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    • 3. 发明授权
    • Thermosetting resin composition and thermosetting dry film
    • 热固性树脂组合物和热浸膜干膜
    • US5128444A
    • 1992-07-07
    • US510016
    • 1990-04-17
    • Hiroshi InoueTadao MuramatsuTetsuji Hirano
    • Hiroshi InoueTadao MuramatsuTetsuji Hirano
    • C08J5/18C08G73/10C08L79/08C09D179/08H05K1/03H05K3/38
    • C09D179/08C08L79/08C08L79/085H05K1/0346H05K3/386Y10T428/31721
    • A thermosetting resin composition, a solution composition of the resin and a thermosetting dry film formed out of the resin are disclosed. The thermosetting resin composition contains a specific resin component as the main component. The resin component consists of (A) 100 weight parts of an aromatic polyimide; and (B) 5 to 2,000 weight parts of (a) a terminal-modified imide oligomer or (b) an unsaturated imide compound. The aromatic polyimide (A) is formed from a tetracarboxylic acid ingredient which contains 2,3,3',4'-biphenyltetracarboxylic acid or its derivative in an amount of at least 60 mole % and an aromatic diamine ingredient. The polyimide has such a high molecular weight that the logarithmic viscosity (concentration: 0.5 g/100 ml of solvent; solvent: N-methyl-2-pyrrolidone; and temperature of measurement: 30.degree. C.) is not less than 0.2. The polyimide is soluble in an organic polar solvent. The imide oligomer (a) has an internal imide bond inside of the oligomer and an unsaturated group as a terminal group, and is formed by a reaction of an aromatic tetracarboxylic acid ingredient, a diamine ingredient, and an unsaturated monoamine or dicarboxylic acid ingredient having an unsaturated group. The oligomer has a logarithmic viscosity of not more than 0.5 and a softening point of not higher than 300.degree. C. The imide compound (b) has an internal imide bond inside of the compound and an unsaturated group as a terminal group, and is formed by a reaction of an aromatic tetracarboxylic acid ingredient with a monoamine ingredient having an unsaturated group. The compound has a softening point of not higher than 300.degree. C.
    • 7. 发明授权
    • Process for the preparation of aromatic polyimide film
    • 芳族聚酰亚胺薄膜的制备方法
    • US4898753A
    • 1990-02-06
    • US199330
    • 1988-05-26
    • Hiroshi InoueTadao MuramatsuYasuji NaraharaTetsuji Hirano
    • Hiroshi InoueTadao MuramatsuYasuji NaraharaTetsuji Hirano
    • B05D7/24B32B27/34B32B37/00C08G73/10C08J7/04C09D179/08G11B5/73G11B5/733G11B5/74
    • G11B5/7315C08J7/047C09D179/08G11B5/74C08J2379/08C08J2479/00Y10T428/31721
    • A process for the preparation of an aromatic polyimide film having a surface provided with extremely small sized protrusions having an average diameter of 40 to 2,000 angstroms, the number of protrusions being in the range of 1.times.10.sup.4 to 1.times.10.sup.9 /mm.sup.2 is disclosed. The process comprises the steps of coating a coating composition (aromatic polyamic acid solution containing inorganic particles having an average diameter of not larger than 1,000 angstroms) on at least one surface of an aromatic polyimide gel film containing a volatile material in an amount of 10 to 90 wt. % (aromatic polyimide gel film has been obtained by ring closure and imidation of an aromatic polyamic acid in an organic polar oslvent containing a dehydrating agent and a catalyst at a temperature of not higher than 200.degree. C.); drying the obtained film composite at a temperature of 50.degree. to 200.degree. C.; and subjecting the film composite to a heat treatment including heating at a temperature of not lower than 300.degree. C.
    • 公开了一种制备芳族聚酰亚胺膜的方法,其具有设置有平均直径为40至2,000埃的极小尺寸的突起的表面,突起的数量在1×104至1×109 / mm2的范围内。 该方法包括以下步骤:在含有挥发性物质的芳族聚酰亚胺凝胶膜的至少一个表面上涂布涂料组合物(含有平均直径不大于1000埃的无机颗粒的芳族聚酰胺酸溶液),其量为10至 90重量% %(芳族聚酰亚胺凝胶膜是通过在不高于200℃的温度下在含有脱水剂和催化剂的有机极性溶液中闭环并酰胺化芳族聚酰胺酸得到的); 在50〜200℃的温度下干燥得到的复合膜。 并对膜复合物进行包括在不低于300℃的温度下的加热的热处理。