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1. 发明授权

US09244269B2 Micro movable device and optical switching apparatus 有权
标题翻译：微动移动装置和光开关装置
公开(公告)号：US09244269B2
公开(公告)日：2016-01-26
申请号：US12573393
申请日：2009-10-05
申请人： Hiromitsu Soneda , Tsuyoshi Matsumoto , Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Osamu Tsuboi
发明人： Hiromitsu Soneda , Tsuyoshi Matsumoto , Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Osamu Tsuboi
IPC分类号： G02B6/42 , G02B26/08 , B81C3/00 , G01D5/28 , G02B6/35 , H02N1/00
CPC分类号： G02B26/0841 , B81B2201/042 , B81B2203/0136 , B81B2203/058 , B81C3/001 , G01D5/285 , G02B6/3518 , G02B6/3556 , G02B6/356 , G02B6/357 , G02B6/3584 , H02N1/006
摘要： A micro movable device includes: a micro movable substrate in which a micro movable unit is formed, the micro movable unit including a frame, a movable part, and a coupling part for coupling the frame and the movable part to define an axial center of rotation of the movable part; a supporting substrate; and a reinforced fixed part provided between the frame and the supporting substrate, and including a first spacer that joins the frame to the supporting substrate and an adhesive part that covers the first spacer and joins the frame to the supporting substrate, wherein the frame includes a first area facing the movable part in a direction of extent of the axial center, and a second area different from the first area, and the reinforced fixed part is bonded to the second area of the frame.
摘要翻译：微型移动装置包括：微型可移动基板，其中形成有微型可动单元，微型可移动单元包括框架，可移动部件和用于联接框架和可动部件的联接部件，以限定轴向旋转中心的可动部分; 支撑基板; 以及设置在所述框架和所述支撑基板之间的加强固定部，并且包括将所述框架连接到所述支撑基板的第一间隔件和覆盖所述第一间隔件并将所述框架连接到所述支撑基板的粘合部，其中，所述框架包括所述第一区域与所述第一区域不同的第二区域，所述加强固定部分接合到所述框架的第二区域。

2. 发明授权

US08093086B2 Packaged device and method of manufacturing the same 有权
标题翻译：封装装置及其制造方法
公开(公告)号：US08093086B2
公开(公告)日：2012-01-10
申请号：US13020101
申请日：2011-02-03
申请人： Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi
发明人： Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi
IPC分类号： H01L21/52
CPC分类号： H01L23/055 , B81B7/0038 , B81B2201/0235 , G01P1/023 , G01P15/0802 , H01L23/564 , H01L24/05 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/0401 , H01L2224/05553 , H01L2224/05554 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/484 , H01L2224/49175 , H01L2224/73257 , H01L2224/8192 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/10161 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/06 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip.
摘要翻译：封装装置包括具有限定封闭内部空间的内表面的封装，固定在内部空间中的封装的器件芯片和覆盖封装的内表面的至少一部分的聚对二甲苯膜和/或至少一个器件芯片表面的一部分。

3. 发明申请

US20110192635A1 MICROSTRUCTURE AND MICROSTRUCTURE MANUFACTURE METHOD 有权
标题翻译：微结构和微结构制造方法
公开(公告)号：US20110192635A1
公开(公告)日：2011-08-11
申请号：US13091728
申请日：2011-04-21
申请人： Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi
发明人： Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi
IPC分类号： H05K1/00 , H01B13/06
CPC分类号： B81C1/00698 , Y10T29/49117
摘要： A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face.
摘要翻译：微结构包括具有第一导体，第二导体和位于第一和第二导体之间的中间绝缘体的层压结构。第一导体包括相对于第二导体的相对面，侧面和形成上述相对面和侧面的边界的边缘部分。第二导体包括延伸超过超过第一导体的边缘部分的延伸面。绝缘膜包括覆盖边缘部分的至少一部分和/或侧面的至少一部分的区域。

4. 发明申请

US20100092130A1 MICRO MOVABLE DEVICE AND OPTICAL SWITCHING APPARATUS 有权
标题翻译：微型可移动设备和光学切换设备
公开(公告)号：US20100092130A1
公开(公告)日：2010-04-15
申请号：US12573393
申请日：2009-10-05
申请人： Hiromitsu SONEDA , Tsuyoshi Matsumoto , Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Osamu Tsuboi
发明人： Hiromitsu SONEDA , Tsuyoshi Matsumoto , Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Osamu Tsuboi
IPC分类号： G02B6/26 , H02N1/00 , G02B26/08
CPC分类号： G02B26/0841 , B81B2201/042 , B81B2203/0136 , B81B2203/058 , B81C3/001 , G01D5/285 , G02B6/3518 , G02B6/3556 , G02B6/356 , G02B6/357 , G02B6/3584 , H02N1/006
摘要： A micro movable device includes: a micro movable substrate in which a micro movable unit is formed, the micro movable unit including a frame, a movable part, and a coupling part for coupling the frame and the movable part to define an axial center of rotation of the movable part; a supporting substrate; and a reinforced fixed part provided between the frame and the supporting substrate, and including a first spacer that joins the frame to the supporting substrate and an adhesive part that covers the first spacer and joins the frame to the supporting substrate, wherein the frame includes a first area facing the movable part in a direction of extent of the axial center, and a second area different from the first area, and the reinforced fixed part is bonded to the second area of the frame.
摘要翻译：微型移动装置包括：微型可移动基板，其中形成有微型可动单元，微型可移动单元包括框架，可移动部件和用于联接框架和可动部件的联接部件，以限定轴向旋转中心的可动部分; 支撑基板; 以及设置在所述框架和所述支撑基板之间的加强固定部，并且包括将所述框架连接到所述支撑基板的第一间隔件和覆盖所述第一间隔件并将所述框架连接到所述支撑基板的粘合部，其中，所述框架包括所述第一区域与所述第一区域不同的第二区域，所述加强固定部分接合到所述框架的第二区域。

5. 发明申请

US20090001487A1 PACKAGED DEVICE AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：包装装置及其制造方法
公开(公告)号：US20090001487A1
公开(公告)日：2009-01-01
申请号：US12164670
申请日：2008-06-30
申请人： Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi
发明人： Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi
IPC分类号： H01L29/84 , H01L21/52
CPC分类号： H01L23/055 , B81B7/0038 , B81B2201/0235 , G01P1/023 , G01P15/0802 , H01L23/564 , H01L24/05 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/0401 , H01L2224/05553 , H01L2224/05554 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/484 , H01L2224/49175 , H01L2224/73257 , H01L2224/8192 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/10161 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/06 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip.
摘要翻译：封装装置包括具有限定封闭内部空间的内表面的封装，固定在内部空间中的封装的器件芯片和覆盖封装的内表面的至少一部分的聚对二甲苯膜和/或至少一个器件芯片表面的一部分。

6. 发明授权

US07952033B2 Microstructure and microstructure manufacture method 有权
标题翻译：微结构和微结构制造方法
公开(公告)号：US07952033B2
公开(公告)日：2011-05-31
申请号：US12039186
申请日：2008-02-28
申请人： Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi
发明人： Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi
IPC分类号： H05K1/03
CPC分类号： B81C1/00698 , Y10T29/49117
摘要： A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face.
摘要翻译：微结构包括具有第一导体，第二导体和位于第一和第二导体之间的中间绝缘体的层压结构。第一导体包括相对于第二导体的相对面，侧面和形成上述相对面和侧面的边界的边缘部分。第二导体包括延伸超过超过第一导体的边缘部分的延伸面。绝缘膜包括覆盖边缘部分的至少一部分和/或侧面的至少一部分的区域。

7. 发明授权

US07871687B2 Method of making microstructure device, and microstructure device made by the same 有权
标题翻译：制造微结构器件的方法及其制造的微结构器件
公开(公告)号：US07871687B2
公开(公告)日：2011-01-18
申请号：US11902011
申请日：2007-09-18
申请人： Norinao Kouma , Yoshihiro Mizuno , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi , Ippei Sawaki
发明人： Norinao Kouma , Yoshihiro Mizuno , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi , Ippei Sawaki
IPC分类号： B32B3/06 , G02B7/182 , H01L23/58 , G01P3/44 , G01P15/097
CPC分类号： B81C1/00682 , B81B2203/0136 , Y10T428/24025 , Y10T428/2457 , Y10T428/24612
摘要： A microstructure device is made by processing a material substrate consisting of e.g. a first process layer, a second process layer and a middle layer arranged between the first and the second process layers. The microstructure device includes a first structural part and a second structural part that has a portion facing the first structural part via a gap. The first and the second structural parts are connected to each other by a connecting part extending across the gap. This connecting part is formed in the first process layer to be in contact with the middle layer. The microstructure device also includes a protective part extending from the first structural part toward the second structural part or vice versa. The protective part is formed in the first or second process layer to be in contact with the middle layer.
摘要翻译：微结构装置是通过加工由例如玻璃，布置在第一和第二处理层之间的第一处理层，第二处理层和中间层。微结构装置包括第一结构部分和第二结构部分，其具有经由间隙面对第一结构部分的部分。第一和第二结构部件通过跨越间隙延伸的连接部分相互连接。该连接部形成在第一处理层中以与中间层接触。微结构装置还包括从第一结构部件朝向第二结构部件延伸的保护部件，反之亦然。保护部分形成在第一或第二处理层中以与中间层接触。

8. 发明申请

US20100007940A1 MICRO OSCILLATING DEVICE 失效
标题翻译：微型振荡器件
公开(公告)号：US20100007940A1
公开(公告)日：2010-01-14
申请号：US12484456
申请日：2009-06-15
申请人： Osamu Tsuboi , Norinao Kouma , Yoshihiro Mizuno , Hiromitsu Soneda , Hisao Okuda , Tsuyoshi Matsumoto
发明人： Osamu Tsuboi , Norinao Kouma , Yoshihiro Mizuno , Hiromitsu Soneda , Hisao Okuda , Tsuyoshi Matsumoto
IPC分类号： G02B26/08
CPC分类号： G02B26/0841
摘要： A micro oscillating device includes a first frame; an oscillating portion; a first twist coupling portion and a second twist coupling portion coupling the first frame and the oscillating portion to define a first shaft center of an oscillating operation of the oscillating portion; a second frame including a support base and an arm portion extended from the support base toward the oscillating portion; and a third twist coupling portion and a fourth twist coupling portion coupling the second frame and the first frame to define a second shaft center of an oscillating operation of the first frame, wherein the third twist coupling portion is coupled to the first frame and the arm portion between the oscillating portion and the support base, and the fourth twist coupling portion is coupled to the first frame and the support base or the arm portion between the oscillating portion and the support base.
摘要翻译：微振荡装置包括：第一框架; 振荡部分; 第一扭转联接部分和第二扭转联接部分，其联接所述第一框架和所述振荡部分，以限定所述振荡部分的振荡操作的第一轴心; 第二框架，包括支撑基座和从支撑基部向振荡部分延伸的臂部分; 以及第三扭转联接部分和第四扭转联接部分，其联接所述第二框架和所述第一框架以限定所述第一框架的振荡操作的第二轴心，其中所述第三扭转联接部分联接到所述第一框架和所述臂所述摆动部分与所述支撑基座之间的部分，所述第四扭转联接部分在所述振荡部分和所述支撑基座之间联接到所述第一框架和所述支撑基座或所述臂部分。

9. 发明申请

US20090267445A1 MICRO ROCKING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：微型摇动装置及其制造方法
公开(公告)号：US20090267445A1
公开(公告)日：2009-10-29
申请号：US12249677
申请日：2008-10-10
申请人： Yoshihiro MIZUNO , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi , Ippei Sawaki
发明人： Yoshihiro MIZUNO , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi , Ippei Sawaki
IPC分类号： H02N11/00 , B44C1/22
CPC分类号： G02B26/0841 , B81B3/0005 , B81C1/0096 , H02N1/008
摘要： A micro rocking device includes a frame, a rocking portion, a torsion connecting portion, and a second comb-like electrode, the rocking portion including a first comb-like electrode. The torsion connecting portion connects the frame and the rocking portion. The torsion connecting portion defines the axis of rotational displacement of the rocking portion. The second comb-like electrode attracts the first comb-like electrode and rotationally displaces the rocking portion. The first comb-like electrode has a plurality of first parallel electrode teeth which extend in the direction of the axis and which are spaced from each other in a direction crossing the extension direction. The second comb-like electrode has a plurality of second parallel electrode teeth which extend in the direction of the axis and which are spaced from each other in a direction crossing the extension direction.
摘要翻译：微型摆动装置包括框架，摇摆部分，扭转连接部分和第二梳状电极，摇摆部分包括第一梳状电极。扭转连接部分连接框架和摆动部分。扭转连接部分限定摆动部分的旋转位移的轴线。第二梳状电极吸引第一梳状电极并使摆动部分旋转移位。第一梳状电极具有多个第一平行电极齿，该第一平行电极齿在轴线方向上延伸并且在与延伸方向交叉的方向上彼此间隔开。第二梳状电极具有多个第二平行电极齿，该第二平行电极齿在轴线方向上延伸并且在与延伸方向交叉的方向上彼此间隔开。

10. 发明授权

US08471152B2 Microstructure and microstructure manufacture method 有权
标题翻译：微结构和微结构制造方法
公开(公告)号：US08471152B2
公开(公告)日：2013-06-25
申请号：US13091728
申请日：2011-04-21
申请人： Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi
发明人： Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi
IPC分类号： H05K1/03
CPC分类号： B81C1/00698 , Y10T29/49117
摘要： A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face.
摘要翻译：微结构包括具有第一导体，第二导体和位于第一和第二导体之间的中间绝缘体的层压结构。第一导体包括相对于第二导体的相对面，侧面和形成上述相对面和侧面的边界的边缘部分。第二导体包括延伸超过超过第一导体的边缘部分的延伸面。绝缘膜包括覆盖边缘部分的至少一部分和/或侧面的至少一部分的区域。

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