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1. 发明授权

US5026767A Antistatic aromatic polyimide article 失效
标题翻译：抗静电芳香族聚酰亚胺制品
公开(公告)号：US5026767A
公开(公告)日：1991-06-25
申请号：US554152
申请日：1990-07-13
申请人： Hiroshi Inoue , Tadashi Miura , Tetsuji Hirano
发明人： Hiroshi Inoue , Tadashi Miura , Tetsuji Hirano
IPC分类号： H05F1/00 , C08J5/00 , C08K5/41 , C08K5/42 , C09K3/16
CPC分类号： C08K5/41 , C08K5/42 , Y10S524/912
摘要： An antistatic aromatic polyimide article comprises an aromatic polyimide and a small amount of an antistatic agent. The antistatic agent is a sulfonate having the formula (I):R(SO.sub.3 M).sub.n (I)wherein R is a substituted or unsubstituted aryl group; M is an alkali metal; and n is 1 or 2; or a sulfinate having the formula (II):RSO.sub.2 M (II)wherein R and M have the same meanings as defined above.

2. 发明授权

US5308569A Process for the preparation of aromatic polyimide film 失效
标题翻译：芳族聚酰亚胺薄膜的制备方法
公开(公告)号：US5308569A
公开(公告)日：1994-05-03
申请号：US798532
申请日：1991-11-26
申请人： Toshikazu Hamamoto , Hiroshi Inoue , Yoshiyuki Miwa , Tetsuji Hirano , Katsuo Imatani , Kenji Matsubara , Takashi Kohno
发明人： Toshikazu Hamamoto , Hiroshi Inoue , Yoshiyuki Miwa , Tetsuji Hirano , Katsuo Imatani , Kenji Matsubara , Takashi Kohno
IPC分类号： B29C41/24 , B29D7/01 , C08G73/10 , C08J5/18 , B29C39/14
CPC分类号： C08J5/18 , B29C41/24 , B29D7/01 , C08G73/1028 , B29K2079/08 , C08J2379/08
摘要： A process for the preparation of an aromatic polyimide film includes the steps of casting a polyamide acid solution containing an imidization agent on a support in the form of a film, heating the filmy cast solution on the support at a temperature of 80.degree. to 200.degree. C. to obtain a self-supportable film; peeling the self-supportable film from the support; and further heating the film at a temperature of not lower than 300.degree. C. The polyamide acid solution includes a polyamide acid obtained by polymerization reaction of 3,4,3',4'-biphenyltetracarboxylic dianhydride and p-phenylenediamine in a mixture of a polar organic solvent and a small amount of an imidization agent selected from imidazole, a substituted imidazole, benzimidazole, a substituted benzimidazole, isoquinoline, and a substituted pyridine.
摘要翻译：制备芳族聚酰亚胺膜的方法包括以下步骤：将含有酰亚胺化剂的聚酰胺酸溶液以薄膜形式在载体上浇铸，在80℃至200℃的温度下将薄膜状溶液加热到载体上 C.获得自我支持的电影; 从支撑体剥离自支撑膜; 并在不低于300℃的温度下进一步加热该膜。聚酰胺酸溶液包括通过3,4,3'，4'-联苯四羧酸二酐和对苯二胺的聚合反应获得的聚酰胺酸极性有机溶剂和少量的选自咪唑，取代的咪唑，苯并咪唑，取代的苯并咪唑，异喹啉和取代的吡啶的酰亚胺化剂。

3. 发明授权

US5128444A Thermosetting resin composition and thermosetting dry film 失效
标题翻译：热固性树脂组合物和热浸膜干膜
公开(公告)号：US5128444A
公开(公告)日：1992-07-07
申请号：US510016
申请日：1990-04-17
申请人： Hiroshi Inoue , Tadao Muramatsu , Tetsuji Hirano
发明人： Hiroshi Inoue , Tadao Muramatsu , Tetsuji Hirano
IPC分类号： C08J5/18 , C08G73/10 , C08L79/08 , C09D179/08 , H05K1/03 , H05K3/38
CPC分类号： C09D179/08 , C08L79/08 , C08L79/085 , H05K1/0346 , H05K3/386 , Y10T428/31721
摘要： A thermosetting resin composition, a solution composition of the resin and a thermosetting dry film formed out of the resin are disclosed. The thermosetting resin composition contains a specific resin component as the main component. The resin component consists of (A) 100 weight parts of an aromatic polyimide; and (B) 5 to 2,000 weight parts of (a) a terminal-modified imide oligomer or (b) an unsaturated imide compound. The aromatic polyimide (A) is formed from a tetracarboxylic acid ingredient which contains 2,3,3',4'-biphenyltetracarboxylic acid or its derivative in an amount of at least 60 mole % and an aromatic diamine ingredient. The polyimide has such a high molecular weight that the logarithmic viscosity (concentration: 0.5 g/100 ml of solvent; solvent: N-methyl-2-pyrrolidone; and temperature of measurement: 30.degree. C.) is not less than 0.2. The polyimide is soluble in an organic polar solvent. The imide oligomer (a) has an internal imide bond inside of the oligomer and an unsaturated group as a terminal group, and is formed by a reaction of an aromatic tetracarboxylic acid ingredient, a diamine ingredient, and an unsaturated monoamine or dicarboxylic acid ingredient having an unsaturated group. The oligomer has a logarithmic viscosity of not more than 0.5 and a softening point of not higher than 300.degree. C. The imide compound (b) has an internal imide bond inside of the compound and an unsaturated group as a terminal group, and is formed by a reaction of an aromatic tetracarboxylic acid ingredient with a monoamine ingredient having an unsaturated group. The compound has a softening point of not higher than 300.degree. C.

4. 发明授权

US4931365A Aromatic polyimide film having metallic surface 失效
标题翻译：具有金属表面的芳香族聚酰亚胺膜
公开(公告)号：US4931365A
公开(公告)日：1990-06-05
申请号：US196316
申请日：1988-05-20
申请人： Hiroshi Inoue , Tetsuji Hirano
发明人： Hiroshi Inoue , Tetsuji Hirano
IPC分类号： B32B15/088 , B32B9/00 , C25D5/56 , H05K1/03 , H05K3/10 , H05K3/18 , H05K3/38
CPC分类号： H05K3/38 , H05K3/188 , H05K3/387 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0236 , H05K2203/1157 , H05K2203/125 , H05K3/105 , Y10S428/901 , Y10T428/31681 , Y10T428/31721
摘要： An aromatic polyimide film having a metallic surface comprises a substrate film of an aromatic polyimide containing essentially no inorganic particle, an aromatic polyimide resin layer containing non-conductive metal oxide particles dispersed therein and a metal layer, superposed in order. A portion of the non-conductive metal oxide particles located in the vicinity of the surface of the aromatic polyimide resin layer is reduced into metal so that the surface of the resin layer is made electroconductive.
摘要翻译：具有金属表面的芳族聚酰亚胺膜包括基本上不含无机颗粒的芳族聚酰亚胺的基底膜，其中分散有非导电金属氧化物颗粒的芳族聚酰亚胺树脂层和金属层，依次叠加。位于芳香族聚酰亚胺树脂层表面附近的非导电性金属氧化物粒子的一部分被还原为金属，使得树脂层的表面形成导电性。

5. 发明授权

US5180627A Heat resistant adhesive composition 失效
标题翻译：耐热粘合剂组合物
公开(公告)号：US5180627A
公开(公告)日：1993-01-19
申请号：US801686
申请日：1991-12-02
申请人： Hiroshi Inoue , Seiichirou Takabayashi , Tadao Muramatsu , Tsutomu Funagoshi , Tetsuji Hirano
发明人： Hiroshi Inoue , Seiichirou Takabayashi , Tadao Muramatsu , Tsutomu Funagoshi , Tetsuji Hirano
IPC分类号： B32B7/12 , C09J163/00 , C09J179/08 , C09J183/10 , H05K1/00 , H05K3/38
CPC分类号： H05K3/386 , B32B7/12 , C09J163/00 , C09J179/08 , C09J183/10 , H05K1/0393 , H05K2201/0154 , H05K2201/0162 , H05K2201/0355 , Y10T428/24959 , Y10T428/31522 , Y10T428/31721
摘要： The disclosed heat resistant adhesive composition comprises a polyimidesiloxane obtained from a biphenyltetracarboxylic acid or its derivative and a diamine composition comprising a diaminopolysiloxane and an aromatic diamine, an epoxy compound having an epoxy group, and an epoxy compound-hardening agent. An adhesive film and a composite sheet utilizing the heat resistant resinous composition are also disclosed.
摘要翻译：所公开的耐热粘合剂组合物包含由联苯四羧酸或其衍生物获得的聚酰亚胺硅氧烷和包含二氨基聚硅氧烷和芳族二胺的二胺组合物，具有环氧基的环氧化合物和环氧化合物硬化剂。还公开了一种使用耐热树脂组合物的粘合膜和复合片。

6. 发明授权

US4963645A Terminal-modified imide oligomer and solution composition of the same 失效
标题翻译：末端修饰的酰亚胺低聚物和溶液组成相同
公开(公告)号：US4963645A
公开(公告)日：1990-10-16
申请号：US236000
申请日：1988-08-24
申请人： Hiroshi Inoue , Tadao Muramatsu , Tetsuji Hirano
发明人： Hiroshi Inoue , Tadao Muramatsu , Tetsuji Hirano
IPC分类号： C08G73/12
CPC分类号： C08G73/122
摘要： A terminal-modified imide oligomer having an unsaturated group as a terminal group and an imide bond inside of the oligomer which is produced by reacting 2,3,3',4'-or 3,3',4,4'-biphenyltetracarboxylic acid or its derivative, a diamine compound, and an unsaturated dicarboxylic acid or its derivative and/or an unsaturated monoamine in an organic solvent is disclosed. This oligomer has a logarithmic viscosity of not more than 1.0. This logarithmic viscosity is measured under the conditions of concentration of 0.5 g/100 ml-solvent (N-methyl-2-pyrrolidone) and a temperature of 30.degree. C., and has a melting point of 50.degree. to 300.degree. C.

7. 发明授权

US4898753A Process for the preparation of aromatic polyimide film 失效
标题翻译：芳族聚酰亚胺薄膜的制备方法
公开(公告)号：US4898753A
公开(公告)日：1990-02-06
申请号：US199330
申请日：1988-05-26
申请人： Hiroshi Inoue , Tadao Muramatsu , Yasuji Narahara , Tetsuji Hirano
发明人： Hiroshi Inoue , Tadao Muramatsu , Yasuji Narahara , Tetsuji Hirano
IPC分类号： B05D7/24 , B32B27/34 , B32B37/00 , C08G73/10 , C08J7/04 , C09D179/08 , G11B5/73 , G11B5/733 , G11B5/74
CPC分类号： G11B5/7315 , C08J7/047 , C09D179/08 , G11B5/74 , C08J2379/08 , C08J2479/00 , Y10T428/31721
摘要： A process for the preparation of an aromatic polyimide film having a surface provided with extremely small sized protrusions having an average diameter of 40 to 2,000 angstroms, the number of protrusions being in the range of 1.times.10.sup.4 to 1.times.10.sup.9 /mm.sup.2 is disclosed. The process comprises the steps of coating a coating composition (aromatic polyamic acid solution containing inorganic particles having an average diameter of not larger than 1,000 angstroms) on at least one surface of an aromatic polyimide gel film containing a volatile material in an amount of 10 to 90 wt. % (aromatic polyimide gel film has been obtained by ring closure and imidation of an aromatic polyamic acid in an organic polar oslvent containing a dehydrating agent and a catalyst at a temperature of not higher than 200.degree. C.); drying the obtained film composite at a temperature of 50.degree. to 200.degree. C.; and subjecting the film composite to a heat treatment including heating at a temperature of not lower than 300.degree. C.
摘要翻译：公开了一种制备芳族聚酰亚胺膜的方法，其具有设置有平均直径为40至2,000埃的极小尺寸的突起的表面，突起的数量在1×104至1×109 / mm2的范围内。该方法包括以下步骤：在含有挥发性物质的芳族聚酰亚胺凝胶膜的至少一个表面上涂布涂料组合物（含有平均直径不大于1000埃的无机颗粒的芳族聚酰胺酸溶液），其量为10至 90重量％％（芳族聚酰亚胺凝胶膜是通过在不高于200℃的温度下在含有脱水剂和催化剂的有机极性溶液中闭环并酰胺化芳族聚酰胺酸得到的）; 在50〜200℃的温度下干燥得到的复合膜。并对膜复合物进行包括在不低于300℃的温度下的加热的热处理。

8. 发明授权

US5147943A Biphenytetracarboxylic acid-derived polyimides with polyepoxides 失效
标题翻译：具有多环氧化合物的二苯乙烯基酸性衍生的聚酰胺
公开(公告)号：US5147943A
公开(公告)日：1992-09-15
申请号：US467549
申请日：1990-01-19
申请人： Hiroshi Inoue , Tetsuji Hirano
发明人： Hiroshi Inoue , Tetsuji Hirano
IPC分类号： C08G59/40 , C08G59/00 , C08G59/14 , C08G73/10 , C08L63/00 , C08L79/08
CPC分类号： C08L63/00 , C08G73/1017 , C08L79/08
摘要： A thermosetting resin composition useful for heat-resistant adhesive agents and cured shaped articles, comprising (A) a terminal imide oligomer having hydroxyl groups prepared, in an organic medium, from a biphenyltetracarboxylic acid ingredient, an aromatic diamine ingredient and a modifying monoamine ingredient having at least one hydroxy group, and exhibiting a logarithmic viscosity number of 0.01 to 1 at 30.degree. C., and (B) an organic compound having at least two epoxy groups, the imide oligomer optionally being in the state of a partial reaction product of the above-mentioned ingredients.

9. 发明授权

US4869861A Process for producing a shaped and drawn aromatic imide polymer article 失效
标题翻译：生产成型和拉伸的芳族酰亚胺聚合物制品的方法
公开(公告)号：US4869861A
公开(公告)日：1989-09-26
申请号：US198100
申请日：1988-05-24
申请人： Hiroshi Inoue , Tetsuji Hirano , Tadao Muramatsu , Yasuji Narahara
发明人： Hiroshi Inoue , Tetsuji Hirano , Tadao Muramatsu , Yasuji Narahara
IPC分类号： B29C41/12 , B29C55/02 , B29K79/00 , B29L7/00 , C08G73/10 , C08J5/18 , D01F6/74
CPC分类号： C08J5/18 , C08G73/1007 , C08G73/1028 , D01F6/74 , C08J2379/08
摘要： A shaped and drawn aromatic imide polymer article, for example, a film or filament, is produced by shaping an aromatic polyamic acid solution containing an imidizing agent in a polar organic solvent while simultaneously imidizing a portion of the aromatic polyamic acid to an extent such that the resultant self-supporting precursory article contains 20% to 87% by weight of a volatile substance and has a tensile strength of at least 1.5 kg/mm.sup.2 and an ultimate elongation of at least 30%, by drawing the precursory article at a draw ratio of 1.3 or more and by heat-treating the drawn article at a temperature of 150.degree. C. or more.
摘要翻译：通过将含有酰亚胺化剂的芳族聚酰胺酸溶液在极性有机溶剂中成型，同时将一部分芳族聚酰胺酸酰亚胺化，使得芳族聚酰胺酸成型和拉伸的芳族酰亚胺聚合物制品，例如膜或长丝，所得到的自支撑前体制品含有20重量％至87重量％的挥发性物质，并且拉伸强度至少为1.5千克/平方毫米，极限伸长率至少为30％。为1.3以上，通过在150℃以上的温度下对拉伸制品进行热处理。

10. 发明授权

US4411952A Aromatic imide polymer laminate material and method for producing the same 失效
标题翻译：芳香族酰亚胺聚合物层压材料及其制造方法
公开(公告)号：US4411952A
公开(公告)日：1983-10-25
申请号：US370048
申请日：1982-04-20
申请人： Yoshikazu Sasaki , Hiroshi Inoue , Tadashi Miura , Kazuo Kumamoto , Sumio Toudou
发明人： Yoshikazu Sasaki , Hiroshi Inoue , Tadashi Miura , Kazuo Kumamoto , Sumio Toudou
IPC分类号： B32B15/08 , B29C53/00 , B29C65/00 , B29C65/02 , B29L9/00 , B32B15/088 , H05K1/03 , B32B7/02
CPC分类号： H05K1/0346 , Y10T428/24967 , Y10T428/26 , Y10T428/263 , Y10T428/265 , Y10T428/266 , Y10T428/31681 , Y10T428/31721
摘要： An aromatic imide polymer laminate material comprising at least one aromatic imide polymer film consisting essentially of at least one aromatic imide polymer which comprises at least 80 molar % of at least one type of recurring unit of the formula (I): ##STR1## wherein R represents a divalent aromatic radical; and at least one metallic foil which is superimposed on and directly bonded to said aromatic imide polymer film, which laminate material is produced by heat-pressing said aromatic imide polymer film superimposed on said metallic foil at 250.degree. to 600.degree. C. under a pressure of 1 to 2,000 kg/cm.sup.2 without applying a bonding agent between the polymer film and the metallic foil.
摘要翻译：芳族酰亚胺聚合物层压材料，其包含至少一种芳族酰亚胺聚合物膜，其基本上由至少一种芳族酰亚胺聚合物组成，所述芳族酰亚胺聚合物包含至少80摩尔％的至少一种式（I）的重复单元：）其中R表示二价芳族基团; 和至少一个叠加在所述芳香族酰亚胺聚合物膜上并直接结合到所述芳族酰亚胺聚合物膜上的金属箔，所述层压材料通过在250℃至600℃下在压力下热压所述金属箔上的所述芳族酰亚胺聚合物膜而制备为1〜2000kg / cm 2，而不在聚合物膜和金属箔之间施加粘合剂。

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