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    • 4. 发明授权
    • Semiconductor device fabrication
    • 半导体器件制造
    • US4379005A
    • 1983-04-05
    • US348526
    • 1982-02-12
    • Harold J. HovelJerry M. Woodall
    • Harold J. HovelJerry M. Woodall
    • H01L21/285H01L21/337H01L29/812H01L21/24
    • H01L29/66924H01L21/28575H01L21/28581H01L21/28587H01L29/812Y10S438/916
    • Semiconductor devices can be fabricated using as an intermediate manufacturing structure a substrate of one semiconductor with a thin epitaxial surface layer of a different semiconductor with properties such that the semiconductors each have different solubilities with respect to a metal. When a vertical differentiation is used to expose the different materials and the metal is deposited on both and heated, the metal will form a Schottky barrier in one material and an ohmic contact in the other. Where the substrate is gallium arsenide and the epitaxial layer is gallium aluminum arsenide and the metal is tin, a self-aligned gallium arsenide MESFET is formed wherein the tin forms ohmic contacts with the gallium arsenide and a Schottky barrier contact with the gallium aluminum arsenide.
    • 可以使用具有不同半导体的薄外延表面层的半导体衬底作为中间制造结构来制造半导体器件,其性能使得半导体对于金属具有不同的溶解度。 当使用垂直分化来暴露不同的材料并且金属沉积在两者上并被加热时,金属将在一种材料中形成肖特基势垒并在另一种材料中形成欧姆接触。 在衬底是砷化镓并且外延层是砷化镓铝并且金属是锡的情况下,形成自对准的砷化镓MESFET,其中锡与砷化镓形成欧姆接触,并与砷化镓砷化物进行肖特基势垒接触。
    • 8. 发明授权
    • Compositionally-graded band gap heterojunction solar cell
    • 组分梯度带隙异质结太阳能电池
    • US08653360B2
    • 2014-02-18
    • US12849966
    • 2010-08-04
    • Stephen W. BedellHarold J. HovelDaniel A. InnsJee H. KimAlexander ReznicekDevendra K. Sadana
    • Stephen W. BedellHarold J. HovelDaniel A. InnsJee H. KimAlexander ReznicekDevendra K. Sadana
    • H01L31/00H01L21/00
    • H01L31/065H01L31/03765H01L31/075H01L31/18Y02E10/548
    • A photovoltaic device includes a composition modulated semiconductor structure including a p-doped first semiconductor material layer, a first intrinsic compositionally-graded semiconductor material layer, an intrinsic semiconductor material layer, a second intrinsic compositionally-graded semiconductor layer, and an n-doped first semiconductor material layer. The first and second intrinsic compositionally-graded semiconductor material layers include an alloy of a first semiconductor material having a greater band gap width and a second semiconductor material having a smaller band gap with, and the concentration of the second semiconductor material increases toward the intrinsic semiconductor material layer in the first and second compositionally-graded semiconductor material layers. The photovoltaic device provides an open circuit voltage comparable to that of the first semiconductor material, and a short circuit current comparable to that of the second semiconductor material, thereby increasing the efficiency of the photovoltaic device.
    • 光伏器件包括组成调制的半导体结构,其包括p掺杂的第一半导体材料层,第一本征成分梯度半导体材料层,本征半导体材料层,第二本征组分梯度半导体层和n掺杂的第一半导体层 半导体材料层。 第一和第二本征成分梯度半导体材料层包括具有较大带隙宽度的第一半导体材料和具有较小带隙的第二半导体材料的合金,并且第二半导体材料的浓度朝向本征半导体 第一和第二组成梯度半导体材料层中的材料层。 光电器件提供与第一半导体材料相当的开路电压,以及与第二半导体材料相当的短路电流,从而提高光伏器件的效率。
    • 10. 发明授权
    • Method and structure of photovoltaic grid stacks by solution based processes
    • 基于解决方案的光伏电网堆栈的方法和结构
    • US08426236B2
    • 2013-04-23
    • US12775939
    • 2010-05-07
    • Cyril Cabral, Jr.Harold J. HovelXiaoyan Shao
    • Cyril Cabral, Jr.Harold J. HovelXiaoyan Shao
    • H01L21/00
    • H01L31/18H01L31/022425Y02E10/50
    • A grid stack structure of a solar cell, which includes a silicon substrate, wherein a front side of the silicon is doped with phosphorus to form a n-emitter and a back side of the silicon is screen printed with aluminum (Al) metallization; a dielectric layer, which acts as an antireflection coating (ARC), applied on the silicon; a mask layer applied on the front side to define a grid opening of the dielectric layer, wherein an etching method is applied to open an unmasked grid area; a light-induced plated nickel or cobalt layer applied to the front side with electrical contact to the back side Al metallization; a silicide layer formed by rapid thermal annealing of the plated nickel (Ni) or cobalt (Co); an optional barrier layer electrodeposited on the silicide; a copper (Cu) layer electrodeposited on the silicide/barrier film layer; and a thin protective layer is chemically applied or electrodeposited on top of the Cu layer.
    • 包括硅衬底的太阳能电池的栅格堆叠结构,其中硅的正面被磷掺杂以形成n发射极,硅的背面用铝(Al)金属化丝网印刷; 作为抗反射涂层(ARC)的介电层,施加在硅上; 施加在前侧的掩模层以限定电介质层的栅格开口,其中施加蚀刻方法以打开未屏蔽的栅格区域; 施加到前侧的光诱导的镀镍或钴层与后侧Al金属化电接触; 通过镀镍(Ni)或钴(Co)的快速热退火形成的硅化物层; 电沉积在硅化物上的可选阻挡层; 电沉积在硅化物/阻挡膜层上的铜(Cu)层; 并且将薄的保护层化学施加或电沉积在Cu层的顶部上。