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    • 3. 发明授权
    • Method of etching organic ARCs in patterns having variable spacings
    • 在具有可变间隔的图案中蚀刻有机ARC的方法
    • US06383941B1
    • 2002-05-07
    • US09611085
    • 2000-07-06
    • Meihua ShenKenju NishikidoJeffrey D. ChinnDragan Podlesnik
    • Meihua ShenKenju NishikidoJeffrey D. ChinnDragan Podlesnik
    • H01L2100
    • H01L21/31138H01L21/0276H01L21/3065
    • The present disclosure relates to semiconductor processing, and to the plasma etching of organic layers, and in particular antireflective coating layers. We have discovered a particular combination of gases useful in producing chemically reactive plasma species, which provides unexpected control over etched feature critical dimension, etch profile, and uniformity of etch across a substrate surface, despite a difference in the spacing of etched features over the substrate surface. The combination of gases which produces chemically reactive plasma species consists essentially of CxHyFz, a bromine-comprising compound (which is typically HBr), and O2, where x ranges from 1 to 4, y ranges from 0 to 3, and z ranges from 1 to 10. Oxygen atoms may be substituted for hydrogen atoms in the CxHyFz compound to a limited extent Essentially inert gases which do not produce chemically reactive species may be added to the combination of etchant-species producing gases. A combination of CF4/HBr/O2 has been demonstrated to work well. With this combination of plasma source gases, critical Dimension (CD) uniformity control across the surface of the substrate is generally improved by using a volumetric ratio of CxHyFz:HBr ranging from about 2:1 to about 5:1, with a range of about 3:1 to about 4:1 being preferred. An increased plasma density also helps improve CD uniformity control. The volumetric ratio of (CxHyFz+HBr):O2 should range between about 1:1 to 5:1, with a range of about 2:1 to about 3:1 being preferred.
    • 本公开涉及半导体处理,以及有机层的等离子体蚀刻,特别是抗反射涂层。 我们已经发现了可用于生产化学反应性等离子体物质的特定气体组合,尽管蚀刻特征在衬底上的间隔有差异,但是它们对蚀刻特征临界尺寸,蚀刻轮廓以及衬底表面上的蚀刻均匀性提供了意想不到的控制 表面。 产生化学反应性等离子体物质的气体的组合基本上由CxHyFz,含溴化合物(通常为HBr)和O 2组成,其中x为1至4,y为0至3,z的范围为1 氧原子可以在有限的程度上代替CxHyFz化合物中的氢原子。基本上不产生化学反应性物质的惰性气体可以添加到产生蚀刻剂的气体组合中。 CF4 / HBr / O2的组合已被证明是有效的。 通过这种等离子体源气体的组合,通常通过使用C 2 H 4 F 5 :H 2 O的体积比约2:1至约5:1的体积比来改善基底表面上的临界尺寸(CD)均匀性控制,其范围为约 优选3:1至约4:1。 增加的等离子体密度也有助于改善CD均匀性控制。 (C x H y F z + HBr):O 2的体积比应在约1:1至5:1之间,优选约2:1至约3:1的范围。