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    • 1. 发明授权
    • Method for preparing substrates for optical sensors
    • 光学传感器基板的制备方法
    • US4776869A
    • 1988-10-11
    • US53617
    • 1987-05-26
    • Helmut OffenbacherHerbert Kroneis
    • Helmut OffenbacherHerbert Kroneis
    • C03B8/00C03C3/091C03C11/00C03C15/00C03C23/00G01N31/22
    • C03C11/005C03C23/008
    • Bodies of borosilicate glass with a B.sub.2 O.sub.3 content of less than 13 percent by weight are provided with a microporous layer of a thickness of 5 to 20 .mu.m, and are thus turned into carriers for optical sensors. This process is characterized by the following steps. Thermal decomposition for 5 to 10 days at 500.degree. to 560.degree. C.; removal of the topmost layer of glass to a depth of at least 10 .mu.m in the part of the surface to be rendered porous; leaching of the separated borate phase with diluted mineral acids for a minimum of 2 days at 70.degree. to 98.degree. C.; and after-treatment of the microporous layer, including (a) chemical treatment with concentrated sulphuric acid and concentrated nitric acid for 2 hours at 20.degree. C., and (b) heat-treatment for 10 minutes to 2 hours at 450.degree. to 700.degree. C.
    • 具有小于13重量%的B 2 O 3含量的硼硅酸盐玻璃体具有厚度为5至20μm的微孔层,因此被转成光学传感器的载体。 该过程的特征在于以下步骤。 在500〜560℃下热分解5〜10天。 在待表面多孔的部分表面去除最上层的玻璃至少10μm的深度; 将分离的硼酸盐相与稀释的无机酸一起在70℃至98℃下浸出最少2天; (a)在20℃下用浓硫酸和浓硝酸进行2小时的化学处理,和(b)在450〜700℃下热处理10分钟〜2小时 DEG C.