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    • 2. 发明申请
    • TOUCHED POSITION IDENTIFICATION METHOD
    • 触控位置识别方法
    • US20110234535A1
    • 2011-09-29
    • US12779927
    • 2010-05-13
    • Yi-Ling HungHeng-Chang Lin
    • Yi-Ling HungHeng-Chang Lin
    • G06F3/042
    • G06F3/0425
    • A touched position identification method for identifying a position touched by an object on an optical touch panel is provided. The optical touch panel includes optical sensors, a light guide plate and a controllable light source. The controllable light source is disposed at a light incident side of the light guide plate. In the method, a turn-on action and a turn-off action are alternatively performed on the controllable light source with a predetermined interval. At least an nth and a (n+2)th image data corresponding to the turn-on action and a (n+1)th and a (n+3)th image data corresponding to the turn-off action is obtained through the optical sensors, wherein n is a natural number. An operation is performed on the image data to obtain a first comparative data and a second comparative data, and the position touched by the object is identified according to the first and the second comparative data.
    • 提供了一种用于识别由光学触摸面板上的物体触摸的位置的触摸位置识别方法。 光学触摸面板包括光学传感器,导光板和可控光源。 可控光源设置在导光板的光入射侧。 在该方法中,以预定间隔在可控光源上交替地执行接通动作和关闭动作。 对应于接通动作的第n和第(n + 2)个图像数据,以及对应于关闭动作的第(n + 1)和第(n + 3)个图像数据,通过 光学传感器,其中n是自然数。 对图像数据执行操作以获得第一比较数据和第二比较数据,并且根据第一和第二比较数据识别由对象触摸的位置。
    • 3. 发明申请
    • DRIVING METHOD OF TOUCH DEVICE
    • 触摸装置的驱动方法
    • US20120013568A1
    • 2012-01-19
    • US12913766
    • 2010-10-28
    • Yi-Ling HungHeng-Chang Lin
    • Yi-Ling HungHeng-Chang Lin
    • G06F3/045
    • G06F3/044G06F3/045
    • A resistive/capacitive integrated touch device includes a resistive touch module, a capacitive touch module and a spacer layer. The resistive touch module includes a first substrate and a first sensing layer. The capacitive touch module includes a second substrate and a second sensing layer. The second sending layer includes a plurality of first sensing pads and a plurality of second sensing pads. The spacer layer is disposed between the first and the second sensing layers. The resistive/capacitive integrated touch device utilizes the plurality of first sensing pads and the plurality of second sensing pads to detect the voltage variation of the first sensing layer for resistive sensing, and detecting the capacitance variation of the plurality of first sensing pads and the plurality of second sensing pads for capacitive sensing.
    • 电阻/电容集成触摸装置包括电阻式触摸模块,电容式触摸模块和间隔层。 电阻式触摸模块包括第一基板和第一感测层。 电容式触摸模块包括第二基板和第二感测层。 第二发送层包括多个第一感测焊盘和多个第二传感焊盘。 间隔层设置在第一和第二感测层之间。 电阻/电容集成触摸装置利用多个第一感测焊盘和多个第二感测焊盘来检测用于电阻感测的第一感测层的电压变化,并且检测多个第一感测焊盘和多个第一传感焊盘的电容变化 的第二感测垫用于电容感测。
    • 4. 发明申请
    • RESISTIVE/CAPACITIVE INTEGRATED TOUCH DEVICE
    • 电阻/电容式集成触摸装置
    • US20120013567A1
    • 2012-01-19
    • US12913764
    • 2010-10-28
    • Yi-Ling HungHeng-Chang Lin
    • Yi-Ling HungHeng-Chang Lin
    • G06F3/045
    • G06F3/044G06F3/045
    • A resistive/capacitive integrated touch device includes a resistive touch module, a capacitive touch module and a spacer layer. The resistive touch module includes a first substrate and a first sensing layer. The capacitive touch module includes a second substrate and a second sensing layer. The second sending layer includes a plurality of first sensing pads and a plurality of second sensing pads. The spacer layer is disposed between the first and the second sensing layers. The resistive/capacitive integrated touch device utilizes the plurality of first sensing pads and the plurality of second sensing pads to detect the voltage variation of the first sensing layer for resistive sensing, and detecting the capacitance variation of the plurality of first sensing pads and the plurality of second sensing pads for capacitive sensing.
    • 电阻/电容集成触摸装置包括电阻式触摸模块,电容式触摸模块和间隔层。 电阻式触摸模块包括第一基板和第一感测层。 电容式触摸模块包括第二基板和第二感测层。 第二发送层包括多个第一感测焊盘和多个第二传感焊盘。 间隔层设置在第一和第二感测层之间。 电阻/电容集成触摸装置利用多个第一感测焊盘和多个第二感测焊盘来检测用于电阻感测的第一感测层的电压变化,并且检测多个第一感测焊盘和多个第一传感焊盘的电容变化 的第二感测垫用于电容感测。
    • 7. 发明申请
    • PERIPHERAL CIRCUIT
    • 外围电路
    • US20090207369A1
    • 2009-08-20
    • US12234700
    • 2008-09-21
    • Heng-Chang LinYu-Fang WangMing-Kang HuangChih-Kun Lin
    • Heng-Chang LinYu-Fang WangMing-Kang HuangChih-Kun Lin
    • G02F1/1345
    • G02F1/13452G02F2001/136254
    • A peripheral circuit disposed on a substrate having an active device array is provided. The peripheral circuit includes first test pads, second test pads, first lines, and second lines. The first and the second lines are electrically connected to the active device array. Each first test pad includes a first conductive layer and a second conductive layer electrically connected to the first conductive layer. The first conductive layer electrically connects at least two of the adjacent first lines. The second test pads are interposed between the first test pads and the active device array. Each second test pad includes third conductive layers and a fourth conductive layer electrically connected to the third conductive layers. The first lines pass through the third conductive layers and are insulated from the fourth conductive layer. Each third conductive layer is electrically connected to one of the adjacent second lines respectively.
    • 设置在具有有源器件阵列的衬底上的外围电路。 外围电路包括第一测试焊盘,第二测试焊盘,第一线和第二线。 第一和第二线电连接到有源器件阵列。 每个第一测试焊盘包括电连接到第一导电层的第一导电层和第二导电层。 第一导电层电连接相邻第一线中的至少两个。 第二测试焊盘插入在第一测试焊盘和有源器件阵列之间。 每个第二测试焊盘包括第三导电层和与第三导电层电连接的第四导电层。 第一线穿过第三导电层并与第四导电层绝缘。 每个第三导电层分别电连接到相邻的第二线之一。