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    • 4. 发明授权
    • Heating system, method for heating a deposition or oxidation reactor, and reactor including the heating system
    • 加热系统,用于加热沉积或氧化反应器的方法和包括加热系统的反应器
    • US06802712B2
    • 2004-10-12
    • US10685062
    • 2003-10-14
    • Henry BernhardtThomas SeidemannMichael Stadtmueller
    • Henry BernhardtThomas SeidemannMichael Stadtmueller
    • F27D110
    • H01L21/67109C23C16/46C30B25/10C30B33/005
    • A heating system, a method for heating a deposition reactor or an oxidation reactor, and a reactor utilizing the heating system are particularly suited for low-pressure chemical vapor deposition or oxidation. A heating system is particularly useful for heating a reactor in which a plurality of wafers is held perpendicularly to the reactant gas flowing direction that is parallel to the longitudinal axis of the reactor, to enable a deposition or oxidation reaction. The heating system is adapted to change the reactor temperature during the process. In addition, a method heats a reactor to enable a reaction. Preferably, each of a plurality of reactor zones, into which the reactor is divided in a direction parallel to the reactant gas flowing direction, is heated at a different temperature profile indicating the temperature of this specific zone versus time. Thereby, the in-plane uniformity of deposited or oxidized layers can be largely improved.
    • 加热系统,用于加热沉积反应器或氧化反应器的方法以及利用加热系统的反应器特别适用于低压化学气相沉积或氧化。 加热系统特别可用于加热其中多个晶片垂直于平行于反应器的纵向轴线的反应物气体流动方向保持的反应器,以实现沉积或氧化反应。 加热系统适用于在过程中改变反应器温度。 此外,一种方法加热反应器以进行反应。 优选地,将反应器沿平行于反应物气体流动方向的方向分割的多个反应器区域中的每一个以指示该特定区域的温度相对于时间的不同温度分布被加热。 由此,能够大幅提高沉积层或氧化层的面内均匀性。
    • 5. 发明授权
    • Memory cell and method for fabricating it
    • 记忆单元及其制造方法
    • US07144770B2
    • 2006-12-05
    • US10980069
    • 2004-11-03
    • Albert BirnerMatthias FoersterThomas HechtMichael StadtmuellerAndreas Orth
    • Albert BirnerMatthias FoersterThomas HechtMichael StadtmuellerAndreas Orth
    • H01L21/8242
    • H01L29/66181H01L29/945
    • The invention provides a method for fabricating a memory cell, a substrate (101) being provided, a trench-type depression (102) being etched into the substrate (101), a barrier layer (103) being deposited non-conformally in the trench-type depression (102), grain elements (104) being grown on the inner areas of the trench-type depression (102), a dielectric layer (202) being deposited on the surfaces of the grain elements and the inner areas of the trench-type depression, and a conduction layer being deposited on the dielectric layer, the grain elements (104) growing selectively on the inner areas (105) of the trench-type depression (102) in an electrode region (301) forming a lower region of the trench-type depression (102) and an amorphous silicon layer continuing to grow in a collar region (302) forming an upper region of the trench-type depression (102).
    • 本发明提供了一种用于制造存储单元的方法,提供了一种衬底(101),蚀刻到衬底(101)中的沟槽型凹陷(102),在沟槽中非保形地沉积的阻挡层(103) 型凹陷(102),在沟槽型凹部(102)的内部区域上生长的晶粒元素(104),沉积在晶粒元素的表面上的介电层(202)和沟槽的内部区域 型凹陷,并且导电层沉积在电介质层上,晶粒元素(104)选择性地生长在形成下部区域的电极区域(301)中的沟槽型凹陷(102)的内部区域(105) 的沟槽型凹陷(102)和在形成沟槽型凹陷(102)的上部区域的凸缘区域(302)中继续生长的非晶硅层。