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1. 发明申请

US20100230141A1 STRUCTURE OF CONNECTING PRINTED WIRING BOARDS, METHOD OF CONNECTING PRINTED WIRING BOARDS, AND ADHESIVE HAVING ANISOTROPIC CONDUCTIVITY 有权
标题翻译：连接打印线的结构，连接打印线的方法和具有各向异性电导率的粘合
公开(公告)号：US20100230141A1
公开(公告)日：2010-09-16
申请号：US12722810
申请日：2010-03-12
申请人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Ayao Kariya , Katsuhiro Satou , Yasuhiro Okuda
发明人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Ayao Kariya , Katsuhiro Satou , Yasuhiro Okuda
IPC分类号： H05K1/03 , H05K3/36 , H05K1/02
CPC分类号： H05K3/323 , H05K2201/0248 , H05K2201/083 , H05K2203/083 , H05K2203/087 , H05K2203/104 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165
摘要： The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.
摘要翻译：本发明提供一种板连接结构，其可以提供具有细间距的电极，并且可以组合绝缘性能和连接可靠性。连接印刷电路板10和20的结构在第一板11上彼此相邻设置的多个第一电极12和13与设置成彼此相邻的多个第二电极22和23电连接第二板21通过含有导电粒子31并具有各向异性导电性的粘合剂30。通过加热和加压位于相互相对的第一电极12和第二电极22之间以及相互面对的第一电极13和第二电极23之间的粘合剂，在第一板11和第二板21之间形成粘接层30a，粘合层30a，在第一电极12和13之间以及第二电极22和23之间形成空腔部分33。

2. 发明授权

US08507803B2 Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity 有权
标题翻译：连接印刷电路板的结构，印刷电路板的连接方法和具有各向异性导电性的粘合剂
公开(公告)号：US08507803B2
公开(公告)日：2013-08-13
申请号：US12722810
申请日：2010-03-12
申请人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Ayao Kariya , Katsuhiro Satou , Yasuhiro Okuda
发明人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Ayao Kariya , Katsuhiro Satou , Yasuhiro Okuda
IPC分类号： H05K1/03
CPC分类号： H05K3/323 , H05K2201/0248 , H05K2201/083 , H05K2203/083 , H05K2203/087 , H05K2203/104 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165
摘要： The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.
摘要翻译：本发明提供一种板连接结构，其可以提供具有细间距的电极，并且可以组合绝缘性能和连接可靠性。连接印刷电路板10和20的结构在第一板11上彼此相邻设置的多个第一电极12和13与设置成彼此相邻的多个第二电极22和23电连接第二板21通过含有导电粒子31并具有各向异性导电性的粘合剂30。通过加热和加压位于相互相对的第一电极12和第二电极22之间以及相互面对的第一电极13和第二电极23之间的粘合剂，在第一板11和第二板21之间形成粘接层30a，粘合层30a，在第一电极12和13之间以及第二电极22和23之间形成空腔部分33。

3. 发明授权

US5561002A Electrode for alkaline storage battery and method of manufacturing 失效
标题翻译：碱性蓄电池用电极及其制造方法
公开(公告)号：US5561002A
公开(公告)日：1996-10-01
申请号：US444038
申请日：1995-05-18
申请人： Takeshi Sakamoto , Takafumi Uemiya , Tetsuya Nishi , Ayao Kariya , Toru Terao
发明人： Takeshi Sakamoto , Takafumi Uemiya , Tetsuya Nishi , Ayao Kariya , Toru Terao
IPC分类号： C23C18/16 , C23C18/34 , H01M4/24 , H01M4/66 , H01M4/80 , H01M10/24 , H01M4/64 , H01M4/32
CPC分类号： H01M4/66 , H01M4/661 , Y10T29/49115
摘要： An improved electrode for an alkaline storage battery can suppress the reduction of the battery capacity when the battery is used in a high-temperature environment. The electrode is formed by charging or filling a collector, which consists of a porous body of a nickel-boron alloy containing 0.001 to 3 percent by weight of boron, with an active material. The porous body of the nickel-boron alloy can be formed by depositing nickel on a surface of a substrate consisting of a porous polymer by electroless plating with a boron compound serving as a reductant.
摘要翻译：用于碱性蓄电池的改进的电极可以抑制当在高温环境中使用电池时电池容量的降低。该电极通过填充或填充由含有0.001至3重量％硼的镍 - 硼合金的多孔体与活性材料组成的集电体而形成。镍 - 硼合金的多孔体可以通过用作为还原剂的硼化合物的化学镀来在由多孔聚合物构成的基板的表面上沉积镍来形成。

4. 发明授权

US06465133B1 Metallic porous body and method of manufacturing the same and battery current collector having the same 有权
标题翻译：金属多孔体及其制造方法以及具有该金属多孔体的电池集电体
公开(公告)号：US06465133B1
公开(公告)日：2002-10-15
申请号：US09567014
申请日：2000-05-09
申请人： Ayao Kariya , Noriki Hayashi , Shinji Inazawa , Masatoshi Majima
发明人： Ayao Kariya , Noriki Hayashi , Shinji Inazawa , Masatoshi Majima
IPC分类号： H01M480
CPC分类号： H01M4/80 , C25D5/56 , H01M4/808 , H01M2300/0014 , Y10T428/12042 , Y10T428/12111
摘要： A metallic porous body comprises a metallic framework having a three-dimensional network with a continuous-pore structure formed by linking sub-stantially polyhedral cells. The substantially polyhedral cells have an average cell diameter of about 200 to about 300 &mgr;m and an average window diameter of about 100 to about 200 &mgr;m. The metallic porous body can be obtained by the following method, for instance: First, a plastic porous body is provided that has an average cell diameter of about 200 to about 300 &mgr;m and an average window diameter of about 100 to about 200 &mgr;m. Second, a conductive layer is formed on a surface of the framework of the plastic porous body to produce a conductive porous body having a resistivity of about 1 k&OHgr;·cm or less. Finally, a continuous metal-plated layer is formed on a surface of the conductive layer by electroplating, with the conductive porous body serving as the cathode. The above-mentioned current collector is provided by filling an active material into the pores of the metallic porous body.
摘要翻译：金属多孔体包括具有三维网状物的金属框架，该三维网状结构具有通过连接亚稳定多面体单元形成的连续孔结构。基本上多边形的单元具有约200至约300μm的平均泡孔直径和约100至约200μm的平均窗口直径。金属多孔体可以通过以下方法获得，例如：首先，提供具有约200至约300μm的平均泡孔直径和约100至约200μm的平均窗口直径的塑料多孔体。其次，在塑料多孔体的框架的表面上形成导电层，以制造电阻率为约1kOMEGA·cm以下的导电性多孔体。最后，通过电镀在导电层的表面上形成连续的金属镀层，导电多孔体用作阴极。通过将活性物质填充到金属多孔体的孔中来提供上述集电体。

5. 发明授权

US06852210B2 Plating method and plating bath precursor used therefor 失效
标题翻译：电镀方法及镀浴前驱体
公开(公告)号：US06852210B2
公开(公告)日：2005-02-08
申请号：US10036506
申请日：2002-01-07
申请人： Keigo Obata , Dong-Hyun Kim , Takao Takeuchi , Seiichiro Nakao , Shinji Inazawa , Ayao Kariya , Masatoshi Majima , Shigeyoshi Nakayama
发明人： Keigo Obata , Dong-Hyun Kim , Takao Takeuchi , Seiichiro Nakao , Shinji Inazawa , Ayao Kariya , Masatoshi Majima , Shigeyoshi Nakayama
IPC分类号： C23C18/31 , C23C18/16 , C23C18/34 , C25D3/56
CPC分类号： C23C18/1617 , C23C18/34 , Y10S428/935 , Y10T428/12681 , Y10T428/12701 , Y10T428/12708 , Y10T428/12792 , Y10T428/12819 , Y10T428/12826 , Y10T428/12847 , Y10T428/12861 , Y10T428/12875 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/12944 , Y10T428/12951
摘要： To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.
摘要翻译：为了提供能够广泛地使用具有优异特性的氧化还原体系无电镀方法的镀覆方法，以及优选用于电镀方法的镀浴前体。电镀方法包括将电镀浴的氧化还原体系的第一金属离子氧化为较低氧化态的工艺，并且所述氧化还原体系的第二金属离子被还原并沉积到被镀物体的表面上其中提供了一种通过向电镀槽供应电流的方法，使第一金属离子从所述较低氧化态还原，从而激活镀浴。形成电镀槽前体稳定电镀液，从而基本上不会发生第二金属离子的还原和沉积，以改善其存储性能。

6. 发明授权

US06338787B1 Redox system electroless plating method 有权
标题翻译：氧化还原体系化学镀方法
公开(公告)号：US06338787B1
公开(公告)日：2002-01-15
申请号：US09543356
申请日：2000-04-05
申请人： Keigo Obata , Dong-Hyun Kim , Takao Takeuchi , Seiichiro Nakao , Shinji Inazawa , Ayao Kariya , Masatoshi Majima , Shigeyoshi Nakayama
发明人： Keigo Obata , Dong-Hyun Kim , Takao Takeuchi , Seiichiro Nakao , Shinji Inazawa , Ayao Kariya , Masatoshi Majima , Shigeyoshi Nakayama
IPC分类号： C25C100
CPC分类号： C23C18/1617 , C23C18/34 , Y10S428/935 , Y10T428/12681 , Y10T428/12701 , Y10T428/12708 , Y10T428/12792 , Y10T428/12819 , Y10T428/12826 , Y10T428/12847 , Y10T428/12861 , Y10T428/12875 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/12944 , Y10T428/12951
摘要： To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.
摘要翻译：为了提供能够广泛地使用具有优异特性的氧化还原体系无电镀方法的镀覆方法，以及优选用于电镀方法的镀浴前体。电镀方法包括将电镀浴的氧化还原体系的第一金属离子氧化为较低氧化态的工艺，并且所述氧化还原体系的第二金属离子被还原并沉积到被镀物体的表面上其中提供了一种通过向电镀槽供应电流的方法，使第一金属离子从所述较低氧化态还原，从而激活镀浴。形成电镀槽前体稳定电镀液，从而基本上不会发生第二金属离子的还原和沉积，以改善其存储性能。

7. 发明授权

US06379845B1 Conductive porous body and metallic porous body and battery plate both produced by using the same 失效
标题翻译：导电多孔体和金属多孔体和电池板都使用它们制造
公开(公告)号：US06379845B1
公开(公告)日：2002-04-30
申请号：US09541619
申请日：2000-04-03
申请人： Shinji Inazawa , Masatoshi Majima , Ayao Kariya
发明人： Shinji Inazawa , Masatoshi Majima , Ayao Kariya
IPC分类号： H01M480
CPC分类号： H01M4/0452 , C23C18/30 , C23C18/34 , H01M4/02 , H01M4/0497 , H01M4/29 , H01M4/667 , H01M4/80 , H01M4/808 , H01M2004/021 , Y10T29/10
摘要： A conductive porous body that has a conductive layer almost free from impurities and that enables a metallic porous body having extremely low resistance to be produced with high productivity and production efficiency, and a metallic porous body and a battery plate both produced by using the conductive porous body. The conductive porous body has a nickel conductive layer formed on the surface of the framework of a plastic porous body having a continuous-pore structure. The conductive layer is formed by the deposition of nickel from an aqueous solution containing nickel compounds with the use of a reducing agent containing titanium compounds. The metallic porous body can be obtained by forming a continuous metal-plated layer on the surface of the framework of the conductive porous body. The metal-plated layer is formed by electroplating with the conductive porous body serving as the cathode. The battery plate consists mainly of the metallic porous body.
摘要翻译：具有几乎不含杂质的导电层的导电性多孔体，能够以高生产率和生产效率制造具有极低电阻的金属多孔体，以及金属多孔体和电池板，均通过使用导电性多孔体身体。导电性多孔体具有形成在具有连续孔结构的塑料多孔体的框架的表面上的镍导电层。通过使用含有钛化合物的还原剂从含有镍化合物的水溶液中沉积镍形成导电层。金属多孔体可以通过在导电性多孔体的框架的表面上形成连续的金属镀层来获得。金属镀层通过电镀作为阴极的导电性多孔体而形成。电池板主要由金属多孔体组成。

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