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    • 2. 发明授权
    • Light emitting diode unit
    • 发光二极管单元
    • US07560748B2
    • 2009-07-14
    • US11589282
    • 2006-10-30
    • Mitsunori IshizakaKoichi FukasawaSadato Imai
    • Mitsunori IshizakaKoichi FukasawaSadato Imai
    • H01L29/22H01L29/24
    • H01L33/641F21K9/00H01L25/0753H01L33/58H01L33/62H01L2224/45144H01L2224/48091H01L2924/10253H01L2924/00014H01L2924/00
    • A light emitting diode unit including a base (100) made of anodized aluminum and a printed board (101) attached to the base (100) and the printed board (101) including a predetermined conductive pattern (102) and an opening (101a) having an area for die-bonding at least one LED chip (113) to the base (100) through a transparent paste, an upper electrode of the at least one LED chip being wire-bonded to a conductive pattern (102) provided on the printed board (101) through a gold line (110), and a lens member (105) including at least two sealing resin-injection holes (106c) and being attached to the printed board (101) to form a space surrounding the at least one LED chip on the base, and the space being filled with the sealing resin by way of the resin-injection holes (106c) to seal the at least one LED chip.
    • 一种发光二极管单元,包括由阳极化铝制成的基座(100)和附接到基座(100)的印刷电路板(101)和包括预定导电图案(102)和开口(101a)的印刷电路板(101) 具有通过透明浆料将至少一个LED芯片(113)芯片接合到基座(100)的区域,所述至少一个LED芯片的上电极被引线接合到设置在所述基板上的导电图案(102) 通过金线(110)的印刷电路板(101)和包括至少两个密封树脂注入孔(106c)的透镜构件(105),并附接到印刷电路板(101)上以形成至少围绕该空间的空间 一个LED芯片,并且通过树脂注入孔(106c)填充密封树脂的空间以密封至少一个LED芯片。
    • 3. 发明申请
    • Light emitting diode unit
    • 发光二极管单元
    • US20070102722A1
    • 2007-05-10
    • US11589282
    • 2006-10-30
    • Mitsunori IshizakaKoichi FukasawaSadato Imai
    • Mitsunori IshizakaKoichi FukasawaSadato Imai
    • H01L33/00
    • H01L33/641F21K9/00H01L25/0753H01L33/58H01L33/62H01L2224/45144H01L2224/48091H01L2924/10253H01L2924/00014H01L2924/00
    • A light emitting diode unit including a base (100) made of anodized aluminum and a printed board (101) attached to the base (100) and the printed board (101) including a predetermined conductive pattern (102) and an opening (101a) having an area for die-bonding at least one LED chip (113) to the base (100) through a transparent paste, an upper electrode of the at least one LED chip being wire-bonded to a conductive pattern (102) provided on the printed board (101) through a gold line (110), and a lens member (105) including at least two sealing resin-injection holes (106c) and being attached to the printed board (101) to form a space surrounding the at least one LED chip on the base, and the space being filled with the sealing resin by way of the resin-injection holes (106c) to seal the at least one LED chip.
    • 一种发光二极管单元,包括由阳极氧化铝制成的基座(100)和附接到基座(100)的印刷电路板(101)和包括预定导电图案(102)的印刷电路板(101) )具有通过透明浆料将至少一个LED芯片(113)芯片接合到基座(100)的区域,所述至少一个LED芯片的上电极被引线接合到设置在所述导体图案(102)上的导电图案 通过金线(110)的印刷电路板(101)和包括至少两个密封树脂注入孔(106c)的透镜构件(105),并附接到印刷电路板(101),以形成围绕 至少一个LED芯片,并且该空间通过树脂注入孔(106c)填充密封树脂以密封至少一个LED芯片。