会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • Probe Card
    • 探头卡
    • US20090219043A1
    • 2009-09-03
    • US12086031
    • 2006-12-04
    • Hiroshi NakayamaMitsuhiro NagayaYoshio Yamada
    • Hiroshi NakayamaMitsuhiro NagayaYoshio Yamada
    • G01R1/073
    • G01R31/2889G01R1/07378
    • A probe card includes probes that are made of a conductive material and come into contact with a semiconductor wafer to receive or output an electric signal; a probe head that holds the probes; a substrate that has a wiring pattern corresponding to a circuit structure for generating a signal for a test; a reinforcing member that reinforces the substrate; an interposer that is stacked on the substrate for connection of wires of the substrate; a space transformer that is stacked between the interposer and the probe head and transforms intervals among the wires; and a plurality of first post members that have a height greater than the thickness of the substrate, and are embedded in a portion of the substrate on which the interposer is stacked.
    • 探针卡包括由导电材料制成并与半导体晶片接触以接收或输出电信号的探针; 保持探头的探针头; 具有对应于用于产生测试信号的电路结构的布线图案的基板; 增强基板的加强构件; 叠置在基板上用于连接基板的导线的插入件; 空间变换器,堆叠在插入器和探头之间,并且变换线间的间隔; 以及具有高于基板的厚度的高度的多个第一柱状构件,并且嵌入在其上堆叠有插入件的基板的一部分中。
    • 2. 发明授权
    • Parallelism adjusting mechanism of probe card
    • 探针卡并联调整机构
    • US08049525B2
    • 2011-11-01
    • US12309825
    • 2007-07-26
    • Yoshio YamadaHiroshi NakayamaMitsuhiro NagayaTsuyoshi InumaTakashi Akao
    • Yoshio YamadaHiroshi NakayamaMitsuhiro NagayaTsuyoshi InumaTakashi Akao
    • G01R31/20
    • G01R31/2891G01R1/07307
    • A parallelism adjusting mechanism of a probe card is provided. The parallelism adjusting mechanism can bring probes held by a probe card into uniform contact with a wafer even if a parallelism between a mounting reference surface for the probe card and the wafer as a test object is lost. To achieve this purpose, specifically, to adjust a parallelism of a probe card (101) that holds a plurality of probes (1) for electrically connecting a wafer (31) as a test object and a circuitry for generating a signal for a test with respect to the wafer (31), adjusting screws (22) as at least part of an inclination changing unit are provided. The inclination changing unit changes a degree of inclination of the probe card (101) with respect to a mounting reference surface (S1) of a prober (202) for mounting the probe card (101) thereon.
    • 提供探针卡的平行度调节机构。 即使在用于探针卡的安装参考表面和作为测试对象的晶片之间的平行度被丢失的情况下,平行度调节机构也可以使由探针卡保持的探针与晶片均匀接触。 为了实现该目的,具体地说,为了调整保持用于电连接作为测试对象的晶片(31)的多个探针(1)的探针卡(101)的平行度和用于产生测试信号的电路, 相对于晶片(31),设置有作为倾斜改变单元的至少一部分的调节螺钉(22)。 倾斜改变单元改变探针卡(101)相对于其上安装探针卡(101)的探测器(202)的安装基准表面(S1)的倾斜程度。
    • 3. 发明申请
    • PARALLELISM ADJUSTING MECHANISM OF PROBE CARD
    • 探索和平机制调查机制
    • US20100001752A1
    • 2010-01-07
    • US12309825
    • 2007-07-26
    • Yoshio YamadaHiroshi NakayamaMitsuhiro NagayaTsuyoshi InumaTakashi Akao
    • Yoshio YamadaHiroshi NakayamaMitsuhiro NagayaTsuyoshi InumaTakashi Akao
    • G01R31/02G01R1/06
    • G01R31/2891G01R1/07307
    • A parallelism adjusting mechanism of a probe card is provided. The parallelism adjusting mechanism can bring probes held by a probe card into uniform contact with a wafer even if a parallelism between a mounting reference surface for the probe card and the wafer as a test object is lost. To achieve this purpose, specifically, to adjust a parallelism of a probe card (101) that holds a plurality of probes (1) for electrically connecting a wafer (31) as a test object and a circuitry for generating a signal for a test with respect to the wafer (31), adjusting screws (22) as at least part of an inclination changing unit are provided. The inclination changing unit changes a degree of inclination of the probe card (101) with respect to a mounting reference surface (S1) of a prober (202) for mounting the probe card (101) thereon.
    • 提供探针卡的平行度调节机构。 即使在用于探针卡的安装参考表面和作为测试对象的晶片之间的平行度被丢失的情况下,平行度调节机构也可以使由探针卡保持的探针与晶片均匀接触。 为了实现该目的,具体地说,为了调整保持用于电连接作为测试对象的晶片(31)的多个探针(1)的探针卡(101)的平行度和用于产生测试信号的电路, 相对于晶片(31),设置有作为倾斜改变单元的至少一部分的调节螺钉(22)。 倾斜改变单元改变探针卡(101)相对于其上安装探针卡(101)的探测器(202)的安装基准表面(S1)的倾斜程度。
    • 5. 发明授权
    • Probe card
    • 探针卡
    • US08149006B2
    • 2012-04-03
    • US12086008
    • 2006-12-04
    • Hiroshi NakayamaMitsuhiro NagayaYoshio Yamada
    • Hiroshi NakayamaMitsuhiro NagayaYoshio Yamada
    • G01R31/20
    • G01R31/2889G01R1/07371
    • A probe card includes probes that come into contact with a semiconductor wafer to receive or output an electric signal; a probe head that holds the probes; a substrate that has a wiring pattern corresponding to a circuit structure for generating a signal for a test; a reinforcing member that reinforces the substrate; an interposer that is stacked on the substrate and includes a housing having connection terminals resilient in an axial direction thereof and hole portions each housing one of the connection terminals; and a space transformer that is stacked between the interposer and the probe head and transforms intervals among the wires.
    • 探针卡包括与半导体晶片接触以接收或输出电信号的探针; 保持探头的探针头; 具有对应于用于产生测试信号的电路结构的布线图案的基板; 加强基板的加强构件; 中间层,其堆叠在所述基板上并且包括具有沿其轴向弹性的连接端子的壳体和各自容纳所述连接端子中的一个的孔部; 以及堆叠在插入件和探针头之间的空间变换器,并且在电线之间变换间隔。
    • 9. 发明授权
    • Probe card
    • 探针卡
    • US08018242B2
    • 2011-09-13
    • US12086031
    • 2006-12-04
    • Hiroshi NakayamaMitsuhiro NagayaYoshio Yamada
    • Hiroshi NakayamaMitsuhiro NagayaYoshio Yamada
    • G01R1/00
    • G01R31/2889G01R1/07378
    • A probe card includes probes that are made of a conductive material and come into contact with a semiconductor wafer to receive or output an electric signal; a probe head that holds the probes; a substrate that has a wiring pattern corresponding to a circuit structure for generating a signal for a test; a reinforcing member that reinforces the substrate; an interposer that is stacked on the substrate for connection of wires of the substrate; a space transformer that is stacked between the interposer and the probe head and transforms intervals among the wires; and a plurality of first post members that have a height greater than the thickness of the substrate, and are embedded in a portion of the substrate on which the interposer is stacked.
    • 探针卡包括由导电材料制成并与半导体晶片接触以接收或输出电信号的探针; 保持探头的探针头; 具有对应于用于产生测试信号的电路结构的布线图案的基板; 加强基板的加强构件; 叠置在基板上用于连接基板的导线的插入件; 空间变换器,堆叠在插入器和探头之间,并且变换线间的间隔; 以及具有高于基板的厚度的高度的多个第一柱状构件,并且嵌入在其上堆叠有插入件的基板的一部分中。
    • 10. 发明授权
    • Probe card
    • 探针卡
    • US07795892B2
    • 2010-09-14
    • US12087244
    • 2006-12-20
    • Yoshio YamadaHiroshi NakayamaMitsuhiro NagayaShogo Imuta
    • Yoshio YamadaHiroshi NakayamaMitsuhiro NagayaShogo Imuta
    • G01R31/02
    • G01R1/07378G01R1/44G01R31/2863G01R31/2874
    • Provided is a probe card capable of surely bringing probes into contact with a contact object regardless of a temperature environment of a test. To achieve the object, the probe card includes a plurality of probes that are made of a conductive material and come into contact with electrode pads of a semiconductor wafer to input or output an electric signal; a probe head that houses and holds the probes; a substrate that has a wiring pattern corresponding to the circuitry; and a space transformer that is stacked on the probe head, changes a space of the wiring pattern of the substrate and thus relays wires, and has electrode pads provided on a surface on a side opposed to the probe head in association with the relayed wires. Both ends of the probes come into contact with portions near the centers of the electrodes pads of the semiconductor wafer and the space transformer under an environment having an average temperature of a lowest temperature and a highest temperature in testing the semiconductor wafer.
    • 提供了一种探针卡,其能够确保使探针与接触物体接触,而与测试的温度环境无关。 为了实现该目的,探针卡包括由导电材料制成并与半导体晶片的电极焊盘接触以输入或输出电信号的多个探针; 探针头,用于容纳和保持探针; 具有对应于所述电路的布线图案的基板; 以及堆叠在探头上的空间变换器,改变基板的布线图案的空间,从而中继线,并且与中继线相关联地具有设置在与探头相对的一侧的表面上的电极焊盘。 在半导体晶片的测试中,在具有最低温度和最高温度的平均温度的环境下,探针的两端与半导体晶片和空间变换器的电极焊盘的中心附近的部分接触。