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1. 发明授权

US06934429B2 Optical waveguide board and optical module 失效
标题翻译：光波导板和光模块
公开(公告)号：US06934429B2
公开(公告)日：2005-08-23
申请号：US10285647
申请日：2002-11-01
申请人： Hideo Kikuchi , Junichi Sasaki , Seiji Suda , Mikio Oda , Hikaru Kouta , Sakae Kitajo , Yuzo Shimada
发明人： Hideo Kikuchi , Junichi Sasaki , Seiji Suda , Mikio Oda , Hikaru Kouta , Sakae Kitajo , Yuzo Shimada
IPC分类号： G02B6/122 , G02B6/42 , H04B10/25 , H04B10/2507 , H04B10/2581 , G02B6/12
CPC分类号： G02B6/4214 , G02B6/42 , G02B6/4206
摘要： An optical waveguide board is provided which includes a substrate, an optical path changing unit being formed on the substrate used to change a direction of an optical path of incident light from a direction being vertical to a surface of the substrate to a direction being horizontal to the surface of the substrate and to condense a luminous flux and an optical waveguide being formed on the substrate to carry out multi-mode transmission of a luminous flux fed from the optical path changing unit wherein, based on a spread angle of the luminous flux formed by the optical path changing unit, mainly light components to be transmitted in a zero-order mode to a three-order mode only, out of various kinds of modes for the multi-mode transmission, is transmitted through the optical waveguide.
摘要翻译：提供了一种光波导板，其包括基板，光路改变单元，其形成在基板上，用于将入射光的光路方向从垂直于基板的表面的方向改变到水平方向在基板的表面上冷凝形成在基板上的光束和光波导，以进行从光路改变单元馈送的光束的多模传输，其中基于形成的光束的扩展角通过光路改变单元，主要是通过光波导传输在多模式传输的各种模式中仅以零阶模式传输到三阶模式的光分量。

2. 发明授权

US07186928B2 Electronic device including chip parts and a method for manufacturing the same 失效
标题翻译：包括芯片部件的电子设备及其制造方法
公开(公告)号：US07186928B2
公开(公告)日：2007-03-06
申请号：US10522686
申请日：2003-08-01
申请人： Hideo Kikuchi , Junichi Sasaki
发明人： Hideo Kikuchi , Junichi Sasaki
IPC分类号： H05K9/00
CPC分类号： H01L24/81 , H01C1/06 , H01G2/22 , H01G4/228 , H01L23/552 , H01L24/10 , H01L24/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/14051 , H01L2224/16 , H01L2224/16235 , H01L2224/1703 , H01L2224/17515 , H01L2224/2929 , H01L2224/293 , H01L2224/73153 , H01L2224/73253 , H01L2224/81201 , H01L2224/8121 , H01L2224/81815 , H01L2224/83851 , H01L2224/92225 , H01L2924/0001 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/12043 , H01L2924/15192 , H01L2924/15787 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K1/181 , H05K2201/10371 , H05K2201/10734 , H01L2224/81801 , H01L2224/29075 , H01L2924/00 , H01L2224/05599
摘要： In a shielding configuration of a chip part, a shielding effect and a cooling effect are sufficiently obtained at the same time. In an electronic device including a chip part to be disclosed, a shielding conductor includes a ceiling plate section covering the chip part and side plate sections which are formed to be united with the ceiling plate section and to be at a position lower than the ceiling plate section and which are arranged on both sides in a horizontal direction of the chip part, and openings are formed in both side ends in a front-rear direction of the shielding conductor to open both sides in a front-rear direction of the chip part, and the side plate sections of the shielding conductor are electrically connected via a plurality of shielding bumps in the front-rear direction to a ground layer pattern of a mounting substrate.
摘要翻译：在芯片部件的屏蔽结构中，同时充分获得屏蔽效果和冷却效果。在包括要公开的芯片部件的电子设备中，屏蔽导体包括覆盖芯片部分的顶板部分和形成为与顶板部分结合并且处于比顶板的下方的位置的侧板部分并且在芯片部分的水平方向上布置在两侧，并且在屏蔽导体的前后方向的两个侧端形成开口，以在芯片部分的前后方向上打开两侧，并且屏蔽导体的侧板部分经由多个前后方向的屏蔽凸块电连接到安装基板的接地层图案。

3. 发明申请

US20050248909A1 Electronic device including chip parts and a method for manufacturing the same 失效
标题翻译：包括芯片部件的电子设备及其制造方法
公开(公告)号：US20050248909A1
公开(公告)日：2005-11-10
申请号：US10522686
申请日：2003-08-01
申请人： Hideo Kikuchi , Junichi Sasaki
发明人： Hideo Kikuchi , Junichi Sasaki
IPC分类号： H05K9/00 , H01C1/06 , H01G2/22 , H01G4/228 , H01L21/60 , H01L23/00 , H01L23/485 , H01L23/552 , H01S5/022 , H05K1/02 , H05K1/18
CPC分类号： H01L24/81 , H01C1/06 , H01G2/22 , H01G4/228 , H01L23/552 , H01L24/10 , H01L24/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/14051 , H01L2224/16 , H01L2224/16235 , H01L2224/1703 , H01L2224/17515 , H01L2224/2929 , H01L2224/293 , H01L2224/73153 , H01L2224/73253 , H01L2224/81201 , H01L2224/8121 , H01L2224/81815 , H01L2224/83851 , H01L2224/92225 , H01L2924/0001 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/12043 , H01L2924/15192 , H01L2924/15787 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K1/181 , H05K2201/10371 , H05K2201/10734 , H01L2224/81801 , H01L2224/29075 , H01L2924/00 , H01L2224/05599
摘要： In a shielding configuration of a chip part, a shielding effect and a cooling effect are sufficiently obtained at the same time. In an electronic device including a chip part to be disclosed, a shielding conductor 3 includes a ceiling plate section 4 covering the chip part 1 and side plate sections 5 which are formed to be united with the ceiling plate section 4 and to be at a position lower than the ceiling plate section 4 and which are arranged on both sides in a horizontal direction of the chip part 1, and openings 8 are formed in both side ends in a front-rear direction of the shielding conductor 3 to open both sides in a front-rear direction of the chip part 1, and the side plate sections 5 of the shielding conductor 3 are electrically connected via a plurality of shielding bumps 17 in the front-rear direction to a ground layer pattern 11 of a mounting substrate 10.
摘要翻译：在芯片部件的屏蔽结构中，同时充分获得屏蔽效果和冷却效果。在包括要公开的芯片部件的电子设备中，屏蔽导体3包括覆盖芯片部分1的顶板部分4和形成为与顶板部分4结合在一起的位置的侧板部分5 低于顶板部分4，并且在芯片部分1的水平方向上布置在两侧，并且在屏蔽导体3的前后方向上的两个侧端形成有开口8，以便在一个芯片部分1的前后方向和屏蔽导体3的侧板部分5经由多个屏蔽凸块17在前后方向上电连接到安装基板10的接地层图案11。

4. 发明授权

US08322933B2 Optical connection structure between optical backplane and circuit substrate 有权
标题翻译：光背板与电路基板之间的光连接结构
公开(公告)号：US08322933B2
公开(公告)日：2012-12-04
申请号：US12534622
申请日：2009-08-03
申请人： Junichi Sasaki
发明人： Junichi Sasaki
IPC分类号： G02B6/36 , G02B6/38
CPC分类号： G02B6/3885 , G02B6/3897 , G02B6/43
摘要： Information processing equipment includes a photoelectric conversion module disposed on a circuit substrate, a first optical connector connected to the photoelectric conversion module through a plurality of first optical fibers and disposed to an edge portion of the circuit substrate, and a second optical connector disposed on an optical backplane and optically connected to the first optical connector. The disposing direction of the optical fibers in the photoelectric conversion module is in nonparallel with the main surface of the circuit substrate and the disposing direction of the optical fibers in the first optical connector and the disposing direction of the optical fibers in the second optical connector are in nonparallel with the main surface of the circuit substrate.
摘要翻译：信息处理设备包括设置在电路基板上的光电转换模块，通过多个第一光纤连接到光电转换模块并且设置在电路基板的边缘部分的第一光学连接器，以及设置在电路基板上的第二光学连接器光学背板并且光学连接到第一光学连接器。光电转换模块中的光纤的布置方向与电路基板的主表面不平行，第一光连接器中的光纤的布置方向和第二光连接器中的光纤的布置方向为与电路基板的主表面不平行。

5. 发明授权

US08267597B2 Mounting of optical device on mounting board to at least provide heat radiation 有权
标题翻译：将光学装置安装在安装板上至少提供热辐射
公开(公告)号：US08267597B2
公开(公告)日：2012-09-18
申请号：US12545204
申请日：2009-08-21
申请人： Junichi Sasaki
发明人： Junichi Sasaki
IPC分类号： G02B6/00 , G02B6/36
CPC分类号： G02B6/4214 , G02B6/325 , G02B6/4228 , H05K1/141 , H05K1/182
摘要： An optical module includes: an optical device mounting board including a first surface, a second surface on the reverse side, and a light transparent part allowing an emitted light traveling from the first surface to the second surface and a received light traveling in the opposite direction to pass through the transparent part; an optical device mounted on the first surface, which is a light emitting device or a light receiving device; a first terminal mounted on a surface except the first surface of the optical device mounting board; a wiring connecting a second terminal of a component mounted on the first surface including the optical device with the first terminal; and a transmission medium connector connecting a light transmission medium transmitting the emitted light traveling from the second surface to an outside of the optical module or the received light traveling in the opposite direction.
摘要翻译：光学模块包括：光学装置安装板，包括第一表面，反面上的第二表面和允许从第一表面到第二表面传播的发射光的透光部分和沿相反方向行进的接收光透过透明部分; 安装在第一表面上的光学器件，其是发光器件或光接收器件; 第一端子，其安装在除了所述光学装置安装板的第一表面之外的表面上; 连接安装在包括光学装置的第一表面的部件的第二端子与第一端子的布线; 以及传输介质连接器，其连接将从第二表面传播的发射光传输到光学模块的外部的光传输介质或沿相反方向传播的接收光。

6. 发明授权

US07732340B2 Method for adjusting a critical dimension in a high aspect ratio feature 失效
标题翻译：用于调整高宽高比特征中临界尺寸的方法
公开(公告)号：US07732340B2
公开(公告)日：2010-06-08
申请号：US11463133
申请日：2006-08-08
申请人： Toshifumi Nagaiwa , Junichi Sasaki , Stefan Sawusch
发明人： Toshifumi Nagaiwa , Junichi Sasaki , Stefan Sawusch
IPC分类号： H01I21/302
CPC分类号： H01L21/31116 , H01L21/31122 , H01L21/31144
摘要： A method for adjusting the lateral critical dimension (i.e., length and width) of a feature formed in a layer on a substrate using a dry etching process. One or more thin intermediate sub-layers are inserted in the layer within which the feature is to be formed. Once an intermediate sub-layer is reached during the etching process, an etch process is performed to correct and/or adjust the lateral critical dimensions before etching through the intermediate sub-layer and continuing the layer etch.
摘要翻译：一种用于使用干蚀刻工艺调节在衬底上形成的特征的横向临界尺寸（即，长度和宽度）的方法。将一个或多个薄的中间子层插入其中要形成特征的层中。一旦在蚀刻过程中达到中间子层，则在蚀刻通过中间子层并继续层蚀刻之前，执行蚀刻工艺以校正和/或调整横向临界尺寸。

7. 发明授权

US07561762B2 Semiconductor device having optical signal input-output mechanism 有权
标题翻译：具有光信号输入输出机构的半导体装置
公开(公告)号：US07561762B2
公开(公告)日：2009-07-14
申请号：US11575482
申请日：2005-09-20
申请人： Kazunori Miyoshi , Kazuhiko Kurata , Takanori Shimizu , Ichiro Hatakeyama , Junichi Sasaki
发明人： Kazunori Miyoshi , Kazuhiko Kurata , Takanori Shimizu , Ichiro Hatakeyama , Junichi Sasaki
IPC分类号： G02B6/12 , G02B6/26 , G02B6/42
CPC分类号： G02B6/42 , G02B6/4214 , G02B6/4232 , H05K1/141 , H05K1/147 , H05K1/189
摘要： A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).
摘要翻译：半导体装置具有印刷电路板（11），其中形成连接到LSI芯片（17）和平面光学元件（21）的电线（18），并且其中传输输入到平面光学元件的光的光波导（25） 21）和/或从平面光学元件（21）输出的光是固定的。平面光学元件（21）安装在小基板（13）的一端，小基板（13）的另一端通过焊料凸块（26）与印刷电路板（11）连接。安装平面光学元件（21）的小基板（13）的一端通过固定机构固定到印刷电路板（11）。小基板（13）具有柔性部分（15），其与印刷电路板（11）和小基板（13）的其它部分相比容易变形，在平面光学元件（21）的一端之间的至少一部分区域中，并且另一端电连接到印刷线路板（11）。

8. 发明授权

US07473038B2 Optical connector for coupling an optical fiber to a circuit board 有权
标题翻译：用于将光纤耦合到电路板的光学连接器
公开(公告)号：US07473038B2
公开(公告)日：2009-01-06
申请号：US11437646
申请日：2006-05-22
申请人： Kunihiko Fujiwara , Akito Nishimura , Kenji Sasaki , Yukio Hayashi , Ichiro Hatakeyama , Youichi Hashimoto , Junichi Sasaki , Ryosuke Kuribayashi , Kazunori Miyoshi , Kazuhiko Kurata
发明人： Kunihiko Fujiwara , Akito Nishimura , Kenji Sasaki , Yukio Hayashi , Ichiro Hatakeyama , Youichi Hashimoto , Junichi Sasaki , Ryosuke Kuribayashi , Kazunori Miyoshi , Kazuhiko Kurata
IPC分类号： G02B6/36
CPC分类号： G02B6/4292 , G02B6/3885 , G02B6/3897 , G02B6/4214 , G02B6/4249
摘要： An optical connector according to the present invention including a connector body mounted on an optical module mounted on a circuit board, and a connector fixing member for pressing the connector body against the optical module. The connector fixing member can be engaged/disengaged with/from the circuit board, and thus the connector body can be attached/detached to/from the optical module.
摘要翻译：根据本发明的光连接器，包括安装在安装在电路板上的光学模块上的连接器主体和用于将连接器主体压靠在光学模块上的连接器固定构件。连接器固定构件可以与电路板接合/脱开，从而可以将连接器主体与光学模块连接/分离。

9. 发明申请

US20070292081A1 OPTICAL CONNECTOR AND OPTICAL MODULE 失效
标题翻译：光学连接器和光模块
公开(公告)号：US20070292081A1
公开(公告)日：2007-12-20
申请号：US11694787
申请日：2007-03-30
申请人： Youichi Hashimoto , Junichi Sasaki , Ichiro Hatakeyama , Kazuhiko Kurata
发明人： Youichi Hashimoto , Junichi Sasaki , Ichiro Hatakeyama , Kazuhiko Kurata
IPC分类号： G02B6/26
CPC分类号： G02B6/4292 , G02B6/421 , G02B6/4214 , G02B6/4277
摘要： An optical waveguide or first optical fiber whose one end optically connects with a light exit plane and/or light incidence plane of an optical element and whose other end optically connects with an second optical fiber and a connector for mechanically connecting the optical waveguide or the first optical fiber and the second optical fiber are included. The optical waveguide or first optical fiber is bent in order to change the traveling direction of light so that the light incoming from one end is emitted from the other end substantially in parallel with a board and the light incoming substantially in parallel with the board to the optical waveguide or first optical fiber from the other end is emitted from one end toward the optical element.
摘要翻译：一种光波导或第一光纤，其一端与光学元件的光出射平面和/或光入射面光学连接，并且其另一端与第二光纤和连接器光学连接，用于机械地连接光波导或第一包括光纤和第二光纤。弯曲光波导或第一光纤以改变光的行进方向，使得从一端进入的光从基板平行于另一端发射，并且基本上与板平行地入射到光光波导或另一端的第一光纤从一端朝向光学元件发射。

10. 发明申请

US20060280410A1 Optical connector 有权
标题翻译：光连接器
公开(公告)号：US20060280410A1
公开(公告)日：2006-12-14
申请号：US11437646
申请日：2006-05-22
申请人： Kunihiko Fujiwara , Akito Nishimura , Kenji Sasaki , Yukio Hayashi , Ichiro Hatakeyama , Youichi Hashimoto , Junichi Sasaki , Ryosuke Kuribayashi , Kazunori Miyoshi , Kazuhiko Kurata
发明人： Kunihiko Fujiwara , Akito Nishimura , Kenji Sasaki , Yukio Hayashi , Ichiro Hatakeyama , Youichi Hashimoto , Junichi Sasaki , Ryosuke Kuribayashi , Kazunori Miyoshi , Kazuhiko Kurata
IPC分类号： G02B6/36
CPC分类号： G02B6/4292 , G02B6/3885 , G02B6/3897 , G02B6/4214 , G02B6/4249
摘要： An optical connector according to the present invention including a connector body mounted on an optical module mounted on a circuit board, and a connector fixing member for pressing the connector body against the optical module. The connector fixing member can be engaged/disengaged with/from the circuit board, and thus the connector body can be attached/detached to/from the optical module.
摘要翻译：根据本发明的光连接器，包括安装在安装在电路板上的光学模块上的连接器主体和用于将连接器主体压靠在光学模块上的连接器固定构件。连接器固定构件可以与电路板接合/脱开，从而可以将连接器主体与光学模块连接/分离。

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