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1. 发明授权

US07829754B2 Method of cleaning heavy metals-containing soil 失效
标题翻译：清洁含重金属的土壤的方法
公开(公告)号：US07829754B2
公开(公告)日：2010-11-09
申请号：US11662343
申请日：2005-09-09
申请人： Hideo Tamura , Takeshi Sato , Munechika Honda
发明人： Hideo Tamura , Takeshi Sato , Munechika Honda
IPC分类号： A62D3/30 , A62D3/33 , A62D3/00 , A62D3/02 , C02F3/32 , C02F3/34 , B09B3/00 , B09C1/10 , C12P1/00 , C12S3/00
CPC分类号： B09C1/105
摘要： A soil cleaning method (phytoremediation) of absorbing a contaminating substance contained in a contaminated soil by a plant to clean the soil. An object of the present invention is to provide a method of cleaning a contaminated soil which performs cleaning of a soil containing heavy metals in a shorter term than before and, at the same time, utilizes phytoremediation having little influence on the environment. The object is attained by absorbing heavy metals by a plant of Polygonaceae family, Fagopyrum genus, and, at the same time, adding a biodegradable chelating agent to a contaminated soil in order to assist the absorption. And, a biodegradable chelating agent having the high heavy metal dissolving out ability not only enhances the cleaning efficacy but also reduces secondary influence on the environment.
摘要翻译：用植物吸收污染土壤中污染物质的土壤清洁方法（植物修复）来清洁土壤。本发明的目的是提供一种清洁污染土壤的方法，所述污染土壤在比以前更短的时间内对含有重金属的土壤进行清洁，并且同时利用对环境几乎没有影响的植物修复。该目的是通过gon科科（Fagopyrum）属的植物吸收重金属，同时在污染的土壤中加入可生物降解的螯合剂以辅助吸收。而且，具有高重金属溶解能力的生物降解性螯合剂不仅提高了清洗效果，而且还降低了对环境的二次影响。

2. 发明申请

US20080071130A1 Method Of Cleaning Heavy Metals-Containing Soil 失效
标题翻译：清洁含重金属的土壤的方法
公开(公告)号：US20080071130A1
公开(公告)日：2008-03-20
申请号：US11662343
申请日：2005-09-09
申请人： Hideo Tamura , Takeshi Sato , Munechika Honda
发明人： Hideo Tamura , Takeshi Sato , Munechika Honda
IPC分类号： B09C1/10 , A01G1/00 , B09C1/08
CPC分类号： B09C1/105
摘要： A soil cleaning method (phytoremediation) of absorbing a contaminating substance contained in a contaminated soil by a plant to clean the soil. An object of the present invention is to provide a method of cleaning a contaminated soil which performs cleaning of a soil containing heavy metals in a shorter term than before and, at the same time, utilizes phytoremediation having little influence on the environment. The object is attained by absorbing heavy metals by a plant of Polygonaceae family, Fagopyrum genus, and, at the same time, adding a biodegradable chelating agent to a contaminated soil in order to assist the absorption. And, a biodegradable chelating agent having the high heavy metal dissolving out ability not only enhances the cleaning efficacy but also reduces secondary influence on the environment.
摘要翻译：用植物吸收污染土壤中污染物质的土壤清洁方法（植物修复）来清洁土壤。本发明的目的是提供一种清洁污染土壤的方法，所述污染土壤在比以前更短的时间内对含有重金属的土壤进行清洁，并且同时利用对环境几乎没有影响的植物修复。该目的是通过gon科科（Fagopyrum）属的植物吸收重金属，同时在污染的土壤中加入可生物降解的螯合剂以辅助吸收。而且，具有高重金属溶解能力的生物降解性螯合剂不仅提高了清洗效果，而且还降低了对环境的二次影响。

3. 发明授权

US08943690B2 Method for manufacturing substrate for liquid ejection head and method for manufacturing liquid ejection head 有权
标题翻译：液体喷射头用基板的制造方法及液体喷射头的制造方法
公开(公告)号：US08943690B2
公开(公告)日：2015-02-03
申请号：US13216069
申请日：2011-08-23
申请人： Yuzuru Ishida , Takuya Hatsui , Kazuaki Shibata , Takeru Yasuda , Ryoji Oohashi , Yoshiyuki Imanaka , Koichi Omata , Hideo Tamura , Kousuke Kubo , Yuji Tamaru
发明人： Yuzuru Ishida , Takuya Hatsui , Kazuaki Shibata , Takeru Yasuda , Ryoji Oohashi , Yoshiyuki Imanaka , Koichi Omata , Hideo Tamura , Kousuke Kubo , Yuji Tamaru
IPC分类号： B21D53/76 , B23P17/00 , B41J2/14 , B41J2/16
CPC分类号： B41J2/1404 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1639 , B41J2/1642 , B41J2/1646 , Y10T29/42 , Y10T29/49004 , Y10T29/49401 , Y10T156/1056
摘要： When protective portions are independently provided for each energy generation element, a leakage current inspection between the protective portions and the energy generation elements cannot be performed at once. Therefore, there is a concern that the inspection in manufacturing a substrate for liquid ejection head requires time. Therefore, the substrate for liquid ejection head is manufactured by performing a leakage current inspection between a connecting portion that is electrically connected to plurality of protective portions and a terminal to which the plurality of energy generation elements are connected, and thereafter removing the connecting portion.
摘要翻译：当为每个能量产生元件独立提供保护部分时，不能立即执行保护部分和能量产生元件之间的泄漏电流检查。因此，在制造液体喷射头用基板时的检查需要时间。因此，通过在与多个保护部分电连接的连接部分与多个能量产生元件连接的端子之间进行泄漏电流检查，然后除去连接部分来制造用于喷液头的基板。

4. 发明授权

US08884327B2 Semiconductor light emitting device and method for manufacturing same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US08884327B2
公开(公告)日：2014-11-11
申请号：US12886709
申请日：2010-09-21
申请人： Yoshiaki Sugizaki , Hideki Shibata , Akihiro Kojima , Masayuki Ishikawa , Hideo Tamura , Tetsuro Komatsu
发明人： Yoshiaki Sugizaki , Hideki Shibata , Akihiro Kojima , Masayuki Ishikawa , Hideo Tamura , Tetsuro Komatsu
IPC分类号： H01L33/00 , H01L33/50 , H01L33/44 , H01L33/38 , H01L33/62 , H01L33/48
CPC分类号： H01L33/0066 , H01L27/15 , H01L33/0075 , H01L33/0079 , H01L33/38 , H01L33/44 , H01L33/48 , H01L33/486 , H01L33/50 , H01L33/62 , H01L2924/0002 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2924/00
摘要： According to one embodiment, a semiconductor light emitting device includes a light emitting chip and a fluorescent material layer. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, and a resin layer. The semiconductor layer includes a light emitting layer, a first major surface, and a second major surface formed on a side opposite to the first major surface. The fluorescent material layer is provided on the first major surface and has a larger planer size than the light emitting chip.
摘要翻译：根据一个实施例，半导体发光器件包括发光芯片和荧光材料层。发光芯片包括半导体层，第一电极，第二电极，绝缘层，第一互连层，第二互连层，第一金属柱，第二金属柱和树脂层。半导体层包括形成在与第一主表面相对的一侧上的发光层，第一主表面和第二主表面。荧光材料层设置在第一主表面上，并且具有比发光芯片更大的平面尺寸。

5. 发明授权

US08523329B2 Inkjet printhead substrate, inkjet printhead, and inkjet printing apparatus 有权
标题翻译：喷墨打印头基板，喷墨打印头和喷墨打印设备
公开(公告)号：US08523329B2
公开(公告)日：2013-09-03
申请号：US13023849
申请日：2011-02-09
申请人： Yuji Tamaru , Yoshiyuki Imanaka , Hideo Tamura
发明人： Yuji Tamaru , Yoshiyuki Imanaka , Hideo Tamura
IPC分类号： B41J2/05
CPC分类号： B41J2/14129 , B41J29/38
摘要： An inkjet printhead substrate includes: a pair of individual conductive layers configured to supply electrical power to a heat generation element; a first common conductive layer configured to be connected to one of the pair of individual conductive layers; a second common conductive layer configured to be connected to the other of the pair of individual conductive layers; and an isolation layer configured to be provided between the one of the pair of individual conductive layers and the first common conductive layer, and between the other of the pair of individual conductive layers and the second common conductive layer, wherein the isolation layer is formed from a conductive material which has a lower solubility in ink than a material used for the pairs of individual conductive layers, the first common conductive layer and the second common conductive layer.
摘要翻译：喷墨打印头基板包括：一对单独的导电层，被配置为向发热元件供电; 第一公共导电层，被配置为连接到所述一对单独的导电层之一; 第二公共导电层，被配置为连接到所述一对独立导电层中的另一个; 以及隔离层，其被配置为设置在所述一对独立导电层中的一个和所述第一公共导电层之间以及所述一对独立导电层和所述第二公共导电层中的另一个之间，其中所述隔离层由导电材料，其在油墨中的溶解度低于用于成对的各个导电层，第一公共导电层和第二公共导电层的材料。

6. 发明授权

US08436378B2 Semiconductor light emitting device and method for manufacturing same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US08436378B2
公开(公告)日：2013-05-07
申请号：US12817592
申请日：2010-06-17
申请人： Akihiro Kojima , Yoshiaki Sugizaki , Hideki Shibata , Hideo Tamura , Tetsuro Komatsu , Masayuki Ishikawa
发明人： Akihiro Kojima , Yoshiaki Sugizaki , Hideki Shibata , Hideo Tamura , Tetsuro Komatsu , Masayuki Ishikawa
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/50 , H01L33/504 , H01L2224/16
摘要： According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, an insulating film, a first interconnection, a second interconnection, a first metal pillar, a second metal pillar, a resin, and a fluorescent layer. The semiconductor layer has a first major surface, a second major surface formed on an opposite side to the first major surface, and a light emitting layer. The first electrode and the second electrode are provided on the second major surface of the semiconductor layer. The fluorescent layer faces to the first major surface of the semiconductor layer and includes a plurality of kinds of fluorescent materials having different peak wavelengths of emission light.
摘要翻译：根据一个实施例，半导体发光器件包括半导体层，第一电极，第二电极，绝缘膜，第一互连，第二互连，第一金属柱，第二金属柱，树脂和荧光层。半导体层具有第一主表面，与第一主表面相反的一侧形成的第二主表面和发光层。第一电极和第二电极设置在半导体层的第二主表面上。荧光层面向半导体层的第一主表面，并且包括发射光的不同峰值波长的多种荧光材料。

7. 发明授权

US08433952B2 Memory access control device, memory access control method and memory access control program 有权
标题翻译：内存访问控制设备，内存访问控制方法和内存访问控制程序
公开(公告)号：US08433952B2
公开(公告)日：2013-04-30
申请号：US12731773
申请日：2010-03-25
申请人： Hideo Tamura
发明人： Hideo Tamura
IPC分类号： G06F11/07
CPC分类号： G06F13/1668
摘要： A memory access control device has a memory control unit and a software execution unit executing software. The memory control unit has: a data transmission unit configured to perform multicast transfer that reads a data from the memory and transmits the data to data transfer destinations through a network; a data reception unit configured to receive multicast transfer data from the network; and a reception data counter configured to indicate a number of multicast transfer data received by the data reception unit. The software execution unit instructs the memory control unit to perform a plurality of multicast transfers and then reads respective reception data counters of the data transfer destinations for each checkpoint in sequence of the software to determine completion of the plurality of multicast transfers.
摘要翻译：存储器访问控制装置具有执行软件的存储器控制单元和软件执行单元。存储器控制单元具有：数据发送单元，被配置为执行从存储器读取数据并通过网络将数据发送到数据传送目的地的多播传送; 数据接收单元，被配置为从所述网络接收组播传送数据; 以及接收数据计数器，被配置为指示由数据接收单元接收的多播传送数据的数量。软件执行单元指示存储器控制单元执行多个多播传输，然后按软件顺序读取每个检查点的数据传送目的地的各个接收数据计数器，以确定多个多播传输的完成。

8. 发明授权

US08373192B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US08373192B2
公开(公告)日：2013-02-12
申请号：US12883745
申请日：2010-09-16
申请人： Yoshiaki Sugizaki , Hideki Shibata , Akihiro Kojima , Masayuki Ishikawa , Hideo Tamura , Tetsuro Komatsu
发明人： Yoshiaki Sugizaki , Hideki Shibata , Akihiro Kojima , Masayuki Ishikawa , Hideo Tamura , Tetsuro Komatsu
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/0079 , H01L33/508 , H01L33/58 , H01L2224/11 , H01L2924/0002 , H01L2924/3511 , H01L2933/0016 , H01L2933/0066 , H01L2924/00
摘要： According to one embodiment, a semiconductor light emitting device includes a plurality of semiconductor layers, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar and a resin layer, and is mounted in a bent state on a curved surface. The plurality of semiconductor layers includes a first main surface, a second main surface opposite to the first main surface, and a light emitting layer, the plurality of semiconductor layers being separated from one another. A material is provided between the plurality of the semiconductor layers separated from one another. The member has a higher flexibility than the semiconductor layers being.
摘要翻译：根据一个实施例，半导体发光器件包括多个半导体层，第一电极，第二电极，绝缘层，第一互连层，第二互连层，第一金属柱，第二金属柱和树脂层，并且以弯曲状态安装在弯曲表面上。多个半导体层包括第一主表面，与第一主表面相对的第二主表面和发光层，所述多个半导体层彼此分离。在彼此分离的多个半导体层之间提供材料。该构件具有比半导体层更高的柔性。

9. 发明申请

US20110297994A1 SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
标题翻译：半导体发光器件
公开(公告)号：US20110297994A1
公开(公告)日：2011-12-08
申请号：US12883745
申请日：2010-09-16
申请人： Yoshiaki Sugizaki , Hideki Shibata , Akihiro Kojima , Masayuki Ishikawa , Hideo Tamura , Tetsuro Komatsu
发明人： Yoshiaki Sugizaki , Hideki Shibata , Akihiro Kojima , Masayuki Ishikawa , Hideo Tamura , Tetsuro Komatsu
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/0079 , H01L33/508 , H01L33/58 , H01L2224/11 , H01L2924/0002 , H01L2924/3511 , H01L2933/0016 , H01L2933/0066 , H01L2924/00
摘要： According to one embodiment, a semiconductor light emitting device includes a plurality of semiconductor layers, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar and a resin layer, and is mounted in a bent state on a curved surface. The plurality of semiconductor layers includes a first main surface, a second main surface opposite to the first main surface, and a light emitting layer, the plurality of semiconductor layers being separated from one another. A material is provided between the plurality of the semiconductor layers separated from one another. The member has a higher flexibility than the semiconductor layers being.
摘要翻译：根据一个实施例，半导体发光器件包括多个半导体层，第一电极，第二电极，绝缘层，第一互连层，第二互连层，第一金属柱，第二金属柱和树脂层，并且以弯曲状态安装在弯曲表面上。多个半导体层包括第一主表面，与第一主表面相对的第二主表面和发光层，所述多个半导体层彼此分离。在彼此分离的多个半导体层之间提供材料。该构件具有比半导体层更高的柔性。

10. 发明授权

US08070263B2 Printing head substrate, ink jet printing head and ink jet printing apparatus with substrate temperature detecting element 有权
标题翻译：印刷头基板，喷墨打印头和具有基板温度检测元件的喷墨打印设备
公开(公告)号：US08070263B2
公开(公告)日：2011-12-06
申请号：US12480249
申请日：2009-06-08
申请人： Ryoji Oohashi , Yoshiyuki Imanaka , Koichi Omata , Hideo Tamura , Takaaki Yamaguchi , Kousuke Kubo , Yuuji Tamaru , Masafumi Takimoto
发明人： Ryoji Oohashi , Yoshiyuki Imanaka , Koichi Omata , Hideo Tamura , Takaaki Yamaguchi , Kousuke Kubo , Yuuji Tamaru , Masafumi Takimoto
IPC分类号： B41J2/05
CPC分类号： B41J2/1752 , B41J2/04563 , B41J2/0458 , B41J2/04588 , B41J2/1408 , B41J2/17553
摘要： There are provided a printing head substrate, an ink jet printing head and an ink jet printing apparatus, which accurately detect a temperature state in the central part of a heater array on the substrate and restrict an area of the substrate to a minimum. A printing head substrate has a plurality of heating elements, a plurality of ink supply openings, a logic circuit for driving the heating elements; a substrate temperature detecting element for detecting a temperature of the printing head substrate, and input and output pads for carrying out reception and supply of a signal between a printing apparatus, and the logic circuit and the substrate temperature detecting element, wherein a beam integral with the substrate is provided between the plurality of ink supply openings, and the substrate temperature detecting element is arranged on the beam.
摘要翻译：提供了一种能够准确地检测基板上的加热器阵列的中心部分的温度状态并将基板的面积限制在最小的打印头基板，喷墨打印头和喷墨打印装置。印刷头基板具有多个加热元件，多个供墨孔，用于驱动加热元件的逻辑电路; 用于检测打印头基板的温度的基板温度检测元件，以及用于在打印装置与逻辑电路与基板温度检测元件之间进行信号的接收和提供的输入输出焊盘，其中，与基板设置在多个供墨口之间，基板温度检测元件设置在横梁上。

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