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    • 6. 发明授权
    • Semiconductor device having insulated gate bipolar transistor with dielectric isolation structure
    • 具有绝缘栅双极晶体管的半导体器件,具有绝缘隔离结构
    • US06677622B2
    • 2004-01-13
    • US10090823
    • 2002-03-06
    • Fumito SuzukiHitoshi TakahashiHaruki AraiYoshihiro Yamaguchi
    • Fumito SuzukiHitoshi TakahashiHaruki AraiYoshihiro Yamaguchi
    • H01L2974
    • H01L29/66325H01L29/7394
    • A semiconductor substrate is of first-conductivity-type and has a principal surface. A first semiconductor region and a second semiconductor region are of second-conductivity-type and formed apart from each other in the principal surface of the semiconductor substrate. A third semiconductor region is of second-conductivity-type and formed on the first semiconductor region. The third semiconductor region has an impurity concentration higher than that of the first semiconductor region. A fourth semiconductor region is of first-conductivity-type and formed on the third semiconductor region. A first main electrode is formed on the fourth semiconductor region. A second main electrode is formed on the second semiconductor region. A gate electrode is formed, at least on the first semiconductor region and on the principal surface of the semiconductor substrate between the fourth semiconductor region and the second semiconductor region, with a gate insulating film therebetween.
    • 半导体衬底是第一导电型并具有主表面。 第一半导体区域和第二半导体区域是第二导电型并且在半导体衬底的主表面中彼此分开形成。 第三半导体区域是第二导电型并形成在第一半导体区域上。 第三半导体区域的杂质浓度高于第一半导体区域。 第四半导体区域是第一导电型并形成在第三半导体区域上。 第一主电极形成在第四半导体区域上。 第二主电极形成在第二半导体区域上。 至少在第一半导体区域和第四半导体区域与第二半导体区域之间的半导体衬底的主表面上形成栅电极,其间具有栅极绝缘膜。
    • 9. 发明授权
    • Lateral semiconductor device
    • 侧面半导体器件
    • US06713794B2
    • 2004-03-30
    • US09897058
    • 2001-07-03
    • Fumito Suzuki
    • Fumito Suzuki
    • H01L2976
    • H01L29/7824H01L29/0619H01L29/66325H01L29/7394H01L2924/0002H01L2924/00
    • A semiconductor device including a semiconductor base, a first semiconductor region formed in the semiconductor base, a second semiconductor region formed in the semiconductor base, a third semiconductor region formed in the first semiconductor region, a first main electrode which is formed on the first and third semiconductor regions, a second main electrode which is formed on the second semiconductor region, an insulating film formed on the semiconductor base and first semiconductor region, and a gate electrode formed on the insulating film. The fourth semiconductor region is formed in the semiconductor base between the first and second semiconductor regions below an end region of the gate electrode.
    • 一种半导体器件,包括半导体基底,形成在半导体基底中的第一半导体区域,形成在半导体基底中的第二半导体区域,形成在第一半导体区域中的第三半导体区域,形成在第一半导体区域中的第一主电极 第三半导体区域,形成在第二半导体区域上的第二主电极,形成在半导体基底和第一半导体区域上的绝缘膜,以及形成在绝缘膜上的栅电极。 第四半导体区域形成在栅电极的端部区域下方的第一和第二半导体区域之间的半导体基底中。
    • 10. 发明授权
    • Photosensitive solder resist ink, printed circuit board and production
thereof
    • 感光性阻焊油墨,印刷电路板及其制造
    • US5821031A
    • 1998-10-13
    • US648002
    • 1996-05-22
    • Soichi HashimotoFumito SuzukiToshikazu Oda
    • Soichi HashimotoFumito SuzukiToshikazu Oda
    • G03F7/027G03F7/033G03F7/038H05K3/28G03F7/40G03F7/028G03F7/38
    • G03F7/033G03F7/027G03F7/0388H05K3/287
    • Disclosed herein is a photosensitive solder resist ink capable of development with a dilute alkaline solution. It has a wide pre-curing latitude. It permits the pre-cured board to be stored for a long period of time. It is superior in resolution, sensitivity, and solder resistance. Disclosed also herein is a printed circuit board having good adhesion, chemical resistance, electrical properties, gold plating resistance, solder heat resistance, and electrocorrosion resistance. Disclosed also herein is a process for producing said printed circuit board by using said solder resist ink. The photosensitive solder resist ink comprises (A) an ultraviolet-curable resin containing 0-20 wt % of aromatic ring moiety which is obtained by reacting a polymer composed of (a) 40-100 mol % of ethylenically unsaturated monomer having an epoxy group and (b) 0-60 mol % of ethylenically unsaturated monomer capable of copolymerization therewith, with (meth)acrylic acid in an amount of 0.7-1.2 equivalents per epoxy equivalent of said polymer and with a saturated or unsaturated polybasic acid anhydride; (B) an epoxy compound soluble in a diluent; (C) a photopolymerization initiator; and (D) a diluent.
    • PCT No.PCT / JP95 / 02017 Sec。 371日期:1996年5月22日 102(e)日期1996年5月22日PCT提交1995年10月2日PCT公布。 公开号WO96 / 11239 日期1996年4月18日在此公开的是能够用稀碱溶液显影的感光性阻焊油墨。 它具有宽的预固化纬度。 它允许预固化板长时间存放。 它在分辨率,灵敏度和焊料阻力方面优越。 此处还公开了具有良好的附着力,耐化学性,电性能,耐镀金性,焊料耐热性和耐电腐蚀性的印刷电路板。 本文还公开了通过使用所述阻焊油墨制造所述印刷电路板的方法。 感光性阻焊油墨包含(A)含有0〜20重量%芳香环部分的紫外线固化树脂,其通过使(a)40-100摩尔%的具有环氧基的烯属不饱和单体和 (b)0-60摩尔%能够与其共聚的烯属不饱和单体,与(甲基)丙烯酸的量相对于所述聚合物的环氧当量为0.7-1.2当量和饱和或不饱和多元酸酐; (B)可溶于稀释剂的环氧化合物; (C)光聚合引发剂; 和(D)稀释剂。