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1. 发明授权

US06749889B2 Method for producing mounting structure for an electronic component 失效
标题翻译：一种电子部件安装结构的制造方法
公开(公告)号：US06749889B2
公开(公告)日：2004-06-15
申请号：US10409400
申请日：2003-04-07
申请人： Hiroaki Takezawa , Tsutomu Mitani , Minehiro Itagaki , Yoshihiro Bessho , Kazuo Eda
发明人： Hiroaki Takezawa , Tsutomu Mitani , Minehiro Itagaki , Yoshihiro Bessho , Kazuo Eda
IPC分类号： B05D512
CPC分类号： H05K3/321 , B32B7/02 , B32B7/12 , H05K2201/09909 , H05K2201/10636 , H05K2201/10984 , H05K2203/0783 , H05K2203/121 , Y02P70/611 , Y10S428/901 , Y10T29/4913 , Y10T29/49147 , Y10T428/24066 , Y10T428/24917 , Y10T428/2495 , Y10T428/24975 , Y10T428/269 , Y10T428/31678 , Y10T428/31681
摘要： In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
摘要翻译：在包括通过导电粘合剂彼此电连接的第一电极和第二电极的安装结构中，至少一个电极和导电粘合剂之间的粘合部分的周边被电绝缘层覆盖，由此附着部分从外围加强。电绝缘层可以通过将导电粘合剂的粘合剂树脂组分溶解在溶剂中而形成。这增加了导电粘合剂中的导电填料的浓度，从而也增强了粘合部分的导电性。

2. 发明授权

US06376051B1 Mounting structure for an electronic component and method for producing the same 失效
公开(公告)号：US06376051B1
公开(公告)日：2002-04-23
申请号：US09519984
申请日：2000-03-07
申请人： Hiroaki Takezawa , Tsutomu Mitani , Minehiro Itagaki , Yoshihiro Bessho , Kazuo Eda
发明人： Hiroaki Takezawa , Tsutomu Mitani , Minehiro Itagaki , Yoshihiro Bessho , Kazuo Eda
IPC分类号： B32B300
CPC分类号： H05K3/321 , B32B7/02 , B32B7/12 , H05K2201/09909 , H05K2201/10636 , H05K2201/10984 , H05K2203/0783 , H05K2203/121 , Y02P70/611 , Y10S428/901 , Y10T29/4913 , Y10T29/49147 , Y10T428/24066 , Y10T428/24917 , Y10T428/2495 , Y10T428/24975 , Y10T428/269 , Y10T428/31678 , Y10T428/31681
摘要： In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

3. 发明授权

US06569512B2 Mounting structure for an electronic component and method for producing the same 失效
公开(公告)号：US06569512B2
公开(公告)日：2003-05-27
申请号：US09965768
申请日：2001-09-27
申请人： Hiroaki Takezawa , Tsutomu Mitani , Minehiro Itagaki , Yoshihiro Bessho , Kazuo Eda
发明人： Hiroaki Takezawa , Tsutomu Mitani , Minehiro Itagaki , Yoshihiro Bessho , Kazuo Eda
IPC分类号： B32B1508
CPC分类号： H05K3/321 , B32B7/02 , B32B7/12 , H05K2201/09909 , H05K2201/10636 , H05K2201/10984 , H05K2203/0783 , H05K2203/121 , Y02P70/611 , Y10S428/901 , Y10T29/4913 , Y10T29/49147 , Y10T428/24066 , Y10T428/24917 , Y10T428/2495 , Y10T428/24975 , Y10T428/269 , Y10T428/31678 , Y10T428/31681
摘要： In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

4. 发明申请

US20050098338A1 Electronic part, and electronic part mounting element and an process for manufacturing such the articles 失效
标题翻译：电子部件和电子部件安装元件及其制造方法
公开(公告)号：US20050098338A1
公开(公告)日：2005-05-12
申请号：US11009045
申请日：2004-12-13
申请人： Takashi Kitae , Tsutomu Mitani , Yukihiro Ishimaru , Hiroaki Takezawa
发明人： Takashi Kitae , Tsutomu Mitani , Yukihiro Ishimaru , Hiroaki Takezawa
IPC分类号： H01L21/60 , H01L23/485 , H05K3/32 , H02G3/08
CPC分类号： H01L24/10 , H01L24/13 , H01L24/29 , H01L24/83 , H01L2224/13 , H01L2224/13099 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29318 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/19041 , H05K3/321 , H05K2201/10636 , H05K2201/10689 , H05K2201/10909 , H05K2203/0307 , H05K2203/1446 , Y02P70/611 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element. Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 μm or more and to 10.0 μm or less and preferably to 1.0 μm or more and to 5.0 μm or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
摘要翻译：电子部件4的外部电极3的表面形成有含有树脂成分的涂层。因此，通过导电粘合剂的介质将电子部件安装到电路板1上可以显着改善粘附强度和可靠性。此外，通过利用形成作为连接元件的外部电极3的导电粘合剂，能够将电子部件安装到要安装的元件上。此外，电子部件的外部电极3的表面粗糙度（R a1 a）设定为0.1μm以上至10.0μm以下，优选为1.0μm以上且5.0μm以下。因此，与传统的电子部件相比，与导电粘合剂的粘附强度可以显着提高。

5. 发明授权

US06510059B2 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module 失效
公开(公告)号：US06510059B2
公开(公告)日：2003-01-21
申请号：US09889523
申请日：2001-07-18
申请人： Tsutomu Mitani , Yukihiro Ishimaru , Takashi Kitae , Hiroaki Takezawa
发明人： Tsutomu Mitani , Yukihiro Ishimaru , Takashi Kitae , Hiroaki Takezawa
IPC分类号： H05K118
CPC分类号： H05K3/321 , C09J9/02 , H01L23/49883 , H01L2924/0002 , H05K3/305 , H05K2201/10636 , H05K2201/10977 , H05K2203/0278 , H05K2203/0783 , Y02P70/611 , Y10S205/925 , Y10T29/4913 , Y10T29/49146 , H01L2924/00
摘要： In mounting an electronic component using a conductive resin, a conductive resin containing a specific diluent component is used as the conductive resin, or a specific diluent component is applied to the conductive resin before being cured. This allows connection in a portion where an electrode (5) of an electronic component (4) and an electrode (2) of a circuit substrate (1) are opposed to each other to be provided via a resin (3a) containing a conductive filler as a main component, and allows connection at a lower surface of the electronic component (4) and connection in vicinities of the electrode (5) to be provided via a resin (3b, 3c) containing a binder resin as a main component that has oozed out of the conductive resin. The resin (3b, 3c) containing the binder resin as the main component increases junction strength.

6. 发明授权

US06814893B2 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure 失效
标题翻译：导电胶粘剂，包装结构及其制造方法
公开(公告)号：US06814893B2
公开(公告)日：2004-11-09
申请号：US10613042
申请日：2003-07-07
申请人： Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Tsutomu Mitani , Tousaku Nishiyama
发明人： Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Tsutomu Mitani , Tousaku Nishiyama
IPC分类号： H01B122
CPC分类号： H01L24/83 , C09J9/02 , H01B1/22 , H01L23/49883 , H01L24/28 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29439 , H01L2224/29444 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/8319 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/1579 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H05K3/321 , H05K13/0469 , H05K2201/0769 , H05K2201/10636 , H05K2201/10674 , H05K2203/121 , Y02P70/611 , Y10T428/2982 , Y10T428/2984 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05599
摘要： A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.

7. 发明授权

US06675474B2 Electronic component mounted member and repair method thereof 有权
标题翻译：电子元件安装件及其修理方法
公开(公告)号：US06675474B2
公开(公告)日：2004-01-13
申请号：US10309597
申请日：2002-12-03
申请人： Tsutomu Mitani , Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Yasuhiro Suzuki
发明人： Tsutomu Mitani , Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Yasuhiro Suzuki
IPC分类号： H05K1300
CPC分类号： H05K3/321 , H05K2201/0129 , H05K2201/10992 , H05K2203/176 , H05K2203/306 , Y10T29/49172
摘要： An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100° C. to 300° C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board. This electronic component mounted member is used, and when a repair is necessary, a portion of the intermediate layer corresponding to the electronic component to be repaired is heated so as to raise a temperature of this portion to at least a melting point of the thermoplastic insulating adhesive, thereby melting the thermoplastic insulating adhesive. Then, the electronic component is removed with this state maintained.
摘要翻译：电子部件安装部件包括电路板，连接到电路板的电子部件和插入在电子部件和电路板之间的导电粘合剂。在导电粘合剂和电路板的电极的接合界面中，由软化温度为100℃至300℃的热塑性绝缘粘合剂形成的中间层介于导电粘合剂和电极。包含在导电粘合剂中的导电填料部分地存在于中间层中，从而允许导电粘合剂和电路板的电极之间的导电。使用该电子部件安装部件，当需要修理时，对应于要修复的电子部件的中间层的一部分被加热，以将该部分的温度升高至热塑性绝缘体的至少熔点粘合剂，从而熔化热塑性绝缘粘合剂。然后，保持该状态，去除电子部件。

8. 发明授权

US06666994B2 Conductive adhesive and packaging structure using the same 有权
公开(公告)号：US06666994B2
公开(公告)日：2003-12-23
申请号：US10309426
申请日：2002-12-03
申请人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani , Tousaku Nishiyama
发明人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani , Tousaku Nishiyama
IPC分类号： H01L2314
CPC分类号： H01B1/22 , C09J9/02 , H01L2924/181 , H05K3/321 , H05K3/323 , H05K2201/0272 , H05K2201/0769 , Y10T428/12069 , Y10T428/1209 , Y10T428/12111 , Y10T428/12139 , Y10T428/12528 , Y10T428/25 , H01L2924/00012
摘要： The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.

9. 发明授权

US06756663B2 Semiconductor device including wiring board with three dimensional wiring pattern 有权
标题翻译：半导体器件包括具有三维布线图案的布线板
公开(公告)号：US06756663B2
公开(公告)日：2004-06-29
申请号：US10337879
申请日：2003-01-08
申请人： Tsukasa Shiraishi , Tsutomu Mitani , Kazuyoshi Amami , Yoshihiro Bessho
发明人： Tsukasa Shiraishi , Tsutomu Mitani , Kazuyoshi Amami , Yoshihiro Bessho
IPC分类号： H05K346
CPC分类号： H01L21/563 , H01L23/5385 , H01L24/45 , H01L24/48 , H01L25/0652 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/19041 , H01L2924/19106 , H01L2924/19107 , H05K1/0284 , H05K1/141 , H05K1/147 , H05K1/189 , H05K3/328 , H05K3/3421 , H05K3/3442 , H05K3/363 , H05K3/368 , H05K2201/056 , H05K2201/10386 , H05K2201/10674 , H05K2203/049 , H05K2203/1572 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor elements without using the chip-on-chip configuration. Semiconductor elements are mounted on both sides of a wiring board having three-dimensional wiring including inner via holes so that the semiconductor elements oppose each other via the wiring board. The electrodes of the semiconductor elements are connected with each other by the three-dimensional wiring of the wiring board.
摘要翻译：半导体器件通过将半导体元件安装在具有包括内通孔的三维布线的布线板的两侧上而制成。通过采用半导体元件的叠层结构而不使用片上芯片配置，可以实现高工作速度和较小尺寸。半导体元件安装在具有包括内部通孔的三维布线的布线板的两侧，使得半导体元件经由布线板彼此相对。半导体元件的电极通过布线板的三维布线彼此连接。

10. 发明授权

US06525414B2 Semiconductor device including a wiring board and semiconductor elements mounted thereon 有权
标题翻译：包括安装在其上的布线板和半导体元件的半导体器件
公开(公告)号：US06525414B2
公开(公告)日：2003-02-25
申请号：US09725283
申请日：2000-11-29
申请人： Tsukasa Shiraishi , Tsutomu Mitani , Kazuyoshi Amami , Yoshihiro Bessho
发明人： Tsukasa Shiraishi , Tsutomu Mitani , Kazuyoshi Amami , Yoshihiro Bessho
IPC分类号： H05K346
CPC分类号： H01L21/563 , H01L23/5385 , H01L24/45 , H01L24/48 , H01L25/0652 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/19041 , H01L2924/19106 , H01L2924/19107 , H05K1/0284 , H05K1/141 , H05K1/147 , H05K1/189 , H05K3/328 , H05K3/3421 , H05K3/3442 , H05K3/363 , H05K3/368 , H05K2201/056 , H05K2201/10386 , H05K2201/10674 , H05K2203/049 , H05K2203/1572 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor elements without using the chip-on-chip configuration. Semiconductor elements are mounted on both sides of a wiring board having three-dimensional wiring including inner via holes so that the semiconductor elements oppose each other via the wiring board. The electrodes of the semiconductor elements are connected with each other by the three-dimensional wiring of the wiring board.
摘要翻译：半导体器件通过将半导体元件安装在具有包括内通孔的三维布线的布线板的两侧上而制成。通过采用半导体元件的叠层结构而不使用片上芯片配置，可以实现高工作速度和较小尺寸。半导体元件安装在具有包括内部通孔的三维布线的布线板的两侧，使得半导体元件经由布线板彼此相对。半导体元件的电极通过布线板的三维布线彼此连接。

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