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2. 发明申请

US20080035181A1 Cleaning apparatus 审中-公开
标题翻译：清洁装置
公开(公告)号：US20080035181A1
公开(公告)日：2008-02-14
申请号：US11888689
申请日：2007-08-02
申请人： Hirohiko Takahashi , Takashi Fujita
发明人： Hirohiko Takahashi , Takashi Fujita
IPC分类号： B08B3/10
CPC分类号： H01L21/67219 , H01L21/67173 , H01L21/67178 , H01L21/6719
摘要： It is an object of the invention to provide a cleaning apparatus which can subject wafers that have undergone polishing to various cleaning processes while reducing the usage amount of pure water, increase the processing speed of wafers per unit floor area and significantly improve the operating rate, enable change or rearrangement of a plurality of cleaning processing chambers to more optimum arrangement in accordance with the cleaning treatment processes and the like, prevent generation of defects in wafers that are in process of, for example, pre-treatment, and simplify the configuration of the apparatus.In order to achieve the above described object, the present invention provides a cleaning apparatus comprising cleaning lines 2A and 2B comprised of lower and upper two levels, each of the levels comprising a plurality of cleaning processing chambers 2a to 2d or 2e to 2h; a center transporting means 6 comprising a function of transporting a wafer to be processed into or a function of transporting the processed wafer from each of the cleaning processing chambers 2a to 2h in the lower-layer and upper-layer cleaning lines 2A and 2B; an inter-chamber transporting means 16 for sequentially transporting the wafer to the adjacent cleaning processing chamber in each of the lower-layer and upper-layer cleaning lines 2A and 2B; and an introducing means for introducing pure water used in the cleaning processing chamber, which carries out precision cleaning in the upper-layer cleaning line 2B, into the cleaning processing chamber, which carries out rough cleaning in the lower-layer cleaning line 2A, as washing water for the rough cleaning.
摘要翻译：本发明的目的是提供一种可以将经过抛光的晶片进行各种清洗处理的清洗装置，同时减少纯水的使用量，增加每单位面积的晶片的处理速度并显着地提高工作速率，能够根据清洁处理过程等使多个清洁处理室的更改或重新布置成更优化的布置，防止在例如预处理过程中生成晶片中的缺陷，并且简化该装置。为了实现上述目的，本发明提供了一种清洁装置，其包括由下部和上部两个层构成的清洁线2A和2B，每个层包括多个清洁处理室2a至2d或2 e至2小时; 中央传送装置6，其包括将待处理的晶片输送到或者从下一层清洁线路2A中的每个清洁处理室2a至2h输送经处理的晶片的功能;以及 2 B; 用于将晶片顺序地输送到下层和上层清洁线路2A和2B中的每一层中的相邻清洁处理室的腔室间传送装置16; 以及引入装置，用于将在上层清洁管线B中执行精密清洁的清洁处理室中使用的纯水引入到在下层清洁管线2A中进行粗略清洁的清洁处理室，作为洗涤水进行粗洗。

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