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    • 9. 发明申请
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US20060043418A1
    • 2006-03-02
    • US11070229
    • 2005-03-03
    • Makoto MiuraKatsuyoshi WashioHiromi Shimamoto
    • Makoto MiuraKatsuyoshi WashioHiromi Shimamoto
    • H01L31/109
    • H01L29/7378H01L29/0821H01L29/66242
    • A bipolar type semiconductor device capable of attaining high current gain and high cut-off frequency and performing a satisfactory transistor operation also in a high current region while maintaining a high breakdown voltage performance, as well as a method of manufacturing the semiconductor device, are provided. In a collector comprising a first semiconductor layer and a second semiconductor layer narrower in band gap than the first semiconductor layer, an impurity is doped so as to have a peak of impurity concentration within the second collector layer and so that the value of the peak is higher than the impurity concentration at any position within the first collector layer. It is preferable to adjust the concentration of the doped impurity in such a manner that a collector-base depletion layer extends up to the first collector layer.
    • 提供一种能够在保持高的击穿电压性能的同时在高电流区域中获得高电流增益和高截止频率并执行令人满意的晶体管操作的双极型半导体器件,以及制造半导体器件的方法 。 在包含比第一半导体层窄的带隙的第一半导体层和第二半导体层的集电体中,掺杂杂质以使第二集电极层内的杂质浓度的峰值为峰值, 高于第一收集层内任何位置的杂质浓度。 优选以使得集电极 - 基极耗尽层向上延伸到第一集电极层的方式调节掺杂杂质的浓度。