专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050106382A1 Anisotropic conductive film and method for producing the same 有权
标题翻译：各向异性导电膜及其制造方法
公开(公告)号：US20050106382A1
公开(公告)日：2005-05-19
申请号：US10506425
申请日：2003-03-03
申请人： Hideaki Kashihara , Masamichi Yamamoto , Jun Yorita , Hideaki Toshioka , Misako Osoegawa , Keiji Koyama , Masatoshi Majima , Yoshie Tani
发明人： Hideaki Kashihara , Masamichi Yamamoto , Jun Yorita , Hideaki Toshioka , Misako Osoegawa , Keiji Koyama , Masatoshi Majima , Yoshie Tani
IPC分类号： G01R1/067 , G01R1/073 , G01R3/00 , H01R4/04 , H01R43/00 , H05K3/32 , B32B15/04
CPC分类号： H01R4/04 , G01R1/06755 , G01R1/073 , G01R3/00 , H01R43/007 , Y10T428/25 , Y10T428/258 , Y10T428/31678
摘要： An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 μm-20 μm when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.
摘要翻译：各向异性导电膜及其制造方法，特别适用于安装半导体封装，并且充分满足更高密度安装的要求，因为即使电极的间距小或适当，也不会在膜的平面方向上发生短路为了安装接触式探头，因为能够以更低的压力确保导电连接不会与高电流并联，甚至可以处理高频信号。各向异性导电膜含有金属粉末，其具有许多细金属颗粒作为导电组分连接的形状，其中金属粉末链的长度设定为不超过当半导体封装为半导体封装时导电地接合的相邻电极之间的距离当安装接触探针时，链条的直径设定在1mum-20mum的范围内。在由具有磁场的顺磁金属形成的链定向的同时形成膜的至少一部分。

2. 发明授权

US07390442B2 Anisotropic conductive film and method for producing the same 有权
标题翻译：各向异性导电膜及其制造方法
公开(公告)号：US07390442B2
公开(公告)日：2008-06-24
申请号：US10506425
申请日：2003-03-03
申请人： Hideki Kashihara , Masamichi Yamamoto , Jun Yorita , Hideaki Toshioka , Misako Osoegawa , Keiji Koyama , Masatoshi Majima , Yoshie Tani
发明人： Hideki Kashihara , Masamichi Yamamoto , Jun Yorita , Hideaki Toshioka , Misako Osoegawa , Keiji Koyama , Masatoshi Majima , Yoshie Tani
IPC分类号： H01B1/02 , H01B1/22
CPC分类号： H01R4/04 , G01R1/06755 , G01R1/073 , G01R3/00 , H01R43/007 , Y10T428/25 , Y10T428/258 , Y10T428/31678
摘要： An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 μm-20 μm when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.
摘要翻译：各向异性导电膜及其制造方法，特别适用于安装半导体封装，并且充分满足更高密度安装的要求，因为即使电极的间距小或适当，也不会在膜的平面方向上发生短路为了安装接触式探头，因为能够以更低的压力确保导电连接不会与高电流并联，甚至可以处理高频信号。各向异性导电膜含有金属粉末，其具有许多细金属颗粒作为导电组分连接的形状，其中金属粉末链的长度设定为不超过当半导体封装为半导体封装时导电地接合的相邻电极之间的距离当安装接触探针时，链条的直径设定在1mum-20mum的范围内。在由具有磁场的顺磁金属形成的链定向的同时形成膜的至少一部分。

3. 发明授权

US07736541B2 Anisotropic conductive adhesive 失效
标题翻译：各向异性导电胶
公开(公告)号：US07736541B2
公开(公告)日：2010-06-15
申请号：US11992790
申请日：2006-09-26
申请人： Hideaki Toshioka , Masamichi Yamamoto
发明人： Hideaki Toshioka , Masamichi Yamamoto
IPC分类号： H01B1/00 , H01B1/20 , H01B1/22
CPC分类号： C09J9/02 , C08G59/621 , C08L61/00 , C08L63/00 , C09J163/00 , H01B1/22 , H01R4/04 , H01R43/007 , H05K3/323 , H05K2201/0209 , Y10T428/28 , Y10T428/31511 , C08L2666/22
摘要： An anisotropic conductive adhesive is provided that includes an epoxy resin, a phenoxy resin, a curing agent, an inorganic filler, and conducting particles as components. The phenoxy resin is controlled to have a glass-transition temperature (Tg) in a range of 66° C. to 100° C., so that the anisotropic conductive adhesive has an excellent fluidity in a mounting process, satisfactory electric conductive/insulation performances, and sufficient adhesiveness. Since the properties of the anisotropic conductive adhesive are almost invariant even if the adhesive is used for a long time under a high-temperature- and high-humidity condition, the anisotropic conductive adhesive can be used for applications where a high reliability is required.
摘要翻译：提供了包括环氧树脂，苯氧树脂，固化剂，无机填料和作为组分的导电颗粒的各向异性导电粘合剂。控制苯氧基树脂的玻璃化转变温度（Tg）在66℃至100℃的范围内，使得各向异性导电粘合剂在安装过程中具有优异的流动性，令人满意的导电/绝缘性能，并具有足够的粘合性。由于各向异性导电粘合剂的性质即使在高温高湿条件下长期使用粘合剂也几乎不变，所以各向异性导电粘合剂可用于需要高可靠性的应用。

4. 发明申请

US20090140210A1 Anisotropic Conductive Adhesive 失效
标题翻译：各向异性导电胶
公开(公告)号：US20090140210A1
公开(公告)日：2009-06-04
申请号：US11992790
申请日：2006-09-26
申请人： Hideaki Toshioka , Masamichi Yamamoto
发明人： Hideaki Toshioka , Masamichi Yamamoto
IPC分类号： C09J163/00
CPC分类号： C09J9/02 , C08G59/621 , C08L61/00 , C08L63/00 , C09J163/00 , H01B1/22 , H01R4/04 , H01R43/007 , H05K3/323 , H05K2201/0209 , Y10T428/28 , Y10T428/31511 , C08L2666/22
摘要： An anisotropic conductive adhesive is provided that includes an epoxy resin, a phenoxy resin, a curing agent, an inorganic filler, and conducting particles as components. The phenoxy resin is controlled to have a glass-transition temperature (Tg) in a range of 66° C. to 100° C., so that the anisotropic conductive adhesive has an excellent fluidity in a mounting process, satisfactory electric conductive/insulation performances, and sufficient adhesiveness. Since the properties of the anisotropic conductive adhesive are almost invariant even if the adhesive is used for a long time under a high-temperature- and high-humidity condition, the anisotropic conductive adhesive can be used for applications where a high reliability is required.
摘要翻译：提供了包括环氧树脂，苯氧树脂，固化剂，无机填料和作为组分的导电颗粒的各向异性导电粘合剂。控制苯氧基树脂的玻璃化转变温度（Tg）在66℃至100℃的范围内，使得各向异性导电粘合剂在安装过程中具有优异的流动性，令人满意的导电/绝缘性能，并具有足够的粘合性。由于各向异性导电粘合剂的性质即使在高温高湿条件下长期使用粘合剂也几乎不变，所以各向异性导电粘合剂可用于需要高可靠性的应用。

5. 发明授权

US07588698B2 Circuit connecting adhesive 失效
标题翻译：电路连接胶
公开(公告)号：US07588698B2
公开(公告)日：2009-09-15
申请号：US11578334
申请日：2005-12-02
申请人： Hideaki Toshioka , Masamichi Yamamoto , Kazuhiro Kawabata
发明人： Hideaki Toshioka , Masamichi Yamamoto , Kazuhiro Kawabata
IPC分类号： H01B1/00 , H01B1/04 , H01B1/06 , H01B1/02 , H01B1/22
CPC分类号： C09J163/00 , C09J9/02 , H01B1/22 , H01B1/24 , H01R4/04
摘要： A circuit coupling adhesive which is superior in heat resistance and moisture resistance is provided. The circuit coupling adhesive of the present invention can be used for purposes where high performing reliability is required, since it exhibits satisfactory electroconductive/insulative performance at connection of electrodes, etc. and the characteristics will not be varied so much even after a long period of use in a high temperature and high humidity environment. The circuit coupling adhesive comprises, as the essential ingredients, an epoxy resin, a latent curing agent, inorganic fillers having an average particle diameter of 500 nm or less, and electro-conductive particles. By mix a sufficient amount of inorganic fillers having an average particle diameter of 500 nm or less, the coefficient of thermal expansion can be decreased and the heat resistance and moisture resistance can be improved.
摘要翻译：提供了耐热性和耐湿性优异的电路耦合粘合剂。本发明的电路耦合粘合剂可以用于需要高性能可靠性的目的，因为它在电极连接时表现出令人满意的导电/绝缘性能，并且特性即使在长时间在高温高湿环境下使用。电路耦合粘合剂包括环氧树脂，潜伏性固化剂，平均粒径为500nm以下的无机填料和导电性颗粒作为必要成分。通过混合足量的平均粒径为500nm以下的无机填料，能够降低热膨胀系数，提高耐热性和耐湿性。

6. 发明申请

US20070215838A1 Circuit Connecting Adhesive 失效
标题翻译：电路连接胶
公开(公告)号：US20070215838A1
公开(公告)日：2007-09-20
申请号：US11578334
申请日：2005-12-02
申请人： Hideaki Toshioka , Masamichi Yamamoto , Kazuhiro Kawabata
发明人： Hideaki Toshioka , Masamichi Yamamoto , Kazuhiro Kawabata
IPC分类号： H01B1/12
CPC分类号： C09J163/00 , C09J9/02 , H01B1/22 , H01B1/24 , H01R4/04
摘要： A circuit coupling adhesive which is superior in heat resistance and moisture resistance is provided. The circuit coupling adhesive of the present invention can be used for purposes where high performing reliability is required, since it exhibits satisfactory electroconductive/insulative performance at connection of electrodes, etc. and the characteristics will not be varied so much even after a long period of use in a high temperature and high humidity environment. The circuit coupling adhesive comprises, as the essential ingredients, an epoxy resin, a latent curing agent, inorganic fillers having an average particle diameter of 500 nm or less, and electro-conductive particles. By mix a sufficient amount of inorganic fillers having an average particle diameter of 500 nm or less, the coefficient of thermal expansion can be decreased and the heat resistance and moisture resistance can be improved.
摘要翻译：提供了耐热性和耐湿性优异的电路耦合粘合剂。本发明的电路耦合粘合剂可以用于需要高性能可靠性的目的，因为它在电极连接时表现出令人满意的导电/绝缘性能，并且特性即使在长时间在高温高湿环境下使用。电路耦合粘合剂包括环氧树脂，潜伏性固化剂，平均粒径为500nm以下的无机填料和导电性颗粒作为必要成分。通过混合足量的平均粒径为500nm以下的无机填料，能够降低热膨胀系数，提高耐热性和耐湿性。

7. 发明申请

US20090175019A1 CIRCUIT-BOARD MODULE AND MANUFACTURING METHOD 审中-公开
标题翻译：电路板模块和制造方法
公开(公告)号：US20090175019A1
公开(公告)日：2009-07-09
申请号：US12299561
申请日：2008-02-08
申请人： Keiji Koyama , Masamichi Yamamoto , Katsunari Mikage , Jin-Joo Park
发明人： Keiji Koyama , Masamichi Yamamoto , Katsunari Mikage , Jin-Joo Park
IPC分类号： H05K1/14 , H01L21/98
CPC分类号： H05K3/323 , H01L2224/2929 , H01L2224/293 , H01L2224/83101 , H01L2224/83851 , H01L2924/07811 , H05K1/147 , H05K1/181 , H05K3/361 , H05K2201/0248 , H05K2201/10378 , H05K2203/1572 , H01L2924/00
摘要： [Problem]To enable mounting a part on the rear surface at the back of a connection part on a PCB to be connected with a FPC.[Means for Solving the Problem]Connection parts are provided such that a conductor wiring of a first circuit board and a conductor wiring of a second circuit board are connected with an anisotropic conductive adhesive which is made of an insulative resin including needle-shaped or linear chain-shaped metal powders oriented in a thickness direction, i.e., adhesion direction, and a part is mounted on at least either one of the first and the second circuit boards, the part being mounted on the rear surface at the back opposed to the surface where the connection part is formed.
摘要翻译： [问题]能够将要连接到FPC的PCB上的连接部分的背面的部件安装在背面。 [解决问题的方法]连接部件设置成使得第一电路板的导体布线和第二电路板的导体布线与各向异性导电粘合剂连接，所述各向异性导电粘合剂由包括针状或线性的绝缘树脂制成在厚度方向上取向的链状金属粉末，即粘附方向，一部分安装在第一和第二电路板中的至少一个中，该部分安装在与表面相对的背面的背面上其中连接部分形成。

8. 发明授权

US08728992B2 Grease composition and bearing 有权
标题翻译：油脂组成和轴承
公开(公告)号：US08728992B2
公开(公告)日：2014-05-20
申请号：US13318842
申请日：2010-05-14
申请人： Masamichi Yamamoto , Yutaka Imai , Jun-ichi Imai
发明人： Masamichi Yamamoto , Yutaka Imai , Jun-ichi Imai
IPC分类号： C10M125/18 , C10M131/00 , C08F8/34 , C10M105/72 , C10M115/08
CPC分类号： C10M169/06 , C10M135/08 , C10M135/10 , C10M2203/1006 , C10M2207/0406 , C10M2207/1285 , C10M2207/2835 , C10M2215/1023 , C10M2217/0456 , C10M2219/04 , C10M2219/044 , C10N2230/28 , C10N2230/76 , C10N2240/02 , C10N2240/20 , C10N2250/10 , F16C33/6633 , C10N2210/01
摘要： The invention provides a grease composition containing a thickener, a base oil and an antistatic agent, where the antistatic agent includes at least one selected from the group consisting of Li(CF3SO2)2N and Li(CF3SO2)3C; and a mechanical part where the above-mentioned grease composition is packed. The composition of the invention shows satisfactory results in the antistatic properties and the acoustic property.
摘要翻译：本发明提供含有增稠剂，基础油和抗静电剂的润滑脂组合物，其中抗静电剂包括选自Li（CF 3 SO 2）2 N和Li（CF 3 SO 2）3 C中的至少一种; 以及其中包装上述润滑脂组合物的机械部件。本发明的组合物在抗静电性能和声学性能方面表现出令人满意的结果。

9. 发明申请

US20100323147A1 ANISOTROPIC CONDUCTIVE FILM 审中-公开
标题翻译：各向异性导电膜
公开(公告)号：US20100323147A1
公开(公告)日：2010-12-23
申请号：US12918260
申请日：2009-08-27
申请人： Masamichi Yamamoto , Yasuhiro Okuda
发明人： Masamichi Yamamoto , Yasuhiro Okuda
IPC分类号： B32B5/16 , H01B1/20
CPC分类号： H05K3/323 , C08G2650/56 , C08L2205/05 , C08L2666/04 , C09J171/00 , H05K3/361 , Y10T428/24
摘要： There is provided an anisotropic conductive film that contains a radically polymerizable substance, a polymerization initiator that generates a radical by heating, a phenoxy resin having a molecular weight of 30,000 or more, and electrically conductive particles, wherein the anisotropic conductive film has a DSC exothermic onset temperature of 100° C. or lower and a DSC peak temperature of 120° C. or lower when measurement is performed at a rate of temperature increase of 10° C./min. The film is capable of establishing a sufficient electrical connection between circuit boards by heating at a low mounting temperature for a short time and is free from problems such as a reduction in connection performance with time in a high temperature and humidity atmosphere.
摘要翻译：提供了含有可自由基聚合物质，通过加热产生自由基的聚合引发剂，分子量为30,000以上的苯氧基树脂和导电性粒子的各向异性导电膜，其中各向异性导电膜具有DSC放热起始温度为100℃以下，当以10℃/分钟的升温速度进行测定时，DSC峰值温度为120℃以下。该膜能够通过在低安装温度下加热短时间来建立电路板之间的足够的电连接，并且没有诸如在高温和高湿气氛中的连接性能随时间的降低的问题。

10. 发明申请

US20100230141A1 STRUCTURE OF CONNECTING PRINTED WIRING BOARDS, METHOD OF CONNECTING PRINTED WIRING BOARDS, AND ADHESIVE HAVING ANISOTROPIC CONDUCTIVITY 有权
标题翻译：连接打印线的结构，连接打印线的方法和具有各向异性电导率的粘合
公开(公告)号：US20100230141A1
公开(公告)日：2010-09-16
申请号：US12722810
申请日：2010-03-12
申请人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Ayao Kariya , Katsuhiro Satou , Yasuhiro Okuda
发明人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Ayao Kariya , Katsuhiro Satou , Yasuhiro Okuda
IPC分类号： H05K1/03 , H05K3/36 , H05K1/02
CPC分类号： H05K3/323 , H05K2201/0248 , H05K2201/083 , H05K2203/083 , H05K2203/087 , H05K2203/104 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165
摘要： The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.
摘要翻译：本发明提供一种板连接结构，其可以提供具有细间距的电极，并且可以组合绝缘性能和连接可靠性。连接印刷电路板10和20的结构在第一板11上彼此相邻设置的多个第一电极12和13与设置成彼此相邻的多个第二电极22和23电连接第二板21通过含有导电粒子31并具有各向异性导电性的粘合剂30。通过加热和加压位于相互相对的第一电极12和第二电极22之间以及相互面对的第一电极13和第二电极23之间的粘合剂，在第一板11和第二板21之间形成粘接层30a，粘合层30a，在第一电极12和13之间以及第二电极22和23之间形成空腔部分33。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式