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1. 发明申请

US20120143112A1 LOWER-LIMB JOINT ORTHOSIS AND CONTROL METHOD THEREFOR 有权
标题翻译：下肢联合治疗及其控制方法
公开(公告)号：US20120143112A1
公开(公告)日：2012-06-07
申请号：US13390542
申请日：2010-09-22
申请人： Hiroki Tomiyama , Tomio Kubo
发明人： Hiroki Tomiyama , Tomio Kubo
IPC分类号： A61F5/00
CPC分类号： A61F5/0127 , A61F5/0125 , A61F2005/0169
摘要： A lower-limb joint orthosis includes a lower component supporting the foot region, an upper component attached to the lower-limb, and an orthotic joint coupling both components. The orthotic joint comprises: a stator including some fluid chambers in which an MR fluid is enclosed; and a rotor including partition plates protruding into the respective fluid chambers. The stator includes a communication path between the anterior chamber and the posterior chamber. The rotor includes connection paths that connect the anterior chambers together, and connect the posterior chambers together. An electromagnet is placed on a side surface of the communication path so that a rotational resistance of the lower component and the upper component is adjusted by adjusting a magnetic force to control the viscosity of the MR fluid that flows through the communication path.
摘要翻译：下肢关节矫形器包括支撑脚部区域的下部构件，附接到下肢的上部构件和连接两个部件的矫正关节。矫正关节包括：定子，其包括一些流体室，MR流体被封闭在其中; 以及包括突出到各个流体室中的分隔板的转子。定子包括前房和后室之间的连通路径。转子包括将前房连接在一起的连接路径，并将后室连接在一起。电磁体被放置在连通路径的侧表面上，使得通过调节磁力来调节下部部件和上部部件的旋转阻力，以控制流过连通路径的MR流体的粘度。

2. 发明授权

US08870801B2 Lower limb joint orthosis and control method therefor 有权
标题翻译：下肢关节矫形及其控制方法
公开(公告)号：US08870801B2
公开(公告)日：2014-10-28
申请号：US13390542
申请日：2010-09-22
申请人： Hiroki Tomiyama , Tomio Kubo
发明人： Hiroki Tomiyama , Tomio Kubo
IPC分类号： A61F5/00 , A61F2/72
CPC分类号： A61F5/0127 , A61F5/0125 , A61F2005/0169
摘要： A lower-limb joint orthosis includes a lower component supporting the foot region, an upper component attached to the lower-limb, and an orthotic joint coupling both components. The orthotic joint includes: a stator including some fluid chambers in which an MR fluid is enclosed; and a rotor including partition plates protruding into the respective fluid chambers. The stator includes a communication path between the anterior chamber and the posterior chamber. The rotor includes connection paths that connect the anterior chambers together, and connect the posterior chambers together. An electromagnet is placed on a side surface of the communication path so that a rotational resistance of the lower component and the upper component is adjusted by adjusting a magnetic force to control the viscosity of the MR fluid that flows through the communication path.
摘要翻译：下肢关节矫形器包括支撑脚部区域的下部构件，附接到下肢的上部构件和连接两个部件的矫正关节。矫正关节包括：定子，其包括一些液体腔，MR流体被封闭在其中; 以及包括突出到各个流体室中的分隔板的转子。定子包括前房和后室之间的连通路径。转子包括将前房连接在一起的连接路径，并将后室连接在一起。电磁体被放置在连通路径的侧表面上，使得通过调节磁力来调节下部部件和上部部件的旋转阻力，以控制流过连通路径的MR流体的粘度。

3. 发明授权

US08366514B2 Semiconductor substrate planarization apparatus and planarization method 失效
标题翻译：半导体衬底平面化装置和平面化方法
公开(公告)号：US08366514B2
公开(公告)日：2013-02-05
申请号：US12748109
申请日：2010-03-26
申请人： Satoru Ide , Moriyuki Kashiwa , Kazuo Kobayashi , Noriyuki Motimaru , Eiichi Yamamoto , Tomio Kubo , Hiroaki Kida
发明人： Satoru Ide , Moriyuki Kashiwa , Kazuo Kobayashi , Noriyuki Motimaru , Eiichi Yamamoto , Tomio Kubo , Hiroaki Kida
IPC分类号： B24B1/00 , B24B5/02
CPC分类号： B24B37/00
摘要： A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.
摘要翻译：一种平面化装置和方法，其通过以高生产量研磨和抛光衬底的后表面来使衬底平坦化，并且制造具有减少的附着污染物的半导体衬底。一种在半导体衬底装载/放电室中容纳各种机构元件的平面化装置，后表面抛光台室和后表面研磨台室。同时抛光两个基材的后表面抛光阶段的生产时间通常是研磨一个基板的后表面研磨阶段的生产时间的两倍。

4. 发明授权

US08047897B2 Substrate flat grinding device 有权
标题翻译：基材平面研磨装置
公开(公告)号：US08047897B2
公开(公告)日：2011-11-01
申请号：US12356793
申请日：2009-01-21
申请人： Moriyuki Kashiwa , Etsuo Fujita , Kazuo Kobayashi , Tomio Kubo
发明人： Moriyuki Kashiwa , Etsuo Fujita , Kazuo Kobayashi , Tomio Kubo
IPC分类号： B24B49/00
CPC分类号： B24B7/228 , B24B41/047
摘要： To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening plate 6 also is a load on the grindstone 14 that does the grinding, there is little deflection in the thickness distribution of the substrates that are obtained, even if they are semiconductor substrates having a large substrate diameter of 450 mm.
摘要翻译：为了提供高刚性的平面研磨装置，基板平面磨削装置具有三个具有运动联接的紧固板提升和降低机构以及将紧固板向上或向下移动的气缸杆。作为紧固板6的负载也是进行研磨的磨石14的载荷的高刚性研磨装置，即使是半导体基板，也可以获得所获得的基板的厚度分布的偏转小具有450mm的大的基材直径。

5. 发明授权

US5542164A Method for forming a barb on a tip of a fishhook 失效
标题翻译：在鱼钩的尖端上形成倒钩的方法
公开(公告)号：US5542164A
公开(公告)日：1996-08-06
申请号：US470056
申请日：1995-06-06
申请人： Shigekatsu Fujii , Naohiro Asada , Tomio Kubo
发明人： Shigekatsu Fujii , Naohiro Asada , Tomio Kubo
IPC分类号： A01K83/00 , B21F45/12
CPC分类号： A01K83/00 , Y10T29/22
摘要： A method for forming a barb of a fishhook including the steps of pressing a thin flat portion of the tip and either cutting or chipping a part of the barb to form a rear face on a side opposite the tip of the hook. At least either upper or lower lateral sides of the hook tip may be cut to form flat or concave lateral cut faces with a sharp edge along a ridge at a juncture of the lateral cut faces.
摘要翻译：一种用于形成鱼钩的倒钩的方法，包括以下步骤：挤压尖端的薄平坦部分，并且切割或切碎一部分倒钩以在与钩的尖端相对的一侧上形成后表面。钩尖的至少上侧或下侧可以被切割以形成平坦或凹入的侧向切割面，在横向切割面的接合处具有沿着脊的尖锐边缘。

6. 发明申请

US20110165823A1 SEMICONDUCTOR SUBSTRATE PLANARIZATION APPARATUS AND PLANARIZATION METHOD 失效
标题翻译：半导体基板平面设计和平面化方法
公开(公告)号：US20110165823A1
公开(公告)日：2011-07-07
申请号：US12748109
申请日：2010-03-26
申请人： Satoru IDE , Moriyuki Kashiwa , Kazuo Kobayashi , Noriyuki Motimaru , Eiichi Yamamoto , Tomio Kubo , Hiroaki Kida
发明人： Satoru IDE , Moriyuki Kashiwa , Kazuo Kobayashi , Noriyuki Motimaru , Eiichi Yamamoto , Tomio Kubo , Hiroaki Kida
IPC分类号： B24B1/00 , B24B41/00 , B24B7/10
CPC分类号： B24B37/00
摘要： A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.
摘要翻译：一种平面化装置和方法，其通过以高生产量研磨和抛光衬底的后表面来使衬底平坦化，并且制造具有减少的附着污染物的半导体衬底。一种在半导体衬底装载/放电室中容纳各种机构元件的平面化装置，后表面抛光台室和后表面研磨台室。同时抛光两个基材的后表面抛光阶段的生产时间通常是研磨一个基板的后表面研磨阶段的生产时间的两倍。

7. 发明申请

US20090203299A1 SUBSTRATE FLAT GRINDING DEVICE 有权
标题翻译：基板平面研磨装置
公开(公告)号：US20090203299A1
公开(公告)日：2009-08-13
申请号：US12356793
申请日：2009-01-21
申请人： Moriyuki KASHIWA , Etsuo Fujita , Kazuo Kobayashi , Tomio Kubo
发明人： Moriyuki KASHIWA , Etsuo Fujita , Kazuo Kobayashi , Tomio Kubo
IPC分类号： B24B41/04 , B24B7/20 , B24B41/00
CPC分类号： B24B7/228 , B24B41/047
摘要： To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening plate 6 also is a load on the grindstone 14 that does the grinding, there is little deflection in the thickness distribution of the substrates that are obtained, even if they are semiconductor substrates having a large substrate diameter of 450 mm.
摘要翻译：为了提供高刚性的平面研磨装置，基板平面磨削装置具有三个具有运动联接的紧固板提升和降低机构以及将紧固板向上或向下移动的气缸杆。作为紧固板6的负载也是进行研磨的磨石14的载荷的高刚性研磨装置，即使是半导体基板，也可以获得所获得的基板的厚度分布的偏转小具有450mm的大的基材直径。

8. 发明授权

US5526603A Fishhook having tip portion with upper and lower lateral cut faces and method of making the same 失效
标题翻译：鱼钩具有具有上侧和下侧切割面的尖端部分及其制造方法
公开(公告)号：US5526603A
公开(公告)日：1996-06-18
申请号：US301959
申请日：1994-09-07
申请人： Shigekatsu Fujii , Naohiro Asada , Tomio Kubo
发明人： Shigekatsu Fujii , Naohiro Asada , Tomio Kubo
IPC分类号： A01K83/00
CPC分类号： A01K83/00 , Y10T29/22
摘要： A fishhook including a fishhook body and a tip portion having a hook tip and a barb and extending from said hook tip to said barb, the tip portion having upper lateral cut faces and lower lateral cut faces on upper and lower lateral sides thereof and sharp edges extending from said hook tip to said barb along ridges at junctures of the upper lateral cut faces and of said lower lateral cut faces.
摘要翻译：一种鱼钩，包括鱼钩体和具有钩尖和倒钩的尖端部分，并且从所述钩尖延伸到所述倒钩，所述尖端部分在其上侧和下侧面上具有上横向切割面和下横向切割面，并且尖锐边缘在所述上横向切割面和所述下横向切割面的交界处沿着所述钩尖延伸到所述倒钩。

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