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1. 发明申请

US20090035935A1 Method of forming a metal wiring 审中-公开
标题翻译：形成金属布线的方法
公开(公告)号：US20090035935A1
公开(公告)日：2009-02-05
申请号：US12222062
申请日：2008-07-31
申请人： Hea-Ki Kim , Dong-Chul Hur , Mo-Hyun Cho , Duk-Sung Kim
发明人： Hea-Ki Kim , Dong-Chul Hur , Mo-Hyun Cho , Duk-Sung Kim
IPC分类号： H01L21/4763
CPC分类号： H01L21/76873 , C23C18/1642 , C23C18/1806 , C23C18/1841 , C23C18/1844 , C23C18/54 , C25D5/02 , H01L21/2885 , H01L21/76849 , H01L21/76877
摘要： A method of forming a metal wiring for a semiconductor device includes forming a metal-based layer on a substrate, the substrate including at least one conductive structure, forming a metal seed layer on the metal-based layer, forming a supplementary contact layer on the metal seed layer along peripheral portions of the substrate, the metal seed layer being between the substrate and the supplementary contact layer, and the supplementary contact layer including a supplementary metal having an electrical resistance smaller than or equal to an electrical resistance of the metal seed layer, loading the substrate into a plating apparatus, such that the supplementary contact layer is being in direct contact with the cathode of the plating apparatus, and performing an electroplating process on the metal seed layer to form a metal wiring layer on the metal-based layer.
摘要翻译：形成用于半导体器件的金属布线的方法包括：在基板上形成金属基层，所述基板包括至少一个导电结构，在金属基层上形成金属籽晶层，在金属基层上形成辅助接触层金属种子层沿着基板的周边部分，金属种子层位于基板和辅助接触层之间，辅助接触层包括电阻小于或等于金属种子层的电阻的补充金属将基板装载到电镀装置中，使辅助接触层与电镀装置的阴极直接接触，对金属种子层进行电镀处理，在金属基层上形成金属配线层。

2. 发明申请

US20080041430A1 Cleaning solution spraying unit and wafer cleaning apparatus with the same 审中-公开
标题翻译：清洗液喷雾装置及晶圆清洗装置
公开(公告)号：US20080041430A1
公开(公告)日：2008-02-21
申请号：US11894543
申请日：2007-08-21
申请人： Mo-Hyun Cho , Duk-Lyol Lee , Kyung-Seuk Hwang , Dong-Chul Hur
发明人： Mo-Hyun Cho , Duk-Lyol Lee , Kyung-Seuk Hwang , Dong-Chul Hur
IPC分类号： B08B3/02
CPC分类号： B08B3/024 , H01L21/67051
摘要： There is provided a cleaning solution spraying unit. The cleaning solution spraying unit comprises a number of nozzles installed in a nozzle base, along a top surface of a wafer, and radially spraying a cleaning solution on the wafer, wherein the nozzle base is positioned above the wafer; and a power unit rotating the nozzles at a predetermined angle relative to a line extending perpendicularly from the top surface of the wafer. In addition, provided is a wafer cleaning apparatus including the cleaning solution spraying unit with the above-described constitution.
摘要翻译：提供了清洗溶液喷涂单元。清洗溶液喷涂单元包括沿着晶片顶表面安装在喷嘴基座中的多个喷嘴，并且在晶片上径向喷射清洁溶液，其中喷嘴基座位于晶片上方; 以及功率单元，其相对于从晶片的顶表面垂直延伸的线以预定角度旋转喷嘴。此外，提供了一种包括具有上述结构的清洁溶液喷射单元的晶片清洁设备。

3. 发明申请

US20070157957A1 Substrate transfer robot and apparatus having the substrate transfer robot for cleaning a substrate 审中-公开
标题翻译：具有用于清洗基板的基板传送机器人的基板传送机器人和设备
公开(公告)号：US20070157957A1
公开(公告)日：2007-07-12
申请号：US11649485
申请日：2007-01-04
申请人： Duk-Lyol Lee , Mo-Hyun Cho , Dong-chul Heo , Kyung-Seuk Hwang
发明人： Duk-Lyol Lee , Mo-Hyun Cho , Dong-chul Heo , Kyung-Seuk Hwang
IPC分类号： B08B3/00 , B65H1/00 , C23F1/00
CPC分类号： H01L21/67778 , H01L21/67051 , H01L21/67288 , H01L21/67748
摘要： In a substrate transfer robot and a substrate cleaning apparatus, the substrate transfer robot transfers substrates between a container supported by a load port and a processing module for cleaning the substrates. The substrate transfer robot includes a driving member that provides a driving force to transfer the substrates, a blade that transfers the substrates using the driving force, and a sensor that senses impurities existing on the blade. When the impurities are detected, a controller can control the operation of the driving member. Thus, the contamination of other substrates in the container can be effectively prevented.
摘要翻译：在基板传送机器人和基板清洁装置中，基板传送机器人在由负载端口支撑的容器和用于清洁基板的处理模块之间传送基板。衬底传送机器人包括提供驱动力以传送衬底的驱动构件，使用驱动力传送衬底的刀片和感测存在于刀片上的杂质的传感器。当检测到杂质时，控制器可以控制驱动构件的操作。因此，能够有效地防止容器内的其他基板的污染。

4. 发明申请

US20070051393A1 Apparatus for cleaning a wafer 审中-公开
标题翻译：清洁晶片的装置
公开(公告)号：US20070051393A1
公开(公告)日：2007-03-08
申请号：US11516101
申请日：2006-09-06
申请人： Mo-Hyun Cho , Dong-Chul Heo , Duk-Lyol Lee , Tae-Hwan Kim , Tae-Wan Kim
发明人： Mo-Hyun Cho , Dong-Chul Heo , Duk-Lyol Lee , Tae-Hwan Kim , Tae-Wan Kim
IPC分类号： B08B3/00 , B08B3/04
CPC分类号： B08B3/04 , H01L21/67051
摘要： An apparatus for cleaning a wafer includes a rotary chuck for supporting and rotating a wafer, a cleaning solution supply unit for supplying a cleaning solution onto the wafer, a bowl spaced apart from and surrounding the rotary chuck, and a protrusion portion protruded from the rotary chuck and having a slope face with respect to the rotary chuck. The protrusion portion can prevent an ascending air stream from being generated by a vortex when the rotary chuck rotates. A guide member can be positioned between the bowl and the rotary chuck to guide the cleaning solution downwardly to a bottom portion of the bowl. A protector can extend from an inner side surface of the guide member toward the rotary chuck, to prevent an ascending air stream caused by the vortex.
摘要翻译：一种用于清洗晶片的设备包括用于支撑和旋转晶片的旋转卡盘，用于将清洁溶液供应到晶片上的清洁溶液供应单元，与旋转卡盘间隔开并围绕旋转卡盘的碗，以及从旋转盘并且相对于旋转卡盘具有倾斜面。当旋转卡盘旋转时，突出部分可以防止上升的气流由涡流产生。引导构件可以定位在碗和旋转卡盘之间，以将清洁溶液向下引导到碗的底部。保护器可以从引导构件的内侧表面朝向旋转卡盘延伸，以防止由涡流引起的上升气流。

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