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1. 发明授权

US07048172B2 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device 有权
公开(公告)号：US07048172B2
公开(公告)日：2006-05-23
申请号：US10925625
申请日：2004-08-25
申请人： Hideki Uchida , Kazuo Kido , Tomoyuki Nakano , Takeshi Kuribayashi , Yoshihiko Misawa
发明人： Hideki Uchida , Kazuo Kido , Tomoyuki Nakano , Takeshi Kuribayashi , Yoshihiko Misawa
IPC分类号： B23K1/00 , B23K5/22
CPC分类号： B23K3/0669 , B23K2101/40 , H01L2924/0002 , H05K3/3484 , H05K13/0469 , Y10T29/49144 , H01L2924/00
摘要： A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.

2. 发明授权

US06957759B2 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device 有权
标题翻译：粘性流体传递装置和转移方法，电子部件安装装置和安装方法以及半导体装置
公开(公告)号：US06957759B2
公开(公告)日：2005-10-25
申请号：US10925766
申请日：2004-08-25
申请人： Hideki Uchida , Kazuo Kido , Tomoyuki Nakano , Takeshi Kuribayashi , Yoshihiko Misawa
发明人： Hideki Uchida , Kazuo Kido , Tomoyuki Nakano , Takeshi Kuribayashi , Yoshihiko Misawa
IPC分类号： B23K1/00 , B23K3/06 , B23K101/40 , H05K3/34 , H05K13/04 , B23K5/22
CPC分类号： B23K3/0669 , B23K2101/40 , H01L2924/0002 , H05K3/3484 , H05K13/0469 , Y10T29/49144 , H01L2924/00
摘要： A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.
摘要翻译：具有搅拌刮板和固定在其上的调平刮板的刮板单元通过传送单元移动机构的往复操作而摇摆，使得搅拌刮板和调平刮板在进出路径上接近转印单元的盘表面。因此，搅拌刮板将传送单元上的粘性流体搅拌在传送单元的传送路径上，并且调平刮板将在传送路径上搅动的粘性流体均匀地平坦化，以在转印单元的返回路径上具有预定的厚度，从而在转移单元上形成平坦的粘性流体转移表面。通过将电子部件的端子部分浸渍在粘性流体转移表面中，将粘性流体转移到电子部件，然后将电子部件安装在预定的安装位置。

3. 发明申请

US20050023326A1 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device 有权
公开(公告)号：US20050023326A1
公开(公告)日：2005-02-03
申请号：US10925766
申请日：2004-08-25
申请人： Hideki Uchida , Kazuo Kido , Tomoyuki Nakano , Takeshi Kuribayashi , Yoshihiko Misawa
发明人： Hideki Uchida , Kazuo Kido , Tomoyuki Nakano , Takeshi Kuribayashi , Yoshihiko Misawa
IPC分类号： B23K1/00 , B23K3/06 , B23K101/40 , H05K3/34 , H05K13/04 , G03G15/10
CPC分类号： B23K3/0669 , B23K2101/40 , H01L2924/0002 , H05K3/3484 , H05K13/0469 , Y10T29/49144 , H01L2924/00
摘要： A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.

4. 发明授权

US06789720B2 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device 失效
标题翻译：粘性流体传递装置和转移方法，电子部件安装装置和安装方法以及半导体装置
公开(公告)号：US06789720B2
公开(公告)日：2004-09-14
申请号：US10016455
申请日：2001-12-10
申请人： Hideki Uchida , Kazuo Kido , Tomoyuki Nakano , Takeshi Kuribayashi , Yoshihiko Misawa
发明人： Hideki Uchida , Kazuo Kido , Tomoyuki Nakano , Takeshi Kuribayashi , Yoshihiko Misawa
IPC分类号： B23K100
CPC分类号： B23K3/0669 , B23K2101/40 , H01L2924/0002 , H05K3/3484 , H05K13/0469 , Y10T29/49144 , H01L2924/00
摘要： A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.
摘要翻译：具有搅拌刮板和固定在其上的调平刮板的刮板单元通过传送单元移动机构的往复操作而摇摆，使得搅拌刮板和调平刮板在进出路径上接近转印单元的盘表面。因此，搅拌刮板将传送单元上的粘性流体搅拌在传送单元的传送路径上，并且调平刮板将在传送路径上搅动的粘性流体均匀地平坦化，以在转印单元的返回路径上具有预定的厚度，从而在转移单元上形成平坦的粘性流体转移表面。通过将电子部件的端子部分浸渍在粘性流体转移表面中，将粘性流体转移到电子部件，然后将电子部件安装在预定的安装位置。

5. 发明申请

US20050023681A1 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device 审中-公开
公开(公告)号：US20050023681A1
公开(公告)日：2005-02-03
申请号：US10925767
申请日：2004-08-25
申请人： Hideki Uchida , Kazuo Kido , Tomoyuki Nakano , Takeshi Kuribayashi , Yoshihiko Misawa
发明人： Hideki Uchida , Kazuo Kido , Tomoyuki Nakano , Takeshi Kuribayashi , Yoshihiko Misawa
IPC分类号： B23K1/00 , B23K3/06 , B23K101/40 , H05K3/34 , H05K13/04 , H01L23/48
CPC分类号： B23K3/0669 , B23K2101/40 , H01L2924/0002 , H05K3/3484 , H05K13/0469 , Y10T29/49144 , H01L2924/00
摘要： A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.

6. 发明申请

US20050017052A1 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device 有权
公开(公告)号：US20050017052A1
公开(公告)日：2005-01-27
申请号：US10925625
申请日：2004-08-25
申请人： Hideki Uchida , Kazuo Kido , Tomoyuki Nakano , Takeshi Kuribayashi , Yoshihiko Misawa
发明人： Hideki Uchida , Kazuo Kido , Tomoyuki Nakano , Takeshi Kuribayashi , Yoshihiko Misawa
IPC分类号： B23K1/00 , B23K3/06 , B23K101/40 , H05K3/34 , H05K13/04 , G03G15/10
CPC分类号： B23K3/0669 , B23K2101/40 , H01L2924/0002 , H05K3/3484 , H05K13/0469 , Y10T29/49144 , H01L2924/00
摘要： A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.

7. 发明授权

US07020322B2 Component-mounting method and component-mounting apparatus 有权
标题翻译：部件安装方法和部件安装装置
公开(公告)号：US07020322B2
公开(公告)日：2006-03-28
申请号：US10003831
申请日：2001-12-06
申请人： Tomoyuki Nakano , Koji Odera , Takeshi Kuribayashi , Kazuo Kido
发明人： Tomoyuki Nakano , Koji Odera , Takeshi Kuribayashi , Kazuo Kido
IPC分类号： G06K9/00 , H01L23/544
CPC分类号： H05K1/0269 , H01L2223/54473 , H05K3/0052 , H05K3/0097 , H05K3/225 , H05K3/303 , H05K13/08 , H05K2201/09918 , H05K2203/163
摘要： A number of recognition operations for a circuit-formed substrate as a whole is reduced by concurrently recognizing a bad mark and an individual substrate mark in the course of a recognition process of a single or a plurality of individual substrate(s) provided by sectioning the circuit-formed substrate. Results of the recognition of an inclination and dislocation of the circuit-formed substrate are used to control a position of a substrate-recognition camera which recognizes the individual substrate, thereby reducing a rate of occurrence of recognition errors. When a component of recognition marks or the individual substrate mark is captured within a visual field of the substrate-recognition camera, a position of a corresponding one of these recognized marks is specified, and such a mark is again recognized, and thus, the occurrence of a recognition error can be inhibited.
摘要翻译：通过在单个或多个单独的基板的识别处理过程中同时识别不良标记和单独的基板标记，整体上对电路形成的基板的识别操作被减少，电路形成的基板。用于识别电路形成的基板的倾斜和位错的结果用于控制识别单个基板的基板识别相机的位置，从而降低识别错误的发生率。当在基板识别照相机的视野内捕获识别标记的分量或单独的基板标记时，指定这些识别的标记中的相应一个的位置，并且再次识别这样的标记，并且因此发生该发生的识别错误可以被抑制。

8. 发明授权

US07447045B2 Board supporting mechanism, board supporting method, and component mounting apparatus and component mounting method using the same mechanism and method 失效
标题翻译：板支撑机构，板支撑方法，以及使用相同的机构和方法的部件安装装置和部件安装方法
公开(公告)号：US07447045B2
公开(公告)日：2008-11-04
申请号：US11480355
申请日：2006-07-05
申请人： Keishi Ikeya , Kazuo Kido , Tetsutaro Hachimura , Hideki Uchida
发明人： Keishi Ikeya , Kazuo Kido , Tetsutaro Hachimura , Hideki Uchida
IPC分类号： H05K7/14
CPC分类号： H05K13/0069 , H05K7/142 , Y10T29/49126 , Y10T29/4913 , Y10T29/49153 , Y10T29/53174 , Y10T29/53265
摘要： A board supporting mechanism and a board supporting method eliminating an adjustment of a support height of a support pin upon position-changing of the support pin in accordance with a change in the model of a circuit board, as well as a component mounting apparatus and a component mounting method. A single or a plurality of support pin(s) (42) have one end(s) and are brought into contact with a bottom face of a circuit board (14) to support the bottom face of the circuit board (14) and the other end(s) are brought into contact with a surface of a support table (27) for raising/lowering the support pin(s) (42). Each support pin is held in a direction substantially perpendicular to the surface of the support table (27). The one end(s) of the support pin (42), held in the direction substantially perpendicular to the surface of the support table (27), is brought into contact with the bottom face of the circuit board (14), and thereby, the support pins support the circuit board (14).
摘要翻译：板支撑机构和板支撑方法，根据电路板的型号的变化，消除了在支撑销的位置变化时支撑销的支撑高度的调整，以及部件安装装置和组件安装方法。一个或多个支撑销（42）具有一个端部并与电路板（14）的底面接触以支撑电路板（14）的底面，并且另一端与支撑台（27）的表面接触，用于升高/降低支撑销（42）。每个支撑销保持在基本上垂直于支撑台（27）的表面的方向上。保持在与支撑台（27）的表面大致垂直的方向上的支撑销（42）的一端与电路板（14）的底面接触，支撑销支撑电路板（14）。

9. 发明授权

US07293352B2 Origin detection method for component placement head 有权
标题翻译：元件放置头的原点检测方法
公开(公告)号：US07293352B2
公开(公告)日：2007-11-13
申请号：US10526894
申请日：2003-09-11
申请人： Osamu Okuda , Kazuo Kido , Hideki Uchida
发明人： Osamu Okuda , Kazuo Kido , Hideki Uchida
IPC分类号： B23P19/00 , A47J45/00
CPC分类号： H05K13/0413 , H05K13/0406 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： An origin detection method for a component placement head includes setting an axial origin for each elevation nut section, of the component placement head, by detecting a rotational angle of a drive section corresponding to the elevation nut section. The elevation nut sections are then individually moved down from the axial origin so that light emitted from a light-projecting section is received by a light-receiving section without being interrupted. Then, it is confirmed that the axial origin of each elevation nut section is an origin of elevation by detecting interruption of light, emitted from the light-projecting section, by the elevation nut section at a position corresponding to the elevation nut section having been lowered from the axial origin by a prescribed light interruption dimension.
摘要翻译：用于元件放置头的原点检测方法包括：通过检测对应于提升螺母部分的驱动部分的旋转角来设置元件放置头的每个仰角螺母部分的轴向原点。升降螺母部分然后从轴向原点单独地向下移动，使得从光投射部分发射的光被光接收部分接收而不被中断。然后，通过在与已经降低的升降螺母部分相对应的位置处检测从凸出部分发射的光的中断，确定每个仰角螺母部分的轴向起点是高度的原点从轴向起点通过规定的光中断尺寸。

10. 发明授权

US07886427B2 Component mounting head 有权
标题翻译：组件安装头
公开(公告)号：US07886427B2
公开(公告)日：2011-02-15
申请号：US10582779
申请日：2004-12-15
申请人： Hideki Uchida , Risa Sakurai , Shin-ichiro Endo , Kazuo Kido
发明人： Hideki Uchida , Risa Sakurai , Shin-ichiro Endo , Kazuo Kido
IPC分类号： H05K13/04
CPC分类号： H05K13/0409 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A suction-and-holding face for a component in a suction nozzle is formed from a semiconductor ceramic so that the suction-and-holding face to be brought into direct contact with the component in suction and holding has the characteristics of a semiconductor. Thus, detrimental effects due to static electricity on the suction nozzle as well as detrimental effects due to electrical conduction between the suction nozzle and the component can be prevented from occurring.
摘要翻译：吸入嘴中的部件的吸引保持面由半导体陶瓷形成，使得与抽吸保持部件直接接触的吸引保持面具有半导体的特性。因此，可以防止由于吸嘴上的静电引起的有害影响以及由于吸嘴与部件之间的电导致的不利影响。

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