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1. 发明授权

US08134840B2 Circuit board and mobile electronic apparatus 有权
标题翻译：电路板和移动电子设备
公开(公告)号：US08134840B2
公开(公告)日：2012-03-13
申请号：US12373325
申请日：2006-07-25
申请人： Mamoru Yoshida , Fumio Hashimoto , Haruo Hayakawa , Kazunori Kouno , Kazuhiro Konishi
发明人： Mamoru Yoshida , Fumio Hashimoto , Haruo Hayakawa , Kazunori Kouno , Kazuhiro Konishi
IPC分类号： H05K5/00
CPC分类号： G06F1/184 , G06F1/1616 , G06F1/1656 , H04M1/0277 , H04M1/185 , H05K5/062
摘要： A circuit board in which the attachment strength of a frame member to a substrate can be improved, and a mobile electronic apparatus are provided.A circuit board 16 has: a substrate 28; plural electronic components 29 which are mounted on the substrate 28; and a frame member 30 which is attached to the substrate 28 so as to surround the electronic components 29. A resin portion 36 is formed by a resin which is filled into the frame member 30. The circuit board 16 has: a lower bent portion 41 (contact portion) which is disposed in a basal end portion 38B of a wall portion 38 of the frame member 30 along the substrate 28; and a raised portion 42 which is disposed in an outer end portion 41A of the lower bent portion 41.
摘要翻译：可以改善框架构件对基板的附着强度的电路板和提供移动电子设备。电路板16具有：基板28; 安装在基板28上的多个电子部件29; 以及框架构件30，其以包围电子部件29的方式附接到基板28.树脂部36由填充到框架构件30中的树脂形成。电路板16具有：下弯曲部41 （接触部），其沿着基板28设置在框架部件30的壁部38的基端部38B中; 以及设置在下弯曲部分41的外端部分41A中的凸起部分42。

2. 发明授权

US08022312B2 Substrate structure and electronic apparatus 有权
公开(公告)号：US08022312B2
公开(公告)日：2011-09-20
申请号：US12162211
申请日：2007-01-26
申请人： Haruo Hayakawa , Kazuhiro Konishi , Mamoru Yoshida , Kazunori Kouno
发明人： Haruo Hayakawa , Kazuhiro Konishi , Mamoru Yoshida , Kazunori Kouno
IPC分类号： H05K1/16 , H05K1/14
摘要： A substrate structure capable of miniaturizing and thinning a housing of a portable terminal is provided.A substrate structure 10 comprises a substrate 11, plural electronic components 12 mounted along one mounting surface 11A in the substrate 11, and a resin part 13 for making close contact with the mounting surface 11A of the substrate 11while each of the electronic components 12 is covered with a resin 13A. In the substrate structure 10, a through hole 14 extending through the substrate 11 in a thickness direction is disposed and also the side of the mounting surface 11A in the through hole 14 is closed by a lid member 15. A rising part 21 is disposed in a peripheral part of this lid member 15.

3. 发明授权

US08106307B2 Substrate structure and electronic apparatus 失效
标题翻译：基板结构和电子设备
公开(公告)号：US08106307B2
公开(公告)日：2012-01-31
申请号：US12162211
申请日：2007-01-26
申请人： Haruo Hayakawa , Kazuhiro Konishi , Mamoru Yoshida , Kazunori Kouno
发明人： Haruo Hayakawa , Kazuhiro Konishi , Mamoru Yoshida , Kazunori Kouno
IPC分类号： H05K1/16 , H05K1/14
CPC分类号： H05K1/147 , H05K1/141 , H05K1/148 , H05K1/182 , H05K1/183 , H05K1/189 , H05K3/284 , H05K3/361 , H05K2201/09072 , H05K2201/10371 , H05K2203/1572
摘要： A substrate structure capable of miniaturizing and thinning a housing of a portable terminal is provided.A substrate structure 10 comprises a substrate 11, plural electronic components 12 mounted along one mounting surface 11A in the substrate 11, and a resin part 13 for making close contact with the mounting surface 11A of the substrate 11while each of the electronic components 12 is covered with a resin 13A. In the substrate structure 10, a through hole 14 extending through the substrate 11 in a thickness direction is disposed and also the side of the mounting surface 11A in the through hole 14 is closed by a lid member 15. A rising part 21 is disposed in a peripheral part of this lid member 15.
摘要翻译：提供了能够使便携式终端的壳体小型化和薄化的基板结构。基板结构10包括基板11，沿着基板11中的一个安装表面11A安装的多个电子部件12以及在每个电子部件12被覆盖的情况下与基板11的安装面11A紧密接触的树脂部13 用树脂13A。在基板结构体10中，设置贯穿基板11的厚度方向的贯通孔14，并且通孔14的安装面11A的一侧也被盖部件15封闭。上升部21配置在该盖部件15的周边部分。

4. 发明申请

US20090032298A1 SUBSTRATE STRUCTURE AND ELECTRONIC APPARATUS 失效
标题翻译：基板结构和电子设备
公开(公告)号：US20090032298A1
公开(公告)日：2009-02-05
申请号：US12162211
申请日：2007-01-26
申请人： Haruo Hayakawa , Kazuhiro Konishi , Mamoru Yoshida , Kazunori Kouno
发明人： Haruo Hayakawa , Kazuhiro Konishi , Mamoru Yoshida , Kazunori Kouno
IPC分类号： H05K1/18
CPC分类号： H05K1/147 , H05K1/141 , H05K1/148 , H05K1/182 , H05K1/183 , H05K1/189 , H05K3/284 , H05K3/361 , H05K2201/09072 , H05K2201/10371 , H05K2203/1572
摘要： A substrate structure capable of miniaturizing and thinning a housing of a portable terminal is provided.A substrate structure 10 comprises a substrate 11, plural electronic components 12 mounted along one mounting surface 11A in the substrate 11, and a resin part 13 for making close contact with the mounting surface 11A of the substrate 11while each of the electronic components 12 is covered with a resin 13A. In the substrate structure 10, a through hole 14 extending through the substrate 11 in a thickness direction is disposed and also the side of the mounting surface 11A in the through hole 14 is closed by a lid member 15. A rising part 21 is disposed in a peripheral part of this lid member 15.
摘要翻译：提供了能够使便携式终端的壳体小型化和薄化的基板结构。基板结构10包括基板11，沿着基板11中的一个安装表面11A安装的多个电子部件12以及在每个电子部件12被覆盖的情况下与基板11的安装面11A紧密接触的树脂部13 用树脂13A。在基板结构体10中，设置贯穿基板11的厚度方向的贯通孔14，并且通孔14的安装面11A的一侧也被盖部件15封闭。上升部21配置在该盖部件15的周边部分。

5. 发明申请

US20090310316A1 CIRCUIT BOARD AND MOBILE ELECTRONIC APPARATUS 有权
标题翻译：电路板和移动电子设备
公开(公告)号：US20090310316A1
公开(公告)日：2009-12-17
申请号：US12373325
申请日：2006-07-25
申请人： Mamoru Yoshida , Fumio Hashimoto , Haruo Hayakawa , Kazunori Kouno , Kazuhiro Konishi
发明人： Mamoru Yoshida , Fumio Hashimoto , Haruo Hayakawa , Kazunori Kouno , Kazuhiro Konishi
IPC分类号： H05K5/00
CPC分类号： G06F1/184 , G06F1/1616 , G06F1/1656 , H04M1/0277 , H04M1/185 , H05K5/062
摘要： A circuit board in which the attachment strength of a frame member to a substrate can be improved, and a mobile electronic apparatus are provided.A circuit board 16 has: a substrate 28; plural electronic components 29 which are mounted on the substrate 28; and a frame member 30 which is attached to the substrate 28 so as to surround the electronic components 29. A resin portion 36 is formed by a resin which is filled into the frame member 30. The circuit board 16 has: a lower bent portion 41 (contact portion) which is disposed in a basal end portion 38B of a wall portion 38 of the frame member 30 along the substrate 28; and a raised portion 42 which is disposed in an outer end portion 41A of the lower bent portion 41.
摘要翻译：可以改善框架构件对基板的附着强度的电路板和提供移动电子设备。电路板16具有：基板28; 安装在基板28上的多个电子部件29; 以及框架构件30，其以包围电子部件29的方式附接到基板28.树脂部36由填充到框架构件30中的树脂形成。电路板16具有：下弯曲部41 （接触部），其沿着基板28设置在框架部件30的壁部38的基端部38B中; 以及设置在下弯曲部分41的外端部分41A中的凸起部分42。

6. 发明授权

US07969741B2 Substrate structure 失效
标题翻译：基材结构
公开(公告)号：US07969741B2
公开(公告)日：2011-06-28
申请号：US12065177
申请日：2006-02-20
申请人： Haruo Hayakawa , Masahiro Ono , Seiji Yamaguchi , Yoshihiro Uda , Kazuhiro Shinchi , Satoru Tomekawa , Kiyoshi Nakanishi , Kosuke Kubota , Atsushi Katagiri , Motohisa Kotani , Kazuhiro Konishi , Eiji Nishimura , Takeo Matsuki
发明人： Haruo Hayakawa , Masahiro Ono , Seiji Yamaguchi , Yoshihiro Uda , Kazuhiro Shinchi , Satoru Tomekawa , Kiyoshi Nakanishi , Kosuke Kubota , Atsushi Katagiri , Motohisa Kotani , Kazuhiro Konishi , Eiji Nishimura , Takeo Matsuki
IPC分类号： H05K7/20
CPC分类号： H05K3/284 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/0203 , H05K1/0218 , H05K1/0274 , H05K7/20463 , H05K9/0047 , H05K9/0086 , H05K2201/0209 , H05K2201/0215 , H05K2201/10128 , H05K2201/10515 , H05K2201/2054 , H05K2203/1316 , H05K2203/1322 , H01L2224/0401
摘要： It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.
摘要翻译：旨在提供确保共同覆盖多个电子部件并能够减小，减薄和减少部件数量的树脂部件的屏蔽性和散热性的基板结构。第一实施例的基板结构20设置有基板21，沿着基板21安装的多个电子部件22和覆盖电子部件22并与基板21紧密接触的树脂部25。基板结构体20中，树脂部25设置有覆盖电子部件22并具有导热性和增强性的加强放热层26和覆盖加强放热层26的屏蔽层27以及覆盖加强放热层26的表面o28 屏蔽层27形成为与显示装置30的与树脂部25相邻的表面结构对应的规定形状。

7. 发明申请

US20100020497A1 SUBSTRATE STRUCTURE 失效
标题翻译：基板结构
公开(公告)号：US20100020497A1
公开(公告)日：2010-01-28
申请号：US12065177
申请日：2006-02-20
申请人： Haruo Hayakawa , Masahiro Ono , Seiji Yamaguchi , Yoshihiro Uda , Kazuhiro Shinchi , Satoru Tomekawa , Kiyoshi Nakanishi , Kosuke Kubota , Atsushi Katagiri , Motohisa Kotani , Kazuhiro Konishi , Eiji Nishimura , Takeo Matsuki
发明人： Haruo Hayakawa , Masahiro Ono , Seiji Yamaguchi , Yoshihiro Uda , Kazuhiro Shinchi , Satoru Tomekawa , Kiyoshi Nakanishi , Kosuke Kubota , Atsushi Katagiri , Motohisa Kotani , Kazuhiro Konishi , Eiji Nishimura , Takeo Matsuki
IPC分类号： H05K7/20 , H05K7/00
CPC分类号： H05K3/284 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/0203 , H05K1/0218 , H05K1/0274 , H05K7/20463 , H05K9/0047 , H05K9/0086 , H05K2201/0209 , H05K2201/0215 , H05K2201/10128 , H05K2201/10515 , H05K2201/2054 , H05K2203/1316 , H05K2203/1322 , H01L2224/0401
摘要： It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.
摘要翻译：旨在提供确保共同覆盖多个电子部件并能够减小，减薄和减少部件数量的树脂部件的屏蔽性和散热性的基板结构。第一实施例的基板结构20设置有基板21，沿着基板21安装的多个电子部件22和覆盖电子部件22并与基板21紧密接触的树脂部25。基板结构体20中，树脂部25设置有覆盖电子部件22并具有导热性和增强性的加强放热层26和覆盖加强放热层26的屏蔽层27以及覆盖加强放热层26的表面o28 屏蔽层27形成为与显示装置30的与树脂部25相邻的表面结构对应的规定形状。

8. 发明授权

US5803323A Structure of carrying case for electronic equipment 失效
标题翻译：电子设备手提箱结构
公开(公告)号：US5803323A
公开(公告)日：1998-09-08
申请号：US929683
申请日：1997-09-15
申请人： Takahiro Hayashi , Haruo Hayakawa
发明人： Takahiro Hayashi , Haruo Hayakawa
IPC分类号： B65D43/22 , A45C11/00 , G08B3/10 , H04M1/725 , H05K5/02 , A45F5/00
CPC分类号： G08B3/1058 , H04M1/72519 , Y10S224/93
摘要： A carrying case for portable electronic equipment is provided which is designed to allow a case carrier to stop an alarm or call sound produced from the electronic equipment without opening the carrying case. The carrying case has a protrusion formed on an inner wall of a cover at a given interval away from an operating button on the electronic equipment disposed within the carrying case. The cover is supported elastically by a case body with a given gap between front edges of the cover and the case body. The depression of the operating button of the electronic equipment through the protrusion to stop the alarm or call sound is achieved by pressing one of the cover and the case body against the other to decrease the gap therebetween. In another modified form, a window is formed in the bottom of the case body for allowing the case carrier to move the electronic equipment within the case body using a finger load, thereby bringing the operating button into engagement with the protrusion on the inner wall of the cover.
摘要翻译：提供了一种用于便携式电子设备的便携式电子设备，其被设计成允许外壳承运人在不打开手提箱的情况下停止从电子设备产生的警报或通话声音。手提箱具有突出部，其形成在盖的内壁上，与设置在手提箱内的电子设备上的操作按钮相隔一定间隔。盖子由壳体弹性地支承，盖体的前边缘和壳体之间具有给定的间隙。通过突起来按压电子设备的操作按钮来停止报警或呼叫声是通过将盖和壳体中的一个抵靠另一个来减小它们之间的间隙来实现的。在另一改进形式中，窗体形成在壳体的底部，用于允许壳体托架使用手指负载移动壳体内的电子设备，从而使操作按钮与内壁上的突起接合封面。

9. 发明授权

US07896657B2 Circuit device, circuit device manufacturing method and connecting member 失效
标题翻译：电路装置，电路装置制造方法及连接部件
公开(公告)号：US07896657B2
公开(公告)日：2011-03-01
申请号：US12442341
申请日：2006-09-22
申请人： Masahiro Ono , Hiroyuki Suzuki , Haruo Hayakawa , Iwao Matuura , Akihiro Miyashita
发明人： Masahiro Ono , Hiroyuki Suzuki , Haruo Hayakawa , Iwao Matuura , Akihiro Miyashita
IPC分类号： H01R12/00 , H05K1/00
CPC分类号： H05K3/368 , H05K2201/042 , H05K2201/10378 , H05K2201/2018
摘要： A circuit device which can form terminal portions at narrow pitches a manufacturing method of the circuit device, and a connecting member are provided. A circuit device 10 includes: a first printed circuit board 11 and a second printed circuit board 15 which are arranged along the thickness direction of substrates 12, 16; and a connecting member 20 which is interposed between the first printed circuit board 11 and the second printed circuit board 15. The first printed circuit board 11 and the second printed circuit board 15 are electrically connected with each other by terminal portions 21 formed on the connecting member 20. The circuit device 10 integrally forms the terminal portions 21 on a frame body 25 by plating.
摘要翻译：提供可以以窄间距形成端子部分的电路装置，电路装置的制造方法和连接构件。电路装置10包括：沿着基板12,16的厚度方向布置的第一印刷电路板11和第二印刷电路板15; 以及连接构件20，其插入在第一印刷电路板11和第二印刷电路板15之间。第一印刷电路板11和第二印刷电路板15通过形成在连接件上的端子部分21彼此电连接电路装置10通过电镀在框体25上一体地形成端子部21。

10. 发明申请

US20090311884A1 CIRCUIT DEVICE, CIRCUIT DEVICE MANUFACTURING METHOD AND CONNECTING MEMBER 失效
标题翻译：电路设备，电路设备制造方法和连接成员
公开(公告)号：US20090311884A1
公开(公告)日：2009-12-17
申请号：US12442341
申请日：2006-09-22
申请人： Masahiro Ono , Hiroyuki Suzuki , Haruo Hayakawa , Iwao Matuura , Akihiro Miyashita
发明人： Masahiro Ono , Hiroyuki Suzuki , Haruo Hayakawa , Iwao Matuura , Akihiro Miyashita
IPC分类号： H01R12/00
CPC分类号： H05K3/368 , H05K2201/042 , H05K2201/10378 , H05K2201/2018
摘要： A circuit device which can form terminal portions at narrow pitches a manufacturing method of the circuit device, and a connecting member are provided. A circuit device 10 includes: a first printed circuit board 11 and a second printed circuit board 15 which are arranged along the thickness direction of substrates 12, 16; and a connecting member 20 which is interposed between the first printed circuit board 11 and the second printed circuit board 15. The first printed circuit board 11 and the second printed circuit board 15 are electrically connected with each other by terminal portions 21 formed on the connecting member 20. The circuit device 10 integrally forms the terminal portions 21 on a frame body 25 by plating.
摘要翻译：提供可以以窄间距形成端子部分的电路装置，电路装置的制造方法和连接构件。电路装置10包括：沿着基板12,16的厚度方向布置的第一印刷电路板11和第二印刷电路板15; 以及连接构件20，其插入在第一印刷电路板11和第二印刷电路板15之间。第一印刷电路板11和第二印刷电路板15通过形成在连接件上的端子部分21彼此电连接电路装置10通过电镀在框体25上一体地形成端子部21。

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