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1. 发明授权

US5468786A Radiation-curable reaction resin system 失效
标题翻译：可辐射固化反应树脂体系
公开(公告)号：US5468786A
公开(公告)日：1995-11-21
申请号：US191141
申请日：1994-02-02
申请人： Heiner Bayer , Barbara Lehner , Michael Rogalli
发明人： Heiner Bayer , Barbara Lehner , Michael Rogalli
IPC分类号： C08F2/46 , C08F2/50 , C08F2/54 , C08F283/00 , C08G59/00 , C08G59/18 , C08L63/00 , C08L101/00
CPC分类号： C08F283/00
摘要： A radiation-curable reaction resin system, comprising a homogeneous solution of a thermoplastic and a reaction resin, whereby the proportion of the thermoplastic in the solution is approximately 3 to about 50% by weight. The reaction resin system has a stable shelf life. Further, the reaction resin system can be cured by radiation to form a shaped material, comprising a continuous and a discontinuous phase and which exhibits thermoplastic-like behavior.
摘要翻译：一种可辐射固化的反应树脂体系，其包含热塑性树脂和反应树脂的均匀溶液，由此该溶液中热塑性塑料的比例为约3至约50重量％。反应树脂体系具有稳定的保质期。此外，反应树脂体系可以通过辐射固化以形成成型材料，其包含连续的和不连续的相，并表现出类似热塑性的行为。

2. 发明授权

US6150435A One-component epoxy resin for covering electronic components 失效
标题翻译：用于覆盖电子元件的单组分环氧树脂
公开(公告)号：US6150435A
公开(公告)日：2000-11-21
申请号：US190647
申请日：1998-11-12
申请人： Heiner Bayer , Barbara Lehner , Ernst Wipfelder
发明人： Heiner Bayer , Barbara Lehner , Ernst Wipfelder
IPC分类号： C08G59/18 , C08G59/62 , C08G59/68 , C08L63/00 , H01L23/29 , C08J3/00 , C08F283/00 , C08G65/48 , C08K3/34
CPC分类号： H01L23/293 , C08G59/18 , C08G59/62 , C08G59/687 , C08L63/00 , H01L2924/0002
摘要： A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the properties of the resin with respect to coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity.
摘要翻译：公开了用于覆盖裸芯片和倒装芯片底部填充的单组分环氧树脂。在本发明的环氧树脂中组合了两种多元醇组分，这显着改善了树脂的相对于膨胀系数，收缩应力，底物粘附性和反应性的性能。

3. 发明授权

US5227219A Surface wave components with an acoustically matched damping compound 失效
标题翻译：表面波组件与声音匹配阻尼化合物
公开(公告)号：US5227219A
公开(公告)日：1993-07-13
申请号：US402355
申请日：1989-09-05
申请人： Heiner Bayer , Michael Rogalli , Frank Dittrich , Hans Stelzl
发明人： Heiner Bayer , Michael Rogalli , Frank Dittrich , Hans Stelzl
IPC分类号： C08G59/56 , C08G59/58 , C08L63/00 , G10K11/16 , G10K11/36 , H03H3/08 , H03H9/25
CPC分类号： G10K11/002 , G10K11/36 , Y10S428/901 , Y10T428/24479 , Y10T428/24802 , Y10T428/31511
摘要： An acoustically matched reaction resin compound for damping coating of surface wave components is disclosed that contains one or more epoxy resins, one or more dicarboxylic acids or polycarboxylic acids or, respectively, acidic esters of dicarboxylic acids or polycarboxylic acids, an aliphatic or hetero-aromatic amine in a proportion sufficient to catalyze the cross linking of the reaction resin compound, and a solvent. The number of amine hydrogen equivalents and acid equivalents together is less than the number of epoxy equivalents and the uniformly mixed reaction resin compound can be set to a predetermined viscosity and thixotropy required for the application. For example, the reaction resin compound can be applied onto the wafer containing the surface wave components in a silk screening process. Sharp contours can be produced that survive the curing process in an unmodified state. The damping properties of cured reaction resin structures are excellent; corrosion induced by the resin is noticeably reduced.
摘要翻译：公开了一种声学匹配的用于阻止表面波分量涂层的反应树脂化合物，其包含一种或多种环氧树脂，一种或多种二羧酸或多元羧酸，或分别为二羧酸或多元羧酸的酸性酯，脂族或杂芳族胺的比例足以催化反应树脂化合物和溶剂的交联。胺氢等价物的数量和酸当量一起小于环氧当量的数量，并且可以将均匀混合的反应树脂化合物设定为施加所需的预定粘度和触变性。例如，反应树脂化合物可以在丝印过程中施加到含有表面波成分的晶片上。可以产生在未修饰状态下经受固化过程的锋利轮廓。固化反应树脂结构的阻尼性能优异; 由树脂引起的腐蚀明显降低。

4. 发明授权

US5366573A UV-curable adhesive semiconductor chip mounting process 失效
标题翻译： UV固化粘合剂半导体芯片安装工艺
公开(公告)号：US5366573A
公开(公告)日：1994-11-22
申请号：US111023
申请日：1993-08-24
申请人： Heiner Bayer , Barbara Lehner , Oskar Wirbser , Gregor Unger
发明人： Heiner Bayer , Barbara Lehner , Oskar Wirbser , Gregor Unger
IPC分类号： C08F299/00 , C08F2/50 , C08F290/00 , C09J4/00 , C09J4/02 , H01L21/52 , H01L21/58 , H01L21/68 , H01L23/29 , H01L23/31 , H01L33/00 , B32B31/00 , B23K1/00
CPC分类号： H01L21/6835 , H01L24/29 , H01L24/83 , H01L2221/68359 , H01L2221/68363 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01061 , H01L2924/01068 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12041 , H01L2924/19042
摘要： Assembly of semiconductor chips is accomplished using an acrylate-based adhesive which can be cured rapidly by UV light and which gives an adhesive bond that is resistant to soldering by can be readily removed by solvents after soldering. During assembly, the back sides of the semiconductor chips are bonded to a temporary carrier by the adhesive and adjusted to the proper mirror image position on the carrier before the adhesive is cured. The chip array is then soldered on a component and the temporary carrier is removed from the chips by a solvent.
摘要翻译： PCT No.PCT / DE90 / 00290 Sec。一九九二年二月二十一日 102（e）日期1992年2月21日PCT提交1990年04月17日PCT公布。公开号WO91 / 01043 日期：1991年1月24日。半导体芯片的组装通过使用能够通过UV光快速固化的丙烯酸酯类粘合剂来实现，并且通过焊接可以容易地通过溶剂去除耐焊接性的粘合剂粘合剂。在组装期间，半导体芯片的背面通过粘合剂粘合到临时载体上，并在粘合剂固化之前调节到载体上的适当的镜像位置。然后将芯片阵列焊接在部件上，并通过溶剂将临时载体从芯片上移除。

5. 发明授权

US5158990A Coating compounds for electrical and electronic components containing vitreons fused silica 失效
标题翻译：包含玻璃体熔融二氧化硅的电气和电子部件的涂料化合物
公开(公告)号：US5158990A
公开(公告)日：1992-10-27
申请号：US827898
申请日：1992-01-30
申请人： Heiner Bayer , Barbara Lehner , Hans-Peter Fritsch , Kurt Wohak
发明人： Heiner Bayer , Barbara Lehner , Hans-Peter Fritsch , Kurt Wohak
IPC分类号： H01L21/312 , H01L21/56 , H01L23/29 , H05K3/28
CPC分类号： H01L21/56 , H01L23/295 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01012 , H01L2924/01014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01068 , H01L2924/01077 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H05K3/287
摘要： A drop coating compound in particular, for unhoused electrical and electronic circuits and components. The compound includes highly filled ultraviolet-curable epoxy resin compounds having improved properties with respect to their use and in comparison to previously used, predominantly two-component, thermally curable resins.
摘要翻译：特别是滴涂剂化合物，用于未安装的电气和电子电路和组件。该化合物包括高度填充的紫外线固化型环氧树脂化合物，其相对于其使用具有改进的性能，并且与先前使用的主要是双组分的热固化树脂相比。

6. 发明授权

US5242715A Process for coating or bonding electronic components and subassemblies 失效
标题翻译：涂层或粘接电子元件和底座的方法
公开(公告)号：US5242715A
公开(公告)日：1993-09-07
申请号：US835805
申请日：1992-02-14
申请人： Lothar Schoen , Bernhard Stapp , Heiner Bayer , Helmut Markert , Volker Muhrer
发明人： Lothar Schoen , Bernhard Stapp , Heiner Bayer , Helmut Markert , Volker Muhrer
IPC分类号： B05D3/02 , B05D3/06 , B05D7/24 , C08G59/00 , C08G59/68 , C08L63/00 , C09D163/00 , C09J163/00 , G03F7/029 , H01L21/56 , H01L23/29 , H05K3/28
CPC分类号： H01L23/293 , C08G59/687 , G03F7/029 , H01L21/56 , H01L2924/0002 , H05K3/285
摘要： In a process for coating or bonding electronic components and subassemblies with reaction resin mixtures that are stable in storage at room temperature as a one-component system for several months, reaction resin mixtures are used, which contain the following components:a cationically hardenable, solvent-free epoxy resin;a triarylsulphonium salt with hexafluorophosphate, -arsenate or -antimonate as anion, with a mass concentration of 0.01 to 5% (relative to epoxy resin); anda benzylthiolanium salt with hexafluorophosphate, -arsenate or -antimonate as anion, with a mass concentration of 0.01 to 5% (relative to epoxy resin);as well as possibly customary additives.These reaction resin mixtures are hardened through UV radiation and thermally.
摘要翻译：在用作为单组分体系几个月在室温下储存稳定的反应树脂混合物涂覆或粘合电子部件和组件的方法中，使用反应树脂混合物，其含有以下组分：阳离子可硬化溶剂无环氧树脂; 三芳基锍盐与六氟磷酸盐，胂酸盐或锑酸盐阴离子，质量浓度为0.01〜5％（相对于环氧树脂）; 和具有六氟磷酸盐，胂酸盐或锑酸盐作为阴离子的苄基硫鎓盐，质量浓度为0.01〜5％（相对于环氧树脂）; 以及可能的常规添加剂。这些反应树脂混合物通过UV辐射和热固化。

7. 发明授权

US07851978B2 Piezo actuator comprising a multilayer encapsulation, and method for the production thereof 有权
标题翻译：包括多层封装的压电致动器及其制造方法
公开(公告)号：US07851978B2
公开(公告)日：2010-12-14
申请号：US12298096
申请日：2007-04-24
申请人： Heiner Bayer , Hellmut Freudenberg , Axel Ganster , Christoph Hamann , Oliver Hennig , Jens Dahl Jensen , Günter Lugert , Randolf Mock , Carsten Schuh , Jörg Zapf
发明人： Heiner Bayer , Hellmut Freudenberg , Axel Ganster , Christoph Hamann , Oliver Hennig , Jens Dahl Jensen , Günter Lugert , Randolf Mock , Carsten Schuh , Jörg Zapf
IPC分类号： H01L41/083
CPC分类号： H01L41/23 , H01L41/0533 , H01L41/083 , Y10T29/42
摘要： In a method for producing a multilayer encapsulation (1) of a piezo actuator (5) such that the piezo actuator (5) is protected towards the outside without having to use an additional enveloping housing-type structure, in order to produce the multilayer encapsulation (1), an electrically insulating elastic layer (10) is first applied to the surface of the piezo actuator (5), whereupon a metallic layer is applied to the electrically insulating elastic layer (10) so as to planarly cover the same.
摘要翻译：在制造压电致动器（5）的多层封装（1）的方法中，使得压电致动器（5）被保护以朝向外部而不必使用附加的包封外壳型结构，以便产生多层封装（1）中，首先将电绝缘弹性层（10）施加到压电致动器（5）的表面，由此将金属层施加到电绝缘弹性层（10）上以平面地覆盖该电绝缘弹性层。

8. 发明申请

US20090278423A1 PIEZOELECTRIC ACTUATOR WITH GRADIENT ENCAPSULATION LAYER AND METHOD FOR THE PRODUCTION THEREOF 有权
标题翻译：具有梯度包层的压电致动器及其生产方法
公开(公告)号：US20090278423A1
公开(公告)日：2009-11-12
申请号：US12298116
申请日：2007-04-24
申请人： Heiner Bayer , Hellmut Freudenberg , Axel Ganster , Christoph Hamann , Oliver Hennig , Jens Dahl Jensen , Günter Lugert , Randolf Mock , Carsten Schuh
发明人： Heiner Bayer , Hellmut Freudenberg , Axel Ganster , Christoph Hamann , Oliver Hennig , Jens Dahl Jensen , Günter Lugert , Randolf Mock , Carsten Schuh
IPC分类号： H01L41/053 , B05D1/08
CPC分类号： H01L41/23 , C23C4/06 , C23C24/04 , H01L41/0533 , H01L41/083
摘要： In a method for the production of a gradient encapsulation layer 20 on a piezoelectric actuator 1, based on this gradient encapsulation layer 20, the piezoelectric actuator 1 does not 5 require an additional housing-like enveloping structure in order to be protected externally. The gradient encapsulation layer 20 is produced by cold gas spraying of particles having different material properties.
摘要翻译：在压电致动器1上制造梯度封装层20的方法中，基于该梯度封装层20，压电致动器1不需要额外的外壳状包封结构以便被外部保护。梯度封装层20是通过冷气喷射具有不同材料特性的颗粒制成的。

9. 发明授权

US06931699B2 Method of producing a surface wave component with a drain for pyroelectric voltage 失效
标题翻译：用于产生具有用于热电压的漏极的表面波分量的方法
公开(公告)号：US06931699B2
公开(公告)日：2005-08-23
申请号：US10169854
申请日：2000-12-20
申请人： Wolfgang Pahl , Heiner Bayer
发明人： Wolfgang Pahl , Heiner Bayer
IPC分类号： H01L41/09 , H01L23/62 , H01L41/18 , H01L41/22 , H03H3/08 , H03H9/02 , H03H9/145 , H04R17/00 , H01L41/04 , H01L41/08 , H02N2/00
CPC分类号： H01L23/62 , H01L2924/0002 , H01L2924/3011 , H03H9/02921 , Y10T29/42 , Y10T29/49005 , Y10T29/49155 , H01L2924/00
摘要： A method of producing a surface wave component with a drain for pyroelectric voltage includes forming electrically-conductive structures on a piezoelectric substrate. The structures form an acoustic path comprising an electroacoustic transducer. The method also includes forming a high-resistance layer on an entire surface of the substrate and on top of the electrically-conductive structures, and removing the high-resistance layer from at least a region corresponding to the electroacoustic transducer, such that at least a region outside the acoustic path remains covered by the high-resistance layer.
摘要翻译：制造具有用于热电电压的漏极的表面波分量的方法包括在压电基片上形成导电结构。该结构形成包括电声换能器的声路。该方法还包括在基板的整个表面上和导电结构的顶部上形成高电阻层，并且从至少对应于电声换能器的区域去除高电阻层，使得至少一个声道外部的区域保持被高电阻层覆盖。

10. 发明申请

US20050072459A1 Barrier layer made of a curable resin containing polymeric polyol 有权
标题翻译：阻挡层由含有聚合多元醇的可固化树脂制成
公开(公告)号：US20050072459A1
公开(公告)日：2005-04-07
申请号：US10503165
申请日：2003-01-31
申请人： Heiner Bayer , Hermann Calwer , Dieter Dlugosch , Gudrun Kuhne
发明人： Heiner Bayer , Hermann Calwer , Dieter Dlugosch , Gudrun Kuhne
IPC分类号： B32B27/26 , B32B27/30 , B32B27/38 , C08G18/40 , C08G59/34 , C08G59/62 , C08L63/00 , H01L31/048 , H01L51/52 , H01L31/00
CPC分类号： B32B17/10036 , B32B17/10761 , B32B27/26 , B32B27/38 , C08G18/4063 , C08G59/027 , C08G59/62 , C08L63/00 , H01L31/048 , H01L51/524 , H01L51/5253 , Y02E10/50 , Y10T428/3163 , C08L2666/02
摘要： A component involving a substrate, a layered structure arranged on the substrate, and a barrier layer arranged over the layered structure, wherein the barrier layer has the reaction product of an epoxy resin and a polymeric polyol.
摘要翻译：涉及衬底的组件，布置在衬底上的层状结构，以及布置在层状结构上的阻挡层，其中阻挡层具有环氧树脂和聚合多元醇的反应产物。

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