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1. 发明授权

US06940722B2 Heat-dissipating member, manufacturing method and installation method 失效
标题翻译：散热构件，制造方法和安装方法
公开(公告)号：US06940722B2
公开(公告)日：2005-09-06
申请号：US10347599
申请日：2003-01-22
申请人： Hiroaki Tetsuka , Kunihiko Mita , Kunihiro Yamada , Yoshitaka Aoki , Tsutomu Yoneyama
发明人： Hiroaki Tetsuka , Kunihiko Mita , Kunihiro Yamada , Yoshitaka Aoki , Tsutomu Yoneyama
IPC分类号： H01L23/427 , H05K7/20
CPC分类号： H01L23/427 , F28F2013/006 , H01L2924/0002 , Y10T428/31663 , H01L2924/00
摘要： A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 μm and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 μm. This heat-dissipating member is non-fluid at room temperature, but due to the action of heat emitted when the electronic component operates, its viscosity decreases, and it softens or melts based on the phase transition of the resin and low melting point metal so that it is effectively in intimate contact with the boundary between the electronic component and heat-dissipating component without any gaps. The thermally-conducting filler contains a low melting point metal powder (1) having a melting temperature of 40-250° C. and a particle diameter of 0.1-100 μm, together with a thermally-conducting powder (2) having a melting temperature exceeding 250° C. and an average particle diameter of 0.1-100 μm, such that (1)/[(1)+(2)]=0.2-1.0.
摘要翻译：夹在由于操作而达到比室温高的温度的散热电子部件之间的散热部件，以及用于散发由该散热电子部件产生的热量的散热部件。本发明的散热构件具有中间层，其包含厚度为1-50μm，导热率为10-500W / mK的金属箔和/或金属网，以及包括含有100 重量份硅树脂和1000-3,000重量份形成在中间层的两个表面上的导热填料，使得总厚度在40-500μm的范围内。该散热构件在室温下为非流体，但是由于电子部件运转时发出的热量的作用，其粘度降低，并且基于树脂和低熔点金属的相变而软化或熔化，因此它有效地与电子部件和散热部件之间的边界紧密接触而没有任何间隙。导热性填料含有熔融温度为40〜250℃，粒径为0.1〜100μm的低熔点金属粉末（1），以及具有熔融温度的导热性粉末（2）超过250℃，平均粒径为0.1-100μm，使得（1）/ [（1）+（2）] = 0.2-1.0。

2. 发明授权

US07141273B2 Curable organopolysiloxane composition and semiconductor device 有权
标题翻译：固化有机聚硅氧烷组合物和半导体器件
公开(公告)号：US07141273B2
公开(公告)日：2006-11-28
申请号：US10958251
申请日：2004-10-06
申请人： Akihiro Endo , Kunihiko Mita , Akio Nakano , Kunihiro Yamada , Hiroaki Kizaki , Hiroaki Tetsuka
发明人： Akihiro Endo , Kunihiko Mita , Akio Nakano , Kunihiro Yamada , Hiroaki Kizaki , Hiroaki Tetsuka
IPC分类号： B05D3/02
CPC分类号： H01L23/3737 , C08G77/12 , C08G77/18 , C08G77/20 , C08K3/08 , C08K5/5419 , C08L83/04 , C08L2205/02 , C08L2205/03 , C09K5/14 , H01L2224/16 , H01L2224/73253 , Y10T428/31663 , C08L83/00
摘要： Provided is a curable organopolysiloxane composition which includes (A) an organopolysiloxane containing at least 2 alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) gallium and/or an alloy thereof, with a melting point within a range from 0 to 70° C., optionally (D) a heat conductive filler with an average particle size within a range from 0.1 to 100 μm, (E) a platinum based catalyst, and (F) an addition reaction control agent. The composition is useful as a material capable of forming a layer with excellent thermal conductivity that is sandwiched between a heat generating electronic component and a heat radiating member.
摘要翻译：提供了一种可固化的有机基聚硅氧烷组合物，其包含（A）在每个分子内含有至少2个与硅原子键合的烯基的有机聚硅氧烷，（B）含有与每个分子内的硅原子键合的至少2个氢原子的有机氢聚硅氧烷，（C）镓和/或其合金，熔点在0-70℃的范围内，任选地（D）平均粒径在0.1-100μm范围内的导热填料，（E）铂基催化剂，（F）加成反应控制剂。该组合物可用作能够形成具有优异导热性的层的材料，其夹在发热电子部件和散热构件之间。

3. 发明申请

US20050084691A1 Curable organopolysiloxane composition and semiconductor device 有权
标题翻译：固化有机聚硅氧烷组合物和半导体器件
公开(公告)号：US20050084691A1
公开(公告)日：2005-04-21
申请号：US10958251
申请日：2004-10-06
申请人： Akihiro Endo , Kunihiko Mita , Akio Nakano , Kunihiro Yamada , Hiroaki Kizaki , Hiroaki Tetsuka
发明人： Akihiro Endo , Kunihiko Mita , Akio Nakano , Kunihiro Yamada , Hiroaki Kizaki , Hiroaki Tetsuka
IPC分类号： C08L83/07 , C08K3/08 , C08K5/5419 , C08L83/04 , C08L83/05 , C09K5/14 , H01L23/36 , H01L23/373 , H01L21/60
CPC分类号： H01L23/3737 , C08G77/12 , C08G77/18 , C08G77/20 , C08K3/08 , C08K5/5419 , C08L83/04 , C08L2205/02 , C08L2205/03 , C09K5/14 , H01L2224/16 , H01L2224/73253 , Y10T428/31663 , C08L83/00
摘要： Provided is a curable organopolysiloxane composition which includes (A) an organopolysiloxane containing at least 2 alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) gallium and/or an alloy thereof, with a melting point within a range from 0 to 70° C., optionally (D) a heat conductive filler with an average particle size within a range from 0.1 to 100 μm, (E) a platinum based catalyst, and (F) an addition reaction control agent. The composition is useful as a material capable of forming a layer with excellent thermal conductivity that is sandwiched between a heat generating electronic component and a heat radiating member.
摘要翻译：提供了一种可固化的有机基聚硅氧烷组合物，其包含（A）在每个分子内含有至少2个与硅原子键合的烯基的有机聚硅氧烷，（B）含有与每个分子内的硅原子键合的至少2个氢原子的有机氢聚硅氧烷，（C）镓和/或其合金，熔点在0-70℃的范围内，任选地（D）平均粒径在0.1-100μm范围内的导热填料，（E）铂基催化剂，（F）加成反应控制剂。该组合物可用作能够形成具有优异导热性的层的材料，其夹在发热电子部件和散热构件之间。

4. 发明授权

US06884660B2 Thermoconducting silicone composition, its curing product and installation method, and a heat dissipating structure of a semiconductor device using same 有权
标题翻译：热固性硅酮组合物，其固化产物和安装方法以及使用其的半导体器件的散热结构
公开(公告)号：US06884660B2
公开(公告)日：2005-04-26
申请号：US10316078
申请日：2002-12-11
申请人： Hiroaki Tetsuka , Kunihiro Yamada , Kunihiko Mita
发明人： Hiroaki Tetsuka , Kunihiro Yamada , Kunihiko Mita
IPC分类号： C08L83/04 , B23K31/00 , C08K3/00 , C08K3/08 , C08K3/10 , C08K5/5415 , C08L83/05 , C08L83/07 , C09K5/14 , H01L23/34 , H01L23/36 , H01L23/40
CPC分类号： C10M111/04 , C08G77/12 , C08G77/20 , C08L83/04 , C10M2201/053 , C10M2201/0623 , C10M2203/06 , C10M2205/20 , C10M2207/021 , C10M2207/20 , C10M2227/04 , C10M2229/0435 , C10M2229/0445 , C10N2210/07 , C10N2220/082 , C10N2240/20 , C10N2250/10 , H01L2224/73253 , C08L83/00 , C10N2210/03 , C10N2210/05 , C10N2210/04 , C10N2210/02
摘要： The present invention relates to a thermoconducting silicone composition having a viscosity at 25° C. before curing of 10-1,000 Pa·s, a method of installing the composition, and a heat dissipating structure comprising the silicone composition.
摘要翻译：本发明涉及一种热固化硅氧烷组合物，其固化前的25℃下的粘度为10-1000帕，安装该组合物的方法，以及包含硅氧烷组合物的散热结构。

5. 发明授权

US07538075B2 Heat-dissipating silicone grease composition 有权
标题翻译：散热硅脂组合物
公开(公告)号：US07538075B2
公开(公告)日：2009-05-26
申请号：US10996418
申请日：2004-11-26
申请人： Kunihiro Yamada , Hiroaki Tetsuka
发明人： Kunihiro Yamada , Hiroaki Tetsuka
IPC分类号： C10M169/04
CPC分类号： C08K3/08 , C08K3/22 , C08K2003/2227 , C08K2003/2296 , C08L83/04 , C10M169/02 , C10M2201/056 , C10M2201/0626 , C10M2203/102 , C10M2203/1025 , C10M2227/04 , C10M2227/045 , C10M2229/025 , C10M2229/0415 , C10N2210/02 , C10N2210/03 , C10N2230/02 , C10N2240/20 , C10N2240/201 , C10N2250/10 , C10N2250/121
摘要： A heat dissipating silicone grease composition comprising: (A) 3% to 30% by weight of an organo polysiloxane represented by the general formula, R1aSiO(4−a)/2(R1 is one or two or more groups selected from a group of saturated or unsaturated monovalent hydrocarbon groups containing one to eighteen carbon atoms, and a is a positive number defined by 1.8≦a≦2.2) having a dynamic viscosity at 25° C. of 50 mm2/s to 500,000 mm2/s; (B) 60% to 96.9% by weight of a thermally conductive filler having a thermal conductivity of at least 10 W/(m·K); and (C) 0.1% to 10% by weight of a solvent that disperses or dissolves component (A).
摘要翻译： 1.一种散热硅润滑脂组合物，其特征在于，含有：（A）3质量％〜30质量％的由通式R1aSiO（4-a）/ 2表示的有机聚硅氧烷（R1为1〜饱和或不饱和的含有1至18个碳原子的一价烃基，a为在25℃下的动态粘度为1.8≤a≤2.2的正数，为50mm 2 / s至500,000mm 2 / s; （B）热导率为10W /（m·K）以上的导热性填料的60〜96.9重量％。和（C）0.1〜10重量％的分散或溶解组分（A）的溶剂。

6. 发明申请

US20050110133A1 Heat-dissipating silicone grease composition 有权
标题翻译：散热硅脂组合物
公开(公告)号：US20050110133A1
公开(公告)日：2005-05-26
申请号：US10996418
申请日：2004-11-26
申请人： Kunihiro Yamada , Hiroaki Tetsuka
发明人： Kunihiro Yamada , Hiroaki Tetsuka
IPC分类号： C08K3/00 , C08K3/08 , C08K3/22 , C08L83/04 , C08L83/06 , C10M105/76 , C10M107/50 , C10M125/02 , C10M125/04 , C10M125/10 , C10M125/20 , C10M125/26 , C10M127/00 , C10M129/06 , C10M129/24 , C10M169/02 , C10N10/02 , C10N10/06 , C10N10/16 , C10N20/02 , C10N30/00 , C10N40/00 , C10N50/10 , C10N70/00 , H01L23/34
CPC分类号： C08K3/08 , C08K3/22 , C08K2003/2227 , C08K2003/2296 , C08L83/04 , C10M169/02 , C10M2201/056 , C10M2201/0626 , C10M2203/102 , C10M2203/1025 , C10M2227/04 , C10M2227/045 , C10M2229/025 , C10M2229/0415 , C10N2210/02 , C10N2210/03 , C10N2230/02 , C10N2240/20 , C10N2240/201 , C10N2250/10 , C10N2250/121
摘要： A heat dissipating silicone grease composition comprising: (A) 3% to 30% by weight of an organo polysiloxane represented by the general formula, R1aSiO(4−a)/2(R1 is one or two or more groups selected from a group of saturated or unsaturated monovalent hydrocarbon groups containing one to eighteen carbon atoms, and a is a positive number defined by 1.8≦a≦2.2) having a dynamic viscosity at 25° C. of 50 mm2/s to 500,000 mm2/s; (B) 60% to 96.9% by weight of a thermally conductive filler having a thermal conductivity of at least 10 W/(m·K); and (C) 0.1% to 10% by weight of a solvent that disperses or dissolves component (A).
摘要翻译：一种散热硅润滑脂组合物，其包含：（A）3重量％至30重量％的由通式表示的有机聚硅氧烷，R 1， 4-a）/ 2（R 1）是选自含有1至18个碳原子的饱和或不饱和一价烃基的一个或两个或更多个基团，a是正的在25℃下具有50mm 2 / s至500,000mm 2 / s的动态粘度的由1.8 <= a <= 2.2定义的数字）（B）热导率为10W /（m·K）以上的导热性填料的60〜96.9重量％。和（C）0.1〜10重量％的分散或溶解组分（A）的溶剂。

7. 发明申请

US20050261140A1 Silicone grease compositions 有权
标题翻译：硅油组合物
公开(公告)号：US20050261140A1
公开(公告)日：2005-11-24
申请号：US11133339
申请日：2005-05-20
申请人： Kunihiro Yamada , Akihiro Endo , Kunihiko Mita
发明人： Kunihiro Yamada , Akihiro Endo , Kunihiko Mita
IPC分类号： C08L83/04 , C10M111/04 , C10M169/02 , C10M13/04
CPC分类号： C10M111/04 , C08L83/04 , C10M169/02 , C10M2201/05 , C10M2201/053 , C10M2201/062 , C10M2201/0623 , C10M2201/10 , C10M2201/1006 , C10M2229/0405 , C10M2229/0415 , C10N2210/01 , C10N2210/02 , C10N2210/03 , C10N2220/02 , C10N2220/022 , C10N2230/02 , C10N2240/20 , C08L2666/54
摘要： A silicone grease composition is provided comprising (A) 2-40% by weight of an organopolysiloxane having a kinematic viscosity of 50-500,000 mm2/s at 25° C., and (B) 60-98% by weight of at least one heat conductive filler selected from among metal powders, metal oxide powders and ceramic powders having a thermal conductivity of at least 10 W/m° C. and an average particle size of 0.1-15.0 μm. Coarse particles are removed such that a 500-mesh oversize fraction is not more than 50 ppm and a 325-mesh oversize fraction is substantially zero.
摘要翻译：提供一种硅氧烷润滑脂组合物，其包含（A）2-40重量％的在25℃下运动粘度为50-500,000mm 2 / s的有机聚硅氧烷，和（B）60- 98重量％的至少一种导热填料，其选自金属粉末，金属氧化物粉末和具有至少10W / m℃的热导率和0.1-15.0μm的平均粒度的陶瓷粉末。粗颗粒被去除，使得500目过大的馏分不超过50ppm，325目过大的馏分基本为零。

8. 发明授权

US07510998B2 Silicon grease compositions 有权
标题翻译：硅油组合物
公开(公告)号：US07510998B2
公开(公告)日：2009-03-31
申请号：US11133339
申请日：2005-05-20
申请人： Kunihiro Yamada , Akihiro Endo , Kunihiko Mita
发明人： Kunihiro Yamada , Akihiro Endo , Kunihiko Mita
IPC分类号： C10M125/04 , C10M173/02 , C08L79/08
CPC分类号： C10M111/04 , C08L83/04 , C10M169/02 , C10M2201/05 , C10M2201/053 , C10M2201/062 , C10M2201/0623 , C10M2201/10 , C10M2201/1006 , C10M2229/0405 , C10M2229/0415 , C10N2210/01 , C10N2210/02 , C10N2210/03 , C10N2220/02 , C10N2220/022 , C10N2230/02 , C10N2240/20 , C08L2666/54
摘要： A silicone grease composition is provided comprising (A) 2-40% by weight of an organopolysiloxane having a kinematic viscosity of 50-500,000 mm2/s at 25° C., and (B) 60-98% by weight of at least one heat conductive filler selected from among metal powders, metal oxide powders and ceramic powders having a thermal conductivity of at least 10 W/m° C. and an average particle size of 0.1-15.0 μm. Coarse particles are removed such that a 500-mesh oversize fraction is not more than 50 ppm and a 325-mesh oversize fraction is substantially zero.
摘要翻译：提供一种硅氧烷润滑脂组合物，其包含（A）2-40重量％的在25℃下的运动粘度为50-500,000mm 2 / s的有机聚硅氧烷，和（B）60-98重量％的至少一种导热性填料选自金属粉末，金属氧化物粉末和导热率至少为10W / m℃，平均粒度为0.1〜15.0μm的陶瓷粉末。粗颗粒被去除，使得500目过大的馏分不超过50ppm，325目过大的馏分基本为零。

9. 发明授权

US08383005B2 Thermally conductive silicone grease composition 有权
标题翻译：导热硅油组合物
公开(公告)号：US08383005B2
公开(公告)日：2013-02-26
申请号：US13282797
申请日：2011-10-27
申请人： Kenichi Tsuji , Kunihiro Yamada , Hiroaki Kizaki , Nobuaki Matsumoto
发明人： Kenichi Tsuji , Kunihiro Yamada , Hiroaki Kizaki , Nobuaki Matsumoto
IPC分类号： C09K5/10 , C08G77/04 , C08G77/12 , C08G77/20
CPC分类号： C09K5/14 , C08G77/12 , C08G77/18 , C08G77/20 , C08L83/04
摘要： A thermally conductive silicone grease composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinetic viscosity of 5,000 to 100,000 mm2/s at 25° C.; (B) a hydrolyzable methylpolysiloxane having a trifunctional termination at one end and represented by the following general formula (2): wherein R2 represents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100; (C) a thermally conductive filler having a thermal conductivity of at least 10 W/m·° C.; (D) an organohydrogenpolysiloxane containing from 2 to 5 hydrogen atoms in one molecule directly bound to silicon atoms (Si—H groups); (E) a bonding aid having a triazine ring and at least one alkenyl group in one molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.
摘要翻译：一种导热硅脂组合物，其包含：（A）在一个分子中具有至少两个烯基的有机聚硅氧烷，其在25℃下的动力学粘度为5,000至100,000mm 2 / s; （B）在一端具有三官能终止并由以下通式（2）表示的可水解甲基聚硅氧烷：其中R2表示碳原子数1〜6的烷基，b为5〜100的整数。（C）具有至少10W / m·℃的导热率的导热填料; （D）在一个直接与硅原子结合的分子（Si-H基）中含有2至5个氢原子的有机氢聚硅氧烷; （E）在一个分子中具有三嗪环和至少一个烯基的键合助剂; 和（F）选自铂和铂化合物的催化剂。

10. 发明授权

US07463972B2 Navigation apparatus and method 失效
标题翻译：导航装置和方法
公开(公告)号：US07463972B2
公开(公告)日：2008-12-09
申请号：US10898940
申请日：2004-07-27
申请人： Kunihiro Yamada , Shino Kimura , Kihachi Hayashida , Minoru Ootake , Akihiro Nakajima , Nobuo Suzuki , Atsuya Ooshima
发明人： Kunihiro Yamada , Shino Kimura , Kihachi Hayashida , Minoru Ootake , Akihiro Nakajima , Nobuo Suzuki , Atsuya Ooshima
IPC分类号： G01C21/00
CPC分类号： G08G1/096811 , G01C21/3484 , G08G1/096716 , G08G1/09675 , G08G1/096775 , G08G1/096827 , G08G1/096838 , G08G1/09685 , G08G1/096872 , G08G1/096888
摘要： A navigation apparatus includes a memory that stores registered routes, wherein each registered route includes a previously traveled route, a corresponding starting point, and a corresponding destination point. The navigation apparatus includes a controller that searches for a route from a specified starting point to a specified destination point, compares the searched route with the registered routes, and utilizes, if a corresponding starting point is substantially identical to the specified starting point or a corresponding destination point is substantially identical to the specified destination point, a portion of a registered route including the substantially identical starting point or the substantially identical destination point as a navigation route.
摘要翻译：导航装置包括存储注册路由的存储器，其中每个注册路由包括先前行进的路由，对应的起始点和对应的目的地点。导航装置包括：控制器，搜索从指定起点到指定目的地点的路线，将搜索到的路线与登记的路线进行比较，并且如果对应的起点与指定的起点基本相同或相应的起点目的地点与指定的目的地点相同，包括基本上相同的出发点或与导航路线基本相同的目的地点的登记路线的一部分。

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