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    • 3. 发明授权
    • Complementary heterojunction device
    • 互补异质结装置
    • US5349214A
    • 1994-09-20
    • US119554
    • 1993-09-13
    • Saied N. TehraniX. Theodore ZhuHerbert GoronkinJun Shen
    • Saied N. TehraniX. Theodore ZhuHerbert GoronkinJun Shen
    • H01L29/80H01L27/06H01L27/092H01L27/095H01L27/088H01L27/105H01L31/06
    • H01L27/0605H01L27/092Y10S148/015Y10S148/072Y10S148/16
    • A heterojunction device including a first semiconductive layer on a substrate, a barrier layer on the first layer, a second semiconductive layer on the barrier layer and a multi-layer cap, on the second semiconductive layer. First and second gates positioned on layers of the cap to define first and second transistors, with the cap layers being selected and etched to pin the Fermi level in a first transistor conduction channel in the second semiconductive layer such that the number of carriers in the first conduction channel are substantially less than the number of carriers in surrounding portions of the second semiconductive layer and the Fermi level in a second transistor conduction channel in the first semiconductive layer such that the number of carriers in the second conduction channel are substantially less than the number of carriers in surrounding portions of the first semiconductive layer.
    • 一种异质结装置,在第二半导体层上包括衬底上的第一半导体层,第一层上的阻挡层,阻挡层上的第二半导体层和多层帽。 位于盖的层上的第一和第二栅极限定第一和第二晶体管,其中盖层被选择和蚀刻以在第二半导体层中的第一晶体管导通通道中引导费米能级,使得第一和第二晶体管中的载流子数目 传导通道基本上小于第一半导体层中的第二半导体层的周围部分中的载流子数量和第二晶体管传导通道中的费米能级数,使得第二导电通道中的载流子数目基本上小于数量 在第一半导体层的周围部分的载体。
    • 10. 发明授权
    • Interconnect structure for coupling semiconductor regions and method for
making
    • 用于耦合半导体区域的互连结构和制造方法
    • US5280180A
    • 1994-01-18
    • US932116
    • 1992-08-19
    • Herbert GoronkinJun ShenSaied TehraniRaymond K. TsuiX. Theodore Zhu
    • Herbert GoronkinJun ShenSaied TehraniRaymond K. TsuiX. Theodore Zhu
    • H01L21/20H01L23/535H01L29/06H01L29/80H01L29/161H01L29/205
    • H01L23/535H01L2924/0002
    • A semiconductor device having a lateral interconnect or via formed by quantum well comprising a semiconductor material is provided. The lateral interconnect (17, 18, 19) formed by a quantum well comprising a first semiconductor material composition. A first semiconductor region (11, 12, 13) comprising a second material type is formed adjacent to the lateral interconnect (17, 18, 19). A second semiconductor region (23, 24, 26) comprising the second material type is adjacent to the lateral interconnect (17, 18, 19) so that the lateral interconnect (17, 18, 19) separates the first (11, 12, 13) and second (23, 24, 26) semiconductor regions. The first (17, 18, 19) and second (23, 24, 26) semiconductor regions have a first quantized energy level that is substantially equal. The lateral interconnect (17, 18, 19) has a first quantized energy level capable of alignment with the quantized energy levels of the first (11, 12, 13) and second (23, 24, 26) semiconductor regions.
    • 提供了具有由包括半导体材料的量子阱形成的横向互连或通孔的半导体器件。 由包括第一半导体材料组合物的量子阱形成的横向互连(17,18,19)。 包括第二材料类型的第一半导体区域(11,12,13)形成为与横向互连(17,18,19)相邻。 包括第二材料类型的第二半导体区域(23,24,26)与横向互连(17,18,19)相邻,使得横向互连(17,18,19)将第一(11,12,13) )和第二(23,24,26)个半导体区域。 第一(17,18,19)和第二(23,24,26)半导体区域具有基本相等的第一量化能级。 横向互连(17,18,19)具有能够与第一(11,12,13)和第二(23,24,26)半导体区域的量化能级对准的第一量化能级。