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    • 1. 发明授权
    • Magnetic bi-dimensional position sensor
    • 磁性二维位置传感器
    • US06529140B1
    • 2003-03-04
    • US09085887
    • 1998-05-27
    • Herbert SaxBruno MurariFlavio VillaBenedetto VignaPaolo Ferrari
    • Herbert SaxBruno MurariFlavio VillaBenedetto VignaPaolo Ferrari
    • G08C1906
    • G01V3/081G01D5/145
    • A bi-dimensional position sensor that can be advantageously used in the turn system controlled from the steering wheel of a vehicle. The sensor includes a permanent magnet fixed to a control lever so as to move in a plane along first and second directions and to rotate about a third direction orthogonal to the preceding ones. The permanent magnet is movable with respect to an integrated device including a first group of sensor elements arranged spaced along the first direction, a second group of sensor elements arranged spaced along the second direction and a third group of sensor elements detecting the angular position of the permanent magnet. Electronics integrated with the sensor elements generate a code associated with each position which the permanent magnet may assume and generate a control signal corresponding to the desired function.
    • 一种二维位置传感器,其可以有利地用于从车辆的方向盘控制的转向系统中。 传感器包括固定到控制杆的永久磁铁,以沿着第一和第二方向在平面内移动并围绕与前述正交的第三方向旋转。 永磁体可相对于包括沿着第一方向间隔布置的第一组传感器元件的集成装置移动,第二组传感器元件沿着第二方向间隔布置,第三组传感器元件检测第二组传感器元件的角位置 永久磁铁 与传感器元件集成的电子产生与永磁体可以采取的每个位置相关联的代码,并产生对应于期望功能的控制信号。
    • 5. 发明授权
    • Method of fabricating a piezoresistive pressure sensor
    • 制造压阻式压力传感器的方法
    • US06417021B1
    • 2002-07-09
    • US09404507
    • 1999-09-23
    • Benedetto VignaPaolo FerrariFlavio Villa
    • Benedetto VignaPaolo FerrariFlavio Villa
    • H01L2100
    • G01L9/0042G01L9/0055
    • The pressure sensor is integrated in an SOI (Silicon-on-Insulator) substrate using the insulating layer as a sacrificial layer, which is partly removed by chemical etching to form the diaphragm. To fabricate the sensor, after forming the piezoresistive elements and the electronic components integrated in the same chip, trenches are formed in the upper wafer of the substrate and extending from the surface to the layer of insulating material; the layer of insulating material is chemically etched through the trenches to form an opening beneath the diaphragm; and a dielectric layer is deposited to outwardly close the trenches and the opening. Thus, the process is greatly simplified, and numerous packaging problems eliminated.
    • 压力传感器集成在使用绝缘层作为牺牲层的SOI(绝缘体上硅)衬底中,其通过化学蚀刻部分去除以形成隔膜。 为了制造传感器,在形成压电元件和集成在同一芯片中的电子部件之后,在基板的上晶片中形成沟槽,并从表面延伸到绝缘材料层; 绝缘材料层通过沟槽进行化学蚀刻,以形成隔膜下面的开口; 并且沉积介电层以向外关闭沟槽和开口。 因此,该过程被大大简化,并且消除了许多封装问题。