专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07491897B2 Electronic equipment provided with wiring board into which press-fit terminals are press-fitted 有权
标题翻译：电子设备配备有压接端子被压入其中的接线板
公开(公告)号：US07491897B2
公开(公告)日：2009-02-17
申请号：US10675227
申请日：2003-09-29
申请人： Hiromichi Watanabe , Yoshifumi Fukatsu , Toshihiro Kasai , Naoki Sugita , Naofumi Saito , Hiroyuki Yamanaka
发明人： Hiromichi Watanabe , Yoshifumi Fukatsu , Toshihiro Kasai , Naoki Sugita , Naofumi Saito , Hiroyuki Yamanaka
IPC分类号： H05K1/11 , H01R12/04
CPC分类号： H01R12/585 , H05K3/308
摘要： In order to suppress the occurrence of damage on a press-fit joining wiring board, a peak value of stress generated on the board in the case of a press-fitting a press-fit terminal into a through-hole is reduced so that it can not exceed the design standard value of the board. In the press-fit terminal in which a body part, retaining part, introducing part and forward end part are integrally formed, a cross-sectional area of the introducing part is reduced to be smaller than that of the retaining part, so that an intensity of the elastic force of the introducing part is decreased to be lower than that of the elastic force of the retaining part. Alternatively, on the wiring board, elastic material is filled into resin for combining sheet-like base material of the board so as to relieve an intensity of stress generated on the board itself.
摘要翻译：为了抑制压配接合线路板的损伤的发生，在将压入端子压入通孔的情况下，在板上产生的应力峰值减小，使得不能超过板的设计标准值。在其中主体部分，保持部分，引导部分和前端部一体地形成的压配合端子中，导入部分的横截面面积被减小为小于保持部分的横截面积，使得强度引导部分的弹力降低到比保持部分的弹性力低。或者，在布线板上，将弹性材料填充到用于组合板的基板材料的树脂中，以便减轻板本身产生的应力强度。

2. 发明授权

US07249957B2 Connector fixing structure 有权
标题翻译：连接器固定结构
公开(公告)号：US07249957B2
公开(公告)日：2007-07-31
申请号：US10968092
申请日：2004-10-20
申请人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
发明人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
IPC分类号： H01R12/00
CPC分类号： H01R12/585 , H01R12/7064
摘要： A connector fixing structure includes a substrate, a connector, and a housing. The substrate defines a first hole portion and a second hole portion. The connector includes a terminal of a pressfit shape that is inserted into the first holed portion to connect with the substrate electrically, and a housing having a leg portion of a press fit shape that is inserted into the second hole portion when the terminal is inserted into the first hole portion.
摘要翻译：连接器固定结构包括基板，连接器和壳体。基板限定第一孔部分和第二孔部分。连接器包括插入第一孔部分中以与电路连接的基座的端子，以及壳体，其具有当端子被插入时插入到第二孔部中的压配合形状的腿部第一孔部分。

3. 发明申请

US20050130463A1 Pressfit terminal and connection structure 失效
标题翻译：压接端子和连接结构
公开(公告)号：US20050130463A1
公开(公告)日：2005-06-16
申请号：US10968066
申请日：2004-10-20
申请人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
发明人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
IPC分类号： H01R4/18 , H01R12/00 , H01R43/16 , H05K3/30
CPC分类号： H01R12/58 , H05K3/308 , H05K2201/0979 , H05K2201/1059 , H05K2201/10787
摘要： A pressfit terminal is to be inserted into a through hole defined in a substrate for electrically contacting with the through hole. The pressfit terminal includes a terminal main body and at least three protrusion portions. The at least three protrusion portions protrude outwardly from a surface of the terminal main body. At least part of the protrusion portions are arranged at intervals in a direction intersecting with an insertion direction of the terminal main body.
摘要翻译：压接端子被插入到限定在基板中的通孔中，以与通孔电接触。压配端子包括端子主体和至少三个突出部。所述至少三个突起部从所述端子主体的表面向外突出。突出部的至少一部分在与端子主体的插入方向相交的方向上间隔地配置。

4. 发明授权

US07108521B2 Pressfit terminal and connection structure 失效
标题翻译：压接端子和连接结构
公开(公告)号：US07108521B2
公开(公告)日：2006-09-19
申请号：US10968066
申请日：2004-10-20
申请人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
发明人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
IPC分类号： H01R12/00
CPC分类号： H01R12/58 , H05K3/308 , H05K2201/0979 , H05K2201/1059 , H05K2201/10787
摘要： A pressfit terminal is to be inserted into a through hole defined in a substrate for electrically contacting with the through hole. The pressfit terminal includes a terminal main body and at least three protrusion portions. The at least three protrusion portions protrude outwardly from a surface of the terminal main body. At least part of the protrusion portions are arranged at intervals in a direction intersecting with an insertion direction of the terminal main body.
摘要翻译：压接端子被插入到限定在基板中的通孔中，以与通孔电接触。压配端子包括端子主体和至少三个突出部。所述至少三个突起部从所述端子主体的表面向外突出。突出部的至少一部分在与端子主体的插入方向相交的方向上间隔地配置。

5. 发明授权

US07078628B2 Substrate for circuit wiring 有权
标题翻译：电路布线基板
公开(公告)号：US07078628B2
公开(公告)日：2006-07-18
申请号：US10723349
申请日：2003-11-25
申请人： Hiromichi Watanabe , Yoshifumi Fukatsu , Hideaki Kaino
发明人： Hiromichi Watanabe , Yoshifumi Fukatsu , Hideaki Kaino
IPC分类号： H05K1/03
CPC分类号： H05K3/284 , H01L23/49894 , H01L2924/0002 , H05K1/056 , H05K2201/0209 , H05K2201/0212 , H01L2924/00
摘要： The present invention concerns a substrate for circuit wiring in which an electronic component is mounted, by soldering, to a wiring pattern formed on an insulated layer deposited over a metallic substrate. A silica-based filler and a rubber-based filler are added in the insulated layer to reduce the linear thermal expansion of the layer and increase its elastic modulus. The mounting portion of an electronic component is molded with a resin material to which a silica-based filler has been added, and which thus has a coefficient of linear thermal expansion smaller than the coefficient of linear thermal expansion of the insulated layer. This serves to alleviate the stress caused by the linear thermal expansion of the metallic substrate, and thereby to prevent separation from occurring between the insulated layer and the metallic substrate, as well as between the insulated layer and the wiring pattern, when subjected to a high-temperature environment.
摘要翻译：本发明涉及一种用于电路布线的基板，其中通过焊接将电子部件安装到沉积在金属基板上的绝缘层上形成的布线图案。在绝缘层中添加二氧化硅系填料和橡胶类填料，以减少层的线性热膨胀并提高其弹性模量。电子部件的安装部分用添加有二氧化硅基填料的树脂材料模制，因此具有比绝热层的线性热膨胀系数小的线性热膨胀系数。这用于减轻金属基板的线性热膨胀引起的应力，从而防止在绝缘层和金属基板之间以及绝缘层和布线图案之间发生分离时，当受到高温度环境。

6. 发明申请

US20050118864A1 Connector fixing structure 有权
标题翻译：连接器固定结构
公开(公告)号：US20050118864A1
公开(公告)日：2005-06-02
申请号：US10968092
申请日：2004-10-20
申请人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
发明人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
IPC分类号： H01R12/34 , H01R13/60
CPC分类号： H01R12/585 , H01R12/7064
摘要： A connector fixing structure includes a substrate, a connector, and a housing. The substrate defines a first hole portion and a second hole portion. The connector includes a terminal of a pressfit shape that is inserted into the first holed portion to connect with the substrate electrically, and a housing having a leg portion of a press fit shape that is inserted into the second hole portion when the terminal is inserted into the first hole portion.
摘要翻译：连接器固定结构包括基板，连接器和壳体。基板限定第一孔部分和第二孔部分。连接器包括插入第一孔部分中以与电路连接的基座的端子，以及壳体，其具有当端子被插入时插入到第二孔部中的压配合形状的腿部第一孔部分。

7. 发明申请

US20110233765A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20110233765A1
公开(公告)日：2011-09-29
申请号：US13028419
申请日：2011-02-16
申请人： Motoaki TANI , Shinya Iijima , Shinichi Sugiura , Hiromichi Watanabe
发明人： Motoaki TANI , Shinya Iijima , Shinichi Sugiura , Hiromichi Watanabe
IPC分类号： H01L23/48 , H01L21/52
CPC分类号： H01L23/49811 , H01L21/563 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/81 , H01L2224/02166 , H01L2224/02311 , H01L2224/02313 , H01L2224/02331 , H01L2224/0239 , H01L2224/0345 , H01L2224/03912 , H01L2224/0401 , H01L2224/05009 , H01L2224/05024 , H01L2224/05166 , H01L2224/05567 , H01L2224/05644 , H01L2224/0603 , H01L2224/06102 , H01L2224/09103 , H01L2224/1134 , H01L2224/11462 , H01L2224/11472 , H01L2224/13014 , H01L2224/13021 , H01L2224/13023 , H01L2224/13024 , H01L2224/13144 , H01L2224/13147 , H01L2224/1403 , H01L2224/141 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81203 , H01L2224/81205 , H01L2224/81444 , H01L2224/81801 , H01L2224/83104 , H01L2224/92 , H01L2224/92125 , H01L2224/94 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2924/00012 , H01L2224/80203 , H01L2224/11 , H01L21/78 , H01L2224/81 , H01L2924/01047 , H01L2224/05552
摘要： A semiconductor device includes a first bump that is located over a surface of a semiconductor element, and is formed on a first bump formation face distanced from a back surface of the semiconductor element at a first distance, and a second bump that is located over the surface of the semiconductor element, and is formed on a second bump formation face distanced from the back surface of the semiconductor element at a second distance being longer than the first distance, the second bump having a diameter larger than a diameter of the first bump.
摘要翻译：半导体器件包括位于半导体元件的表面上方的第一凸点，并且形成在距第一距离半导体元件的背面远离的第一凸起形成面和位于半导体元件的上方的第二凸起并且形成在距离半导体元件的背面远离第二距离的第二凸起形成面上，第二距离比第一距离长，第二凸起的直径大于第一凸块的直径。

8. 发明授权

US07062955B2 Combustion-pressure-data acquisition system of multi-cylinder engine 失效
标题翻译：多缸发动机燃烧压力数据采集系统
公开(公告)号：US07062955B2
公开(公告)日：2006-06-20
申请号：US11249110
申请日：2005-10-11
申请人： Hajime Kashiwase , Hiromichi Watanabe , Hiroshi Yokoyama
发明人： Hajime Kashiwase , Hiromichi Watanabe , Hiroshi Yokoyama
IPC分类号： G01M15/00
CPC分类号： G01L23/222 , F02D35/023 , F02D41/28 , F02D2041/281 , G01L9/085
摘要： A combustion-pressure-data acquisition system of a multi-cylinder engine according to the present invention includes an in-cylinder pressure sensor CPS#n for directly detecting combustion pressure in each cylinder; an amplifier unit AP#n to which the in-cylinder pressure sensor CPS#n for each cylinder is connected; and a channel switching unit MUX to which the amplifier unit AP#n for each cylinder is connected. It selects a system to be measured from among a plurality of systems of signals from the amplifier units AP#n with a channel selection signal outputted from an engine-controlling electronic control unit and outputs combustion pressure data to the ECU. Further, it outputs to an amplifier unit AP#n with which measurement ends a reset signal for discharging the electric charge between the in-cylinder pressure sensor CPS#n and the amplifier circuit to efficiently acquire combustion pressure data of each cylinder with a simple structure without complicated processing.
摘要翻译：根据本发明的多缸发动机的燃烧压力数据采集系统包括用于直接检测每个气缸中的燃烧压力的缸内压力传感器CPS＃n; 每个气缸的缸内压力传感器CPS＃n连接的放大器单元AP＃n; 以及连接有用于每个气缸的放大器单元AP＃n的通道切换单元MUX。从具有从发动机控制电子控制单元输出的通道选择信号的放大器单元AP＃n的多个信号系统中选择要测量的系统，并将燃料压力数据输出到ECU。此外，它输出到放大器单元AP＃n，测量结束用于在缸内压力传感器CPS＃n和放大器电路之间排放电荷的复位信号，以便以简单的结构有效地获取每个气缸的燃烧压力数据没有复杂的处理。

9. 发明授权

US4597826A Method for forming patterns 失效
标题翻译：形成图案的方法
公开(公告)号：US4597826A
公开(公告)日：1986-07-01
申请号：US686521
申请日：1984-12-26
申请人： Teiji Majima , Hiromichi Watanabe
发明人： Teiji Majima , Hiromichi Watanabe
IPC分类号： H01F41/34 , H01L21/033 , C23F1/02 , B44C1/22 , C03C15/00 , C03C25/06
CPC分类号： H01L21/0337 , H01F41/34 , H01L21/0332 , H01L21/0335 , H01L21/0338
摘要： A method is disclosed of forming a fine pattern on a substrate, in which an etching mask pattern is formed on a layer of material of a pattern to be formed, an overlying layer is deposited on the pattern material layer and the mask pattern, and thereafter, the overlying layer and the pattern material layer are etched by ion etching. This method makes it possible, due to the pattern-widening effect caused by the deposition of the overlying layer and by the use of ion etching, to form a pattern having a gap smaller than 0.5 .mu.m or a contiguous-disk pattern having a period of 2 .mu.m or less by photolithography having a 1 .mu.m resolution. It is also possible to form a pattern adapted to enable an easy planing process, by utilizing a difference in etching rates between the mask pattern and the overlying layer. An apparatus used for carrying out the pattern forming method comprises film layer forming means and ion etching means, whereby the overlying layer forming step and the ion etching step can be successively performed by using one and the same apparatus.
摘要翻译：公开了在基板上形成精细图案的方法，其中在要形成的图案的材料层上形成蚀刻掩模图案，在图案材料层和掩模图案上沉积上覆层，之后，通过离子蚀刻蚀刻上覆层和图案材料层。该方法可以由于由上覆层的沉积引起的图案加宽效应和通过使用离子蚀刻来形成间隙小于0.5μm的图案或具有间隔的连续盘图案为2μm或更小，通过具有1μm分辨率的光刻。也可以通过利用掩模图案和上覆层之间的蚀刻速率的差异来形成适于实现容易的刨削工艺的图案。用于进行图案形成方法的装置包括膜层形成装置和离子蚀刻装置，由此可以通过使用同一装置连续执行上覆层形成步骤和离子蚀刻步骤。

10. 发明授权

US07407325B2 Method and apparatus for measuring thermophysical properties 失效
标题翻译：用于测量热物理性质的方法和装置
公开(公告)号：US07407325B2
公开(公告)日：2008-08-05
申请号：US11214052
申请日：2005-08-30
申请人： Hiromichi Watanabe , Tetsuya Baba
发明人： Hiromichi Watanabe , Tetsuya Baba
IPC分类号： G01J5/00 , G01N25/20
CPC分类号： G01N25/18
摘要： The present invention provides a method for measuring thermophysical properties that includes: rapid resistive self-heating of a specimen by using a heating current; emitting a light to the specimen heated by the rapid resistive self-heating of the specimen; measuring a temperature change of the specimen induced by emitting the light to the specimen; and deriving a thermal diffusivity of the specimen from the temperature change induced by emitting the light to the specimen.
摘要翻译：本发明提供了一种用于测量热物理性质的方法，其包括：通过使用加热电流对试样进行快速电阻自加热; 通过样品的快速电阻自身加热的样品发光; 测量通过将光发射到样品而引起的样品的温度变化; 并从通过将光发射到样品而引起的温度变化导出样品的热扩散率。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式