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    • 7. 发明申请
    • Rinsing Fluid for Lithography
    • 用于平版印刷的冲洗液
    • US20080026975A1
    • 2008-01-31
    • US11587268
    • 2005-04-20
    • Jun KoshiyamaKazumasa WakiyaFumitake KanekoAtsushi MiyamotoHidekazu TajimaYoshihiro Sawada
    • Jun KoshiyamaKazumasa WakiyaFumitake KanekoAtsushi MiyamotoHidekazu TajimaYoshihiro Sawada
    • G03F7/32H01L21/027
    • G03F7/32C11D3/245C11D3/349C11D11/0041G03F7/322
    • The invention provides a novel rinsing fluid which can convert an easily wettable resist pattern surface having a contact angle of 40° or below into one having a contact angle of 70° or above to inhibit pattern collapse effectively and thereby give high-quality products. The rinsing fluid consists of a solution containing at least one fluorine compound soluble in water or alcoholic solvents which is selected from among compounds represented by the general formula (I), those represented by the general formula (II), and those represented by the general formula: Rf′—COOH: wherein R1 and R2 are each optionally substituted C1-5 alkyl whose hydrogen atoms are partially or wholly replaced by fluorine, or R1 and R2 together with the SO2 groups to which they are bonded and the nitrogen atom may form a five- or six-membered ring; Rf is optionally substituted C1-5 alkyl whose hydrogen atoms are partially or wholly replaced by fluorine; m and n are each an integer of 2 or 3; and Rf′ is at least partially fluorinated alkyl having 8 to 20 carbon atoms.
    • 本发明提供了一种新颖的冲洗液,其可以将具有40°或更低接触角的容易润湿的抗蚀剂图案表面转变成接触角为70°或更高的接触角,以有效抑制图案塌陷,从而产生高质量的产品。 冲洗液由含有至少一种可溶于水的氟化合物或醇溶剂的溶液组成,所述氟化合物选自由通式(I)表示的化合物,由通式(II)表示的化合物和由通式 其中R 1和R 2各自是任选取代的C 1-5烷基, 其氢原子部分或全部被氟取代的烷基,或R 1和R 2与它们所键合的SO 2 H 2基团一起 并且氮原子可以形成五元或六元环; R f是任选取代的C 1-5烷基,其氢原子部分或全部被氟取代; m和n分别为2或3的整数; 且R f'是至少部分氟化的具有8至20个碳原子的烷基。
    • 8. 发明申请
    • Developing Solution Composition for Lithography and Method for Resist Pattern Formation
    • 开发用于平版印刷的溶液组合物和抗蚀剂图案形成方法
    • US20070292808A1
    • 2007-12-20
    • US11661317
    • 2005-08-29
    • Jun KoshiyamaKazumasa WakiyaYoshihiro Sawada
    • Jun KoshiyamaKazumasa WakiyaYoshihiro Sawada
    • G03F7/32H01L21/027
    • G03F7/322
    • This invention provides a novel developing solution composition for lithography, which can efficiently reduce defects without varying the formulation of a resist composition per se and without sacrificing the quality of a resist pattern by the use thereof, and a novel method for resist pattern formation using the developing solution composition, which can reduce the occurrence of defects and can be combined with subsequent specific rinsing liquid treatment to control pattern collapse. The developing solution composition comprises a solution containing tetraalkylammonium hydroxide and at least one polymer selected from water soluble or alkali soluble polymers comprising monomer constituent units with a nitrogen-containing heterocyclic ring. A resist pattern is formed by the following steps: (1) the step of providing a resist film on a substrate; (2) the step of selectively exposing the resist film thorough a mask pattern; (3) the step of heating the film after exposure; and (4) the step of developing the film with the above composition.
    • 本发明提供了一种用于光刻的新颖的显影液组合物,其可以有效地减少缺陷,而不改变抗蚀剂组合物本身的配方,而不会因其使用而牺牲抗蚀剂图案的质量,并且使用这种方法 开发溶液组合物,其可以减少缺陷的发生,并且可以与随后的特定漂洗液处理结合以控制图案崩溃。 显影溶液组合物包含含有四烷基氢氧化铵和至少一种选自包含含有含氮杂环的单体构成单元的水溶性或碱溶性聚合物的聚合物的溶液。 通过以下步骤形成抗蚀剂图案:(1)在基板上设置抗蚀剂膜的步骤; (2)通过掩模图案选择性地曝光抗蚀剂膜的步骤; (3)曝光后加热薄膜的步骤; 和(4)用上述组合物显影薄膜的步骤。