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1. 发明授权

US5234572A Metal ion replenishment to plating bath 失效
标题翻译：金属离子对水浴的补充
公开(公告)号：US5234572A
公开(公告)日：1993-08-10
申请号：US911076
申请日：1992-07-09
申请人： Hiroki Uchida , Motonobu Kubo , Masayuki Kiso , Teruyuki Hotta , Tohru Kamitamari
发明人： Hiroki Uchida , Motonobu Kubo , Masayuki Kiso , Teruyuki Hotta , Tohru Kamitamari
IPC分类号： C23C18/16 , C25D3/30 , C25D3/34 , C25D21/14
CPC分类号： C25D21/14 , C23C18/1617
摘要： For replenishing a metal ion to a plating bath, a soluble electrode of the same type of metal as in the bath and a counter electrode of a metal material having a nobler standard electrode potential than the soluble electrode are immersed in the bath. Electricity is conducted between the soluble electrode and the counter electrode, thereby dissolving the soluble electrode to replenish an ion of the metal of the soluble electrode to the bath. The potential of the counter electrode is measured using a reference electrode of the same metal as the soluble electrode. The quantity of electricity is controlled such that the measured potential may not be negative with respect to the reference electrode, thereby preventing deposition of the dissolving metal ion on the counter electrode while ensuring a high rate of metal ion dissolution.

2. 发明授权

US5266103A Bath and method for the electroless plating of tin and tin-lead alloy 失效
标题翻译：锡和锡铅合金化学镀的浴和方法
公开(公告)号：US5266103A
公开(公告)日：1993-11-30
申请号：US907038
申请日：1992-07-01
申请人： Hiroki Uchida , Motonobu Kubo , Masayuki Kiso , Teruyuki Hotta , Tohru Kamitamari
发明人： Hiroki Uchida , Motonobu Kubo , Masayuki Kiso , Teruyuki Hotta , Tohru Kamitamari
IPC分类号： C23C18/48 , C23C18/52 , H05K3/34
CPC分类号： C23C18/48 , C23C18/52 , H05K3/3473
摘要： A tin or tin-lead alloy electroless plating bath comprising (A) a stannous salt or a mixture of a stannous salt and a lead salt, (B) an acid, (C) thiourea or a thiourea derivative, and (D) a reducing agent is improved by adding (E) a nonionic surfactant and optionally, (F) a cationic surfactant, a nitrogenous heterocyclic compound or a derivative thereof, or alternatively by adding (G) an ammonium or quaternary ammonium ion. From the bath, uniform films of fine grains will chemically deposit on fine pitch printed wiring boards intended for SMT.

3. 发明授权

US5294554A Analysis of tin, lead or tin-lead alloy plating solution 失效
标题翻译：分析锡，铅或锡铅合金电镀液
公开(公告)号：US5294554A
公开(公告)日：1994-03-15
申请号：US843199
申请日：1992-02-28
申请人： Hiroki Uchida , Motonobu Kubo , Masayuki Kiso , Teruyuki Hotta , Tohru Kamitamari
发明人： Hiroki Uchida , Motonobu Kubo , Masayuki Kiso , Teruyuki Hotta , Tohru Kamitamari
IPC分类号： C23C18/31 , C23C18/48 , C23C18/52 , G01N21/78 , G01N25/00 , G01N31/00 , G01N31/22 , G01N33/20
CPC分类号： G01N31/22 , G01N21/78
摘要： In electroless or electric tin, lead or tin-lead alloy plating solution which may contain copper, the concentration of a metal ion component selected from divalent tin ion, lead ion, and copper ion is quantitatively determined by taking a sample from the solution, adding a chemical agent, for example, an oxidizing agent to the sample, thereby causing the selected metal ion to develop its color, measuring the absorbance of the sample due to the metal ion by colorimetry, and determining the concentration from the absorbance. A choice of chemical agent depends on a particular metal ion on analysis. When the solution contains more than one metal ion, correction is made by repeating the process using another chemical agent.
摘要翻译：在可能含有铜的化学镀或电镀锡，铅或锡铅合金电镀溶液中，通过从溶液中取出样品定量测定选自二价锡离子，铅离子和铜离子的金属离子成分的浓度，加入化学试剂，例如氧化剂，从而使所选择的金属离子显色，通过比色法测量由于金属离子导致的样品的吸光度，并根据吸光度确定浓度。化学药剂的选择取决于特定金属离子的分析。当溶液含有多于一种金属离子时，通过使用另一种化学试剂重复该过程进行校正。

4. 发明授权

US5248527A Process for electroless plating tin, lead or tin-lead alloy 失效
标题翻译：电镀锡，铅或锡铅合金的工艺
公开(公告)号：US5248527A
公开(公告)日：1993-09-28
申请号：US843015
申请日：1992-02-28
申请人： Hiroki Uchida , Motonobu Kubo , Masayuki Kiso , Teruyuki Hotta , Tohru Kamitamari
发明人： Hiroki Uchida , Motonobu Kubo , Masayuki Kiso , Teruyuki Hotta , Tohru Kamitamari
IPC分类号： C23C18/31 , C23C18/48 , C23C18/52 , H05K3/24 , H05K3/34
CPC分类号： C23C18/52 , C23C18/48 , H05K3/244 , H05K3/3473
摘要： The invention provides a process for electroless plating tin, lead or tin-lead alloy on copper or copper alloy using an electroless plating bath containing a water soluble tin and/or lead salt, an acid capable of dissolving the salts, and a complexing agent. The tin and/or lead content in the bath is maintained high enough to chemically deposit thick films by replenishing the tin and/or lead salt in proportion to an increase in concentration of copper ion dissolving out in the bath. Also provided is an electroless tin, lead or tin-lead alloy plating process in which a water soluble copper salt is added to a fresh bath.

5. 发明授权

US5910340A Electroless nickel plating solution and method 失效
标题翻译：化学镀镍溶液及方法
公开(公告)号：US5910340A
公开(公告)日：1999-06-08
申请号：US931832
申请日：1997-09-17
申请人： Hiroki Uchida , Masayuki Kiso , Takayuki Nakamura , Tohru Kamitamari , Rumiko Susuki , Koichiro Shimizu
发明人： Hiroki Uchida , Masayuki Kiso , Takayuki Nakamura , Tohru Kamitamari , Rumiko Susuki , Koichiro Shimizu
IPC分类号： C23C18/34 , C23C18/42 , H01L21/302
CPC分类号： C23C18/34 , C23C18/42
摘要： To an electroless nickel plating solution comprising a water-soluble nickel salt, a reducing agent, and a complexing agent is added a polythionate or dithionite. The invention also provides a high-build electroless gold plating method comprising the steps of immersing a workpiece in the electroless nickel plating bath, thereby chemically depositing a nickel coating on the workpiece, and immersing the nickel-plated workpiece in an electroless gold plating bath, thereby chemically depositing a gold coating on the workpiece.
摘要翻译：向包含水溶性镍盐，还原剂和络合剂的无电镀镍溶液中加入多硫酸盐或连二亚硫酸盐。本发明还提供了一种高结构化学镀金方法，包括以下步骤：将工件浸入无电镀镍浴中，从而在工件上化学沉积镍涂层，并将镀镍工件浸入无电镀金浴中，从而在工件上化学沉积金涂层。

6. 发明授权

US07985285B2 Electroless gold plating bath, electroless gold plating method and electronic parts 有权
标题翻译：化学镀金，化学镀金方法及电子零件
公开(公告)号：US07985285B2
公开(公告)日：2011-07-26
申请号：US11987880
申请日：2007-12-05
申请人： Masayuki Kiso , Yukinori Oda , Seigo Kurosaka , Tohru Kamitamari , Yoshikazu Saijo , Katsuhisa Tanabe
发明人： Masayuki Kiso , Yukinori Oda , Seigo Kurosaka , Tohru Kamitamari , Yoshikazu Saijo , Katsuhisa Tanabe
IPC分类号： C23C18/44 , B05D1/18
CPC分类号： C23C18/44 , C23C18/54
摘要： An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). A gold plated coating of a good appearance can be formed without causing a failure in appearance owing to the progress of intergranular corrosion in a nickel surface.
摘要翻译：化学镀金浴包括水溶性金化合物，络合剂，偏亚硫酸氢甲酯加成物和由R1-NH-C2H4-NH-R2或（CH2-NH-C2H4-NH-CH2）n表示的胺化合物 -R4（其中R1至R4表示-OH，-CH3，-CH2OH，-C2H4OH，-CH2N（CH3）2，-CH2NH（CH2OH），-CH2NH（C2H4OH），-C2H4NH（CH2OH），-C2H4NH（C2H4OH），-CH 2 N（CH 2 OH）2，-CH 2 N（C 2 H 4 OH）2，-C 2 H 4 N（CH 2 OH）2或-C 2 H 4 N（C 2 H 4 OH）2，n为1〜4的整数）。可以形成良好外观的镀金涂层，而不会由于镍表面的晶间腐蚀的进行而导致外观不良。

7. 发明授权

US07988773B2 Electroless gold plating bath, electroless gold plating method and electronic parts 有权
标题翻译：化学镀金，化学镀金方法及电子零件
公开(公告)号：US07988773B2
公开(公告)日：2011-08-02
申请号：US11987881
申请日：2007-12-05
申请人： Masayuki Kiso , Yoshikazu Saijo , Tohru Kamitamari
发明人： Masayuki Kiso , Yoshikazu Saijo , Tohru Kamitamari
IPC分类号： C23C18/44 , B05D1/18
CPC分类号： C23C18/54 , C23C18/44
摘要： An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, an aldehyde compound, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). The electroless gold plating can be carried out without corrosion of an underlying metal to be plated at a stable deposition rate. Because of the high deposition rate and the immersion and reduction types, thickening of a plated coating is possible in one solution and the color of the coating is not degraded to provide a good appearance while keeping a lemon yellow color inherent to gold.
摘要翻译：化学镀金浴包括水溶性金化合物，络合剂，醛化合物和由R1-NH-C2H4-NH-R2或（CH2-NH-C2H4-NH-CH2）n- R4（其中R1至R4表示-OH，-CH3，-CH2OH，-C2H4OH，-CH2N（CH3）2，-CH2NH（CH2OH），-CH2NH（C2H4OH），-C2H4NH（CH2OH），-C2H4NH（C2H4OH） -CH 2 N（CH 2 OH）2，-CH 2 N（C 2 H 4 OH）2，-C 2 H 4 N（CH 2 OH）2或-C 2 H 4 N（C 2 H 4 OH）2，n为1〜4的整数。化学镀金可以在不会以稳定的沉积速率进行电镀的基底金属的腐蚀下进行。由于沉积速度快，浸渍和还原的种类，镀层可以在一种溶液中增稠，涂层的颜色也不会降解，同时保持黄金固有的柠檬黄色。

8. 发明申请

US20080138507A1 Electroless gold plating bath, electroless gold plating method and electronic parts 有权
标题翻译：化学镀金，化学镀金方法及电子零件
公开(公告)号：US20080138507A1
公开(公告)日：2008-06-12
申请号：US11987881
申请日：2007-12-05
申请人： Masayuki Kiso , Yoshikazu Saijo , Tohru Kamitamari
发明人： Masayuki Kiso , Yoshikazu Saijo , Tohru Kamitamari
IPC分类号： C23C18/32 , C23C18/42 , C23C18/54
CPC分类号： C23C18/54 , C23C18/44
摘要： An electroless gold plating bath includes a water-soluble gold compound, a completing agent, an aldehyde compound, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4).The electroless gold plating can be carried out without corrosion of an underlying metal to be plated at a stable deposition rate. Because of the high deposition rate and the immersion and reduction types, thickening of a plated coating is possible in one solution and the color of the coating is not degraded to provide a good appearance while keeping a lemon yellow color inherent to gold.
摘要翻译：无电镀金浴包括水溶性金化合物，完成剂，醛化合物和由R 1 -NH-C 2 H表示的胺化合物，（3）-NH-R 2或（CH 2 -NH-C 2 H 4）2 / （其中R 1至R 4）其中R 1，R 2，R 3，R 3，R 4， / SUB>表示-OH，-CH 3，-CH 2 OH，-C 2 H 4 OH ，-CH 2 N（CH 3）2，-CH 2 NH（CH 2）2， OH），CH 2 NH（C 2 H 4 OH），-C 2 H 2， NH 2（CH 2 OH），-C 2 H 4 NH（C 2 H 2） H 2 OH，-CH 2 N（CH 2 OH）2，-CH 2， 2 N（C 2 H 4 OH）2 N 2，-C 2 H 2， 4 N（CH 2 OH）2或-C 2 H 4 N（C 1 -C 6烷基） 2个H 4 OH，2个，n为1〜4的整数）。化学镀金可以在不会以稳定的沉积速率进行电镀的基底金属的腐蚀下进行。由于沉积速度快，浸渍和还原的种类，镀层可以在一种溶液中增稠，涂层的颜色也不会降低，同时保持黄金固有的柠檬黄色。

9. 发明申请

US20080138506A1 Electroless gold plating bath, electroless gold plating method and electronic parts 有权
标题翻译：化学镀金，化学镀金方法及电子零件
公开(公告)号：US20080138506A1
公开(公告)日：2008-06-12
申请号：US11987880
申请日：2007-12-05
申请人： Masayuki Kiso , Yukinori Oda , Seigo Kurosaka , Tohru Kamitamari , Yoshikazu Saijo , Katsuhisa Tanabe
发明人： Masayuki Kiso , Yukinori Oda , Seigo Kurosaka , Tohru Kamitamari , Yoshikazu Saijo , Katsuhisa Tanabe
IPC分类号： C23C18/32 , C23C18/42 , C23C18/54
CPC分类号： C23C18/44 , C23C18/54
摘要： An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4).A gold plated coating of a good appearance can be formed without causing a failure in appearance owing to the progress of intergranular corrosion in a nickel surface.
摘要翻译：无电镀金浴包括水溶性金化合物，络合剂，偏亚硫酸氢甲酯加成物和由R 1 -NH-C 2 H表示的胺化合物 4-NH-R 2或（CH 2 -NH-C 2 H 4）（其中R 1至R 4）其中R 1至R 4（其中R 1至R 4） -CH 3，-OH，-CH 2，-SO 2 H，CH 2 CH 2， OH，-CH 2 N（CH 3）2 - ， - CH 2 NH（CH 2） OH），-CH 2 NH（C 2 H 4 OH），-C 2 - H 2 NH（CH 2 OH），-C 2 H 4 NH（C 2 H 2） H 2 OH，-CH 2 N（CH 2 OH）2，-CH 2， N 2 C 2 H 2 H 2，H 2 H 2， N 2（CH 2 OH）2或-C 2 H 4 H（N） C 2 H 4 OH）2，n为1〜4的整数。可以形成良好外观的镀金涂层，而不会由于镍表面的晶间腐蚀的进行而导致外观不良。

10. 发明申请

US20080277140A1 ELECTROLESS GOLD PLATING METHOD AND ELECTRONIC PARTS 有权
标题翻译：电镀金镀层方法和电子部件
公开(公告)号：US20080277140A1
公开(公告)日：2008-11-13
申请号：US12102536
申请日：2008-04-14
申请人： Seigo KUROSAKA , Yukinori Oda , Akira Okada , Ayumi Okubo , Masayuki Kiso
发明人： Seigo KUROSAKA , Yukinori Oda , Akira Okada , Ayumi Okubo , Masayuki Kiso
IPC分类号： B05D1/18 , H01B5/00
CPC分类号： H05K3/244 , C23C18/31 , C23C18/44 , H01L2924/0002 , H05K2203/072 , H01L2924/00
摘要： Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film is formed by an electroless gold plating using an electroless gold plating bath including a water-soluble gold compound, a completing agent, formaldehyde and/or a formaldehyde-bisulfite adduct, and an amine compound represented by the following general formula R1—NH—C2H4—NH—R2 or R3—(CH2—NH—C2H4—NH—CH2)n—R4. The method of the invention does not need two types of baths, a flash gold plating bath and a thick gold plating bath for thickening. Gold plating films of different thicknesses suited for solder bonding or wire bonding can be formed using only one type of gold plating bath. Especially, an electroless gold plating film having a thickness of not smaller than 0.15 μm can be efficiently, effectively formed by use of one plating bath in one step, thereby enabling the process to be simplified along with an attendant advantage in cost.
摘要翻译：通过使用包含水溶性的无电镀金浴的无电镀金，形成包括化学镀镍膜，无电镀钯膜和无电镀金膜的镀膜层压体的无电镀金膜的部分或全部金化合物，完成剂，甲醛和/或甲醛 - 亚硫酸氢盐加合物，以及由以下通式表示的胺化合物：R 1 -NH-C 2 H < （3）-NH-R 2或R 3 - （CH 2 -NH-C 2）其中R 1，R 2，R 3，R 3，R 3和R 4独立地是氢。本发明的方法不需要两种类型的浴，闪镀金浴和用于增稠的厚镀金浴。可以使用仅一种类型的镀金浴形成适用于焊接或引线接合的不同厚度的镀金膜。特别地，通过一步使用一个电镀浴可以有效地形成厚度不小于0.15μm的无电镀金膜，从而使得该工艺可以简化，并伴随着成本的优势。

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