y02B30/125
摘要： A heat pump system includes a heat pump circuit, a heat load circuit, first and second heat exchangers, a flow rate regulation mechanism and a controller. A first passage connects branching and converging portions of the heat load circuit. A second passage connects the branching and converging portions without converging with the first passage. The first and second heat exchanger perform heat exchange between discharge refrigerant from the low and high stage compression mechanisms and fluid in the first and second passages, respectively. The flow rate regulation mechanism regulates a ratio between flow rates through the first and second passages. The controller controls the flow rate regulation mechanism so that the fluid is allowed to flow to the first heat exchanger when a temperature of refrigerant flowing into the first heat exchanger is lower than a heating target temperature of converged fluid flowing through the heat load circuit.
摘要翻译：热泵系统包括热泵回路，热负荷回路，第一和第二热交换器，流量调节机构和控制器。第一通道连接热负荷电路的分支和会聚部分。第二通道连接分支和会聚部分而不与第一通道收敛。第一和第二热交换器分别执行来自低阶段和高阶段压缩机构的排出制冷剂与第一和第二通道中的流体之间的热交换。流量调节机构调节通过第一和第二通道的流速之间的比率。控制器控制流量调节机构，使得当流入第一热交换器的制冷剂的温度低于流过热负荷回路的会聚流体的加热目标温度时允许流体流向第一热交换器。

5. 发明授权

US08631152B2 System and method for data packet transmission and reception 失效
标题翻译：数据包发送和接收的系统和方法
公开(公告)号：US08631152B2
公开(公告)日：2014-01-14
申请号：US12385885
申请日：2009-04-22
申请人： Hidekazu Osano , Hiroshi Nakayama
发明人： Hidekazu Osano , Hiroshi Nakayama
IPC分类号： G06F15/16
CPC分类号： G06F13/387
摘要： A system transmits a data packet from a transmitting apparatus to a receiving apparatus. The receiving apparatus includes a receive buffer, and a size specifying information transmitting unit that transmits size specifying information to the transmitting apparatus. The transmitting apparatus includes a transmit buffer, a credit storage unit that stores, as a credit, a value corresponding to a total size of all data packets stored in the receive buffer, a credit adding unit that adds a credit to the stored credit on transmitting a data packet, a credit subtracting unit that specifies a size of a read-out data packet on receiving the size specifying information, subtracts a credit corresponding to the specified size from a stored credit, and a transmission controlling unit that controls data packet transmission based on a credit stored in the credit storage unit.
摘要翻译：系统将数据分组从发送装置发送到接收装置。接收装置包括接收缓冲器和向发送装置发送大小指定信息的大小指定信息发送单元。发送装置包括发送缓冲器，信用存储单元，作为信用存储对应于存储在接收缓冲器中的所有数据分组的总大小的值;信用增加单元，用于向所发送的存储信用增加信用数据分组，信用减除单元，其在接收到大小指定信息时指定读出数据分组的大小，从存储的积分中减去与规定大小相对应的信用，以及控制数据分组发送的发送控制部，存储在信用存储单元中的信用。

6. 发明授权

US08312340B2 Information processing device, data transmitting device, and data transfer method of data transmitting device 失效
标题翻译：数据发送装置的信息处理装置，数据发送装置以及数据传送方法
公开(公告)号：US08312340B2
公开(公告)日：2012-11-13
申请号：US12926690
申请日：2010-12-03
申请人： Shintaro Itozawa , Hiroshi Nakayama , Junji Ichimiya
发明人： Shintaro Itozawa , Hiroshi Nakayama , Junji Ichimiya
IPC分类号： H03M13/00 , H04L1/18
CPC分类号： H04L1/007 , G06F11/0724 , G06F11/0763 , H04L1/0009 , H04L1/0057 , H04L25/14
摘要： A selection-signal generating circuit in an LSI being a transmission-side LSI, when a transmission error is detected on an A-side signal line and degeneration control is performed thereon, instructs a selector to select an input from an ECC generator in order to transmit data and ECC data for this data to be transmitted via the B-side signal line, via the A-side signal line. In this manner, the degenerated signal line is used to transmit the ECC data for transmission data to be transmitted via a signal line which is not degenerated.
摘要翻译：作为发送侧LSI的LSI中的选择信号生成电路，当在A侧信号线上检测到发送错误并进行退化控制时，指示选择器从ECC发生器选择输入，以便通过A侧信号线经由B侧信号线发送该数据的数据和ECC数据。以这种方式，退化的信号线用于发送经由不退化的信号线发送的发送数据的ECC数据。

7. 发明授权

US08218991B2 Fixing device for image forming apparatus 有权
标题翻译：成像装置用固定装置
公开(公告)号：US08218991B2
公开(公告)日：2012-07-10
申请号：US11942085
申请日：2007-11-19
申请人： Hiroshi Nakayama , Yohei Doi , Tetsuo Kitamura , Osamu Takagi , Satoshi Kinouchi , Yoshinori Tsueda , Kazuhiko Kikuchi , Masanori Takai , Toyoyasu Kusaka , Toshihiro Sone
发明人： Hiroshi Nakayama , Yohei Doi , Tetsuo Kitamura , Osamu Takagi , Satoshi Kinouchi , Yoshinori Tsueda , Kazuhiko Kikuchi , Masanori Takai , Toyoyasu Kusaka , Toshihiro Sone
IPC分类号： G03G15/20
CPC分类号： G03G15/5004 , G03G15/2039
摘要： A fixing device according to an embodiment of the present invention heats a metal conductive layer of a heat roller using an induction current generating coil. In order to supplement a heat capacity of the heat roller, a press roller having a large heat capacity is heated by a halogen lamp. During a start of activation of an image forming apparatus, when a printer control circuit is started, the supply of electric power to the halogen lamp is started before warming-up is started.
摘要翻译：根据本发明实施例的定影装置使用感应电流产生线圈加热加热辊的金属导电层。为了补充热辊的热容量，具有大的热容量的压辊通过卤素灯加热。在图像形成装置的启动开始时，当打印机控制电路启动时，在开始加热之前开始向卤素灯供电。

8. 发明授权

US08159251B2 Probe card for semiconductor wafer 有权
标题翻译：半导体晶圆探头卡
公开(公告)号：US08159251B2
公开(公告)日：2012-04-17
申请号：US12801790
申请日：2010-06-25
申请人： Shunsuke Sasaki , Hiroshi Nakayama
发明人： Shunsuke Sasaki , Hiroshi Nakayama
IPC分类号： G01R31/00
CPC分类号： G01R1/07314 , G01R1/44
摘要： A probe card includes a plurality of probes that contacts a plurality of electrodes provided in the semiconductor wafer and that inputs or outputs an electrical signal in or from the electrodes, a probe head that holds the probes, a substrate having a wiring which is provided near the surface of the substrate facing the probe head so as to be contactable with the probe head and is connected to the probes, a core layer formed of a material which is buried in the substrate and has a coefficient of thermal expansion lower than that of the substrate, and a connecting member that electrically connects at least some of the probes with an external device via the wiring.
摘要翻译：探针卡包括接触设置在半导体晶片中的多个电极并且在电极内或从电极输入或输出电信号的多个探针，保持探针的探针头，具有接近设置的布线的基板所述基板的表面面向所述探针头，以便能够与所述探针头接触，并且与所述探针相连接，所述芯层由掩埋在所述基板中的材料形成，并且具有低于所述探针的热膨胀系数基板和连接构件，其通过布线将至少一些探针与外部装置电连接。

9. 发明授权

US08149008B2 Probe card electrically connectable with a semiconductor wafer 有权
标题翻译：探针卡可与半导体晶圆电连接
公开(公告)号：US08149008B2
公开(公告)日：2012-04-03
申请号：US12452716
申请日：2008-07-16
申请人： Yoshio Yamada , Hiroshi Nakayama , Tsuyoshi Inuma , Takashi Akao
发明人： Yoshio Yamada , Hiroshi Nakayama , Tsuyoshi Inuma , Takashi Akao
IPC分类号： G01R31/20
CPC分类号： G01R31/2891 , G01R1/06722 , G01R1/07371
摘要： A probe card includes a probe head that holds a plurality of probes; a flat wiring board that has a wiring pattern corresponding to a circuit structure; an interposer that is stacked on the wiring board and relays wirings of the wiring board; a space transformer that is placed between the interposer and the probe head, transforms a space between the wirings relayed by the interposer, and leads the transformed wirings out to a surface facing the probe head; and a plurality of post members that are formed in a substantially columnar shape with a height larger than a sum of a thickness of the wiring board and a thickness of the interposer, and embedded to pierce through the wiring board and the interposer in a thickness direction such that one of end surfaces of each post member comes into contact with the space transformer.
摘要翻译：探针卡包括保持多个探针的探针头; 具有对应于电路结构的布线图案的扁平布线板; 叠层在所述布线板上并且中继所述布线板的布线的插入件; 放置在插入器和探针头之间的空间变换器，变换由插入器中继的布线之间的空间，并将变换的布线引导到面向探头的表面; 以及多个柱状部件，其形成为高度大于布线板的厚度和插入件的厚度的总和的大致柱状，并且嵌入以穿过布线板和插入件在厚度方向上穿透使得每个柱构件的端面中的一个与空间变压器接触。

10. 发明授权

US08149006B2 Probe card 有权
标题翻译：探针卡
公开(公告)号：US08149006B2
公开(公告)日：2012-04-03
申请号：US12086008
申请日：2006-12-04
申请人： Hiroshi Nakayama , Mitsuhiro Nagaya , Yoshio Yamada
发明人： Hiroshi Nakayama , Mitsuhiro Nagaya , Yoshio Yamada
IPC分类号： G01R31/20
CPC分类号： G01R31/2889 , G01R1/07371
摘要： A probe card includes probes that come into contact with a semiconductor wafer to receive or output an electric signal; a probe head that holds the probes; a substrate that has a wiring pattern corresponding to a circuit structure for generating a signal for a test; a reinforcing member that reinforces the substrate; an interposer that is stacked on the substrate and includes a housing having connection terminals resilient in an axial direction thereof and hole portions each housing one of the connection terminals; and a space transformer that is stacked between the interposer and the probe head and transforms intervals among the wires.
摘要翻译：探针卡包括与半导体晶片接触以接收或输出电信号的探针; 保持探头的探针头; 具有对应于用于产生测试信号的电路结构的布线图案的基板; 加强基板的加强构件; 中间层，其堆叠在所述基板上并且包括具有沿其轴向弹性的连接端子的壳体和各自容纳所述连接端子中的一个的孔部; 以及堆叠在插入件和探针头之间的空间变换器，并且在电线之间变换间隔。

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