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    • 2. 发明授权
    • Semiconductor device
    • 半导体器件
    • US06897523B2
    • 2005-05-24
    • US10211705
    • 2002-08-05
    • Shuichi UenoHaruo FurutaShigehiro KugeHiroshi Kato
    • Shuichi UenoHaruo FurutaShigehiro KugeHiroshi Kato
    • H01L29/78H01L29/792H01L29/861H01L29/788H01L21/336
    • H01L29/792H01L29/8616
    • A semiconductor device is provided which includes a diode formed of a MISFET and having a current-voltage characteristic close to that of an ideal diode. Negatively charged particles (e.g. electrons: 8a) are trapped on the drain region (2) side of a silicon nitride film (4b) sandwiched between films of silicon oxide (4a, 4c). When a bias voltage is applied between the drain and source with the negatively charged particles (8a) thus trapped and in-channel charged particles (9a) induced by them, the MISFET exhibits different threshold values for channel formation depending on whether it is a forward bias or a reverse bias. That is to say, when a reverse bias is applied, the channel forms insufficiently and the source-drain current is less likely to flow, while the channel forms sufficiently and a large source-drain current flows when a forward bias is applied. This offers a current-voltage characteristic close to that of the ideal diode.
    • 提供一种半导体器件,其包括由MISFET形成的二极管,其具有接近于理想二极管的电流 - 电压特性。 负电粒子(例如电子:8a)被捕获在夹在氧化硅(4a,4c)的膜之间的氮化硅膜(4b)的漏极区(2)侧上。 当在漏极和源极之间施加偏置电压时,带负电荷的颗粒(8a)被这样捕获并且由它们引起的通道内带电粒子(9a),MISFET对通道形成具有不同的阈值,取决于它是否是 正向偏压或反向偏压。 也就是说,当施加反向偏压时,沟道形成不充分,并且源极 - 漏极电流不太可能流动,而沟道形成充分,并且当施加正向偏压时流过大的源极 - 漏极电流。 这提供了接近理想二极管的电流电压特性。
    • 3. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US06731535B1
    • 2004-05-04
    • US10455523
    • 2003-06-06
    • Tsukasa OoishiShuichi UenoShigehiro Kuge
    • Tsukasa OoishiShuichi UenoShigehiro Kuge
    • G11C1114
    • H01L27/224G11C11/16H01L27/228
    • A nonvolatile semiconductor memory device includes a silicon substrate, bit lines, word lines, and memory cells. The bit line is positioned above the main surface of the silicon substrate and the word line is provided to intersect the bit line. The memory cell is positioned at a region where the bit line and the word line intersect and has one end electrically connected to the bit line and the other end electrically connected to the word line. The memory cell includes a TMR element and an access diode electrically connected in series. The access diode includes an n-type silicon layer and a p-type silicon layer recrystallized by melting-recrystallization and has a pn junction at the interface between the n-type silicon layer and the p-type silicon layer. As a result, a nonvolatile semiconductor memory device reduced in size and having high performance can be manufactured inexpensively.
    • 非易失性半导体存储器件包括硅衬底,位线,字线和存储单元。 位线位于硅衬底的主表面上方,并且字线被提供以与位线相交。 存储单元位于位线和字线相交的区域,并且其一端电连接到位线,另一端电连接到字线。 存储单元包括串联电连接的TMR元件和存取二极管。 存取二极管包括n型硅层和通过熔融重结晶重结晶的p型硅层,并且在n型硅层和p型硅层之间的界面处具有pn结。 结果,可以廉价地制造尺寸减小并且具有高性能的非易失性半导体存储器件。
    • 4. 发明授权
    • Method for manufacturing magnetic storage device and magnetic storage device
    • 磁存储装置和磁存储装置的制造方法
    • US08546151B2
    • 2013-10-01
    • US12528854
    • 2008-02-25
    • Haruo FurutaShuichi UenoRyoji MatsudaTatsuya FukumuraTakeharu KuroiwaLien-Chang WangEugene ChenYiming Huai
    • Haruo FurutaShuichi UenoRyoji MatsudaTatsuya FukumuraTakeharu KuroiwaLien-Chang WangEugene ChenYiming Huai
    • H01L21/00
    • H01L43/12B82Y10/00H01L27/228
    • Disclosed is a method for manufacturing a magnetic storage device comprising a TMR element, which comprises a step for forming an insulting film on an interlayer insulating film provided with a wiring layer, an opening formation step for forming an opening in the insulating film so that the wiring layer is exposed therefrom, a metal layer formation step for forming a metal layer on the insulating layer so that the opening is filled therewith, a CMP step for polishing and removing the metal layer on the insulating layer by a CMP method and forming the metal layer remaining in the opening into a lower electrode, and a step for forming a TMR element on the lower electrode. Also disclosed is a magnetic storage device comprising an interlayer insulating film provided with a wiring layer, an insulating film formed on the interlayer insulating film, an opening formed in the insulating film so that the wiring layer is exposed therefrom, a barrier metal layer provided so as to cover the inner surface of the opening, a lower electrode formed on the barrier metal so as to fill the opening, and a TMR element formed on the lower electrode.
    • 公开了一种制造包括TMR元件的磁存储装置的方法,该方法包括在具有布线层的层间绝缘膜上形成绝缘膜的步骤,用于在绝缘膜上形成开口的开口形成步骤, 布线层暴露于其中,金属层形成步骤用于在绝缘层上形成金属层以使其开口被填充; CMP步骤,用于通过CMP方法在绝缘层上抛光和去除金属层,并形成金属 剩余在开口中的层形成下电极,以及在下电极上形成TMR元件的步骤。 还公开了一种磁存储装置,其包括设置有布线层的层间绝缘膜,形成在层间绝缘膜上的绝缘膜,形成在绝缘膜中的开口,使得布线层暴露于其中,阻挡金属层设置为 为了覆盖开口的内表面,形成在阻挡金属上以便填充开口的下电极和形成在下电极上的TMR元件。
    • 7. 发明申请
    • EPOXY RESIN COMPOSITION, CURED OBJECT OBTAINED THEREFROM, AND LIGHT-EMITTING DIODE
    • 环氧树脂组合物,由其获得的固化对象和发光二极管
    • US20100193831A1
    • 2010-08-05
    • US12678166
    • 2008-09-22
    • Takashi SatoShuichi UenoTakeshi Koyama
    • Takashi SatoShuichi UenoTakeshi Koyama
    • H01L23/29C08L63/00C08K5/13
    • C08G59/24C08G59/226C08G59/42C08L63/00H01L33/56H01L51/5237H01L51/5246C08L2666/22
    • Provided are an epoxy resin composition including acid anhydrides (A) and epoxy resins (B), in which: (a) cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride accounts for 50 to 90 mass % of the acid anhydrides (A); (b) an alicyclic epoxy resin compound accounts for 30 to 90 mass % of the epoxy resins (B) and an epoxy resin compound represented by the following general formula (1) accounts for 10 to 50 mass % of the epoxy resins (B); and (c) contents of the acid anhydrides (A) and the epoxy resins (B) are such that a blending equivalent ratio between the acid anhydrides and the epoxy resins ranges from 0.4 to 0.7, a cured product of the composition, and a light-emitting diode. The epoxy resin composition has the following characteristics. That is, (1) the composition has a low viscosity after the mixing, a low degree of viscosity increase in standing at room temperature, and excellent workability, (2) the composition has satisfactory curability even when no curing accelerator is added, and (3) a cured product is colorless and transparent, has crack resistance, and changes its color to a small extent with long-term light irradiation and heating. The composition is suitable for an encapsulant for a photoelectric conversion element such as a blue LED or white LED. (In the formula, R's each independently represent a hydrogen atom or a methyl group, m represents an integer of 1 to 3, and n represents an integer of 2 to 8.)
    • 提供一种包含酸酐(A)和环氧树脂(B))的环氧树脂组合物,其中:(a)环己烷-1,2,4-三羧酸-1,2-酐占50〜90质量% 酸酐(A); (b)环氧树脂(B)的脂环族环氧树脂化合物占30〜90质量%,由通式(1)表示的环氧树脂化合物占环氧树脂(B)的10〜50质量% ; 和(c)酸酐(A)和环氧树脂(B)的含量使得酸酐与环氧树脂的混合当量比为0.4〜0.7,组合物的固化物和光 发光二极管。 环氧树脂组合物具有以下特征。 也就是说,(1)组合物在混合后具有低粘度,在室温下的静置粘度增加低,加工性优异,(2)即使不加入固化促进剂,组合物也具有令人满意的固化性,( 3)固化产物无色透明,具有抗裂性,并在长时间的光照射和加热下颜色变化很小。 该组合物适用于诸如蓝色LED或白色LED的光电转换元件的密封剂。 (式中,R 3各自独立地表示氢原子或甲基,m表示1〜3的整数,n表示2〜8的整数。)
    • 9. 发明申请
    • MAGNETIC MEMORY DEVICE
    • 磁记忆装置
    • US20090237989A1
    • 2009-09-24
    • US12476536
    • 2009-06-02
    • Yoshinori OKUMURAShuichi UenoHaruo Furuta
    • Yoshinori OKUMURAShuichi UenoHaruo Furuta
    • G11C11/14
    • H01L43/08B82Y10/00G11C11/15G11C11/1659G11C11/1675H01L27/228
    • A width and a thickness of a bit line are represented as W1 and T1, respectively, a thickness of a digit line is represented as T2, and a distance from a center of the digit line in a thickness direction to a center of a free layer of an MTJ element in the thickness direction is represented as L1. A width of the digit line is represented as W2, and a distance from a center of the bit line in the thickness direction to the center of the free layer of the MTJ element in the thickness direction is represented as L2. The distances L1 and L2 and the cross-sectional areas S1 and S2 are set in such a manner that when L1/L2≧1, a relation of (1/3)·(L1/L2)≦S2/S1≦1 is satisfied and when L1/L2≦1, a relation of 1≦S2/S1≦3(L1/L2) is satisfied.
    • 位线的宽度和厚度分别表示为W1和T1,数字线的厚度表示为T2,从数字线的中心到厚度方向的中心到自由层的中心的距离 的厚度方向上的MTJ元件表示为L1。 数字线的宽度表示为W2,从厚度方向的位线的中心到厚度方向的MTJ元件的自由层的中心的距离表示为L2。 距离L1和L2以及横截面积S1和S2以如下方式设定:当L1 / L2> = 1时,(1/3)(L1 / L2)<= S2 / S1 <= 1,并且当L1 / L2 <= 1时,满足1 <= S2 / S1 <= 3(L1 / L2)的关系。
    • 10. 发明申请
    • Magnetic memory device
    • 磁存储器件
    • US20080266939A1
    • 2008-10-30
    • US12213505
    • 2008-06-20
    • Yoshinori OkumuraShuichi UenoHaruo Furuta
    • Yoshinori OkumuraShuichi UenoHaruo Furuta
    • G11C11/02
    • H01L43/08B82Y10/00G11C11/15G11C11/1659G11C11/1675H01L27/228
    • A width and a thickness of a bit line are represented as W1 and T1, respectively, a thickness of a digit line is represented as T2, and a distance from a center of the digit line in a thickness direction to a center of a free layer of an MTJ element in the thickness direction is represented as L1. A width of the digit line is represented as W2, and a distance from a center of the bit line in the thickness direction to the center of the free layer of the MTJ element in the thickness direction is represented as L2. The distances L1 and L2 and the cross-sectional areas S1 and S2 are set in such a manner that when L1/L2≧1, a relation of (⅓)·(L1/L2)≦S2/S1≦1 is satisfied and when L1/L2≦1, a relation of 1≦S2/S1≦3(L1/L2) is satisfied.
    • 位线的宽度和厚度分别表示为W 1和T 1,数字线的厚度表示为T 2,并且从数字线的中心到厚度方向的中心的距离 在厚度方向上的MTJ元件的自由层表示为L 1。 数字线的宽度表示为W 2,并且从厚度方向的位线的中心到厚度方向上的MTJ元件的自由层的中心的距离表示为L 2。 距离L 1和L 2以及横截面积S 1和S 2被设定为当L 1 / L 2> = 1时,关于(1/3)(L 1 / L 2 )满足<= S 2 / S 1 <= 1,并且当L 1 / L 2 <= 1时,满足1 <= S 2 / S 1 <= 3(L 1 / L 2)的关系。