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    • 1. 发明授权
    • Cooling system of multicylinder engine
    • 多缸发动机冷却系统
    • US06575123B2
    • 2003-06-10
    • US09953866
    • 2001-09-18
    • Hideo NegishiShinichi Sasaki
    • Hideo NegishiShinichi Sasaki
    • F02F700
    • F02F1/14F01P3/02F01P2003/006F01P2003/021F02F1/004F02F1/16
    • Formed in a cylinder block of a multi-cylinder engine are oil grooves each arranged in a top deck of the cylinder block to surround a corresponding cylinder liner, a supply channel connected to an oil pump, a return channel connected to an oil pan, communication holes interconnecting adjacent oil grooves in series, an inflow hole connecting the most upstream oil groove to the supply channel and an outflow hole connecting the most downstream oil groove to the return channel. Consequently, the oil grooves of all cylinders connected in series cause engine oil to flow through all the oil grooves at the same rate. Such an arrangement is simple in structure and has reduced the number of components so that the manufacturing cost is reduced and the reliability of the cooling system is enhanced.
    • 在多气缸发动机的气缸体中形成的油槽各自布置在气缸体的顶板中以围绕相应的气缸套,连接到油泵的供应通道,连接到油底壳的返回通道,通信 将相邻的油槽串联连接的孔,将最上游油槽连接到供给通道的流入孔和将最下游油槽连接到返回通道的流出孔。 因此,串联连接的所有气缸的油槽使发动机油以相同的速率流过所有油槽。 这种布置结构简单,并且减少了部件的数量,从而降低了制造成本,提高了冷却系统的可靠性。
    • 2. 发明申请
    • Two-Layered Copper-Clad Laminate Material, and Method for Producing Same
    • 两层铜包覆层压材料及其制造方法
    • US20140011047A1
    • 2014-01-09
    • US13983786
    • 2012-01-25
    • Hajime InazumiKazuhiko SakaguchiShinichi Sasaki
    • Hajime InazumiKazuhiko SakaguchiShinichi Sasaki
    • H05K1/03C25D7/00C23C14/20
    • H05K1/0346C23C14/022C23C14/025C23C14/20C23C14/205C23C28/00C25D7/00Y10T428/12569Y10T428/24975
    • A two-layered copper-clad laminate material, in which one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 μm is subjected to a modification treatment by means of a glow discharge plasma treatment in an oxygen gas atmosphere, and a copper layer having a thickness of 1 to 5 μm is formed by means of sputtering or electroplating on one surface or both surfaces of the polyimide film after the modification treatment; characterized in that the integrated intensity ratio of a C1S peak at 287 to 290 eV to a C1S peak at 283 to 287 eV, obtained by analyzing the photoelectron spectroscopy (XPS) spectra of the surface of the polyimide film after the plasma treatment, is within the range of 0.03 to 0.11. The present invention aims at discovering; as a consequence of performing surface characterization by subjecting the PI film surface to XPS analysis before and after the plasma treatment, and of evaluating the dissolution properties and adhesive strength of the PI film before and after the plasma treatment; a two-layered copper-clad laminate material that is ideal to be processed during a wet PI etching step, and a production method for said two-layered copper-clad laminate material.
    • 通过在氧气气氛中的辉光放电等离子体处理对厚度为12.5〜50μm的聚酰亚胺膜的一面或两面进行改性处理的双层覆铜层叠材料, 在改性处理之后,通过溅射或电镀在聚酰亚胺膜的一个表面或两个表面上形成厚度为1至5μm的铜层; 其特征在于,通过分析等离子体处理后聚酰亚胺膜表面的光电子能谱(XPS)光谱获得的287〜290eV的C1S峰与283〜287eV的C1S峰的积分强度比在 范围为0.03〜0.11。 本发明旨在发现; 作为通过在等离子体处理之前和之后对PI膜表面进行XPS分析并且评估PI膜在等离子体处理之前和之后的溶解性能和粘合强度进行表面表征的结果的结果。 在湿式PI蚀刻步骤中理想的加工的双层覆铜层压材料以及所述两层覆铜层压材料的制造方法。
    • 6. 发明申请
    • Apparatus and method for picking-up semiconductor dies
    • 用于拾取半导体管芯的装置和方法
    • US20090101282A1
    • 2009-04-23
    • US12231706
    • 2008-09-05
    • Noboru FujinoOkito UmeharaAkio KatsuroShinichi Sasaki
    • Noboru FujinoOkito UmeharaAkio KatsuroShinichi Sasaki
    • B07C99/00
    • H01L21/67132Y10T156/1983
    • A die pick-up apparatus and method using a wiper that has a tip end moving in and out of an adherence surface of a die stage and a shutter that is moved with the wiper while blocking a suction window formed in the adherence surface. When picking up a semiconductor die, the tip end of the wiper is aligned with a first end of the die, the wiper is moved along the adherence surface while the tip end of the wiper is protruded from the adherence surface with the die being suction-held by a collet. A suction opening is sequentially opened between a first end surface of the suction window and a seat surface of the wiper as the wiper is moved, and a dicing sheet attached to the die is suctioned into the suction opening that has been opened and sequentially peeled off from the die.
    • 一种模具拾取装置和方法,其使用具有尖端移动进入和离开模具台的粘附表面的刮水器以及与擦拭器一起移动的挡板,同时阻挡形成在粘附表面中的吸入窗口。 当拾取半导体管芯时,擦拭器的尖端与模具的第一端对准,擦拭器沿粘附表面移动,同时擦拭器的末端从附着表面突出, 由夹头夹持。 随着擦拭器的移动,抽吸窗口的第一端面和擦拭器的座面之间依次打开抽吸口,将附着在模具上的切割片吸入已打开并依次剥离的抽吸口 从死亡。