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    • 2. 发明授权
    • Method for manufacturing solar cell electrode
    • 制造太阳能电池电极的方法
    • US08691326B2
    • 2014-04-08
    • US13432371
    • 2012-03-28
    • Hiroki KojoMasakatsu KurokiHisashi Matsuno
    • Hiroki KojoMasakatsu KurokiHisashi Matsuno
    • B05D5/12B05D3/06
    • H01L31/022425H01B1/22Y02E10/50
    • A method for manufacturing a solar cell electrode, comprising the steps of: (a) applying a conductive paste for bus electrode to a wafer in order to form a bus electrode pattern; (b) depositing onto the wafer a photocurable conductive paste for finger electrode from a discharge slot of a dispenser nozzle to thereby form an uncured finger electrode pattern on the wafer, wherein the nozzle moves parallel to the wafer; and (c) curing the uncured finger electrode pattern by exposing the uncured finger electrode pattern to UV light either after forming the uncured finger electrode pattern on the wafer in the step (b), or concurrent with the step (b).
    • 一种制造太阳能电池电极的方法,包括以下步骤:(a)将用于总线电极的导电膏施加到晶片以形成总线电极图案; (b)从分配器喷嘴的排出槽向晶片上沉积用于指状电极的可光固化的导电膏,从而在晶片上形成未固化的指状电极图案,其中喷嘴平行于晶片移动; 或者在步骤(b)中在晶片上形成未固化的指状电极图案之后,或者与步骤(b)同时,将未固化的手指电极图案暴露于UV光下,以及(c)固化未固化的手指电极图案。
    • 3. 发明授权
    • Thermosetting electroconductive paste for electroconductive bump use
    • 导电凹凸使用的热固性导电膏
    • US06800223B2
    • 2004-10-05
    • US10223907
    • 2002-08-20
    • Hiroki KojoHisashi Matsuno
    • Hiroki KojoHisashi Matsuno
    • H01B122
    • H05K3/4069H01B1/22H05K1/095H05K3/4614H05K2201/0272H05K2203/1189
    • The invention is directed to a thermosetting electroconductive paste for forming electroconductive bumps at predetermined locations on at least one circuit layer that is laminated to an insulating layer. Upon lamination the electroconductive bumps penetrate the insulating layer forming an electrical connection to a second circuit layer. The paste comprises, based on total composition, 80 to 90 wt % electroconductive powders comprising at least a first and second electroconductive metal powder of which packing densities are in the range of 20% or less of the average density (sp. gr.) of metal for the first powder and 20 to 40% of the average density (sp. gr.) of metal for the second powder; and 10 to 20 wt % epoxy resin, curing agent, and solvent.
    • 本发明涉及一种热固性导电浆料,用于在至少一层层压到绝缘层上的电路层上的预定位置处形成导电凸块。 在层叠时,导电凸块穿透绝缘层,形成与第二电路层的电连接。 基于总组合,糊状物包含80-90重量%的导电粉末,其包含至少第一和第二导电金属粉末,其中填充密度在平均密度(sp。gr。)的20%或更小的范围内 用于第一粉末的金属和用于第二粉末的金属的平均密度(sp。gr。)的20至40%; 和10〜20重量%的环氧树脂,固化剂和溶剂。