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1. 发明授权

US06221176B1 Surface treatment of copper to prevent microcracking in flexible circuits 有权
标题翻译：表面处理铜，以防止柔性电路中的微裂纹
公开(公告)号：US06221176B1
公开(公告)日：2001-04-24
申请号：US09271640
申请日：1999-03-17
申请人： Harish D. Merchant , Charles A. Poutasse , Chin-Ho Lee
发明人： Harish D. Merchant , Charles A. Poutasse , Chin-Ho Lee
IPC分类号： C23C2224
CPC分类号： B32B15/08 , B32B15/20 , B32B2311/12 , B32B2457/08 , H05K1/028 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/389 , H05K2201/0317 , H05K2201/0355 , H05K2203/0315 , H05K2203/0723
摘要： In one embodiment, the present invention relates to a flexible laminate, comprising a first flexible polymeric film; a copper layer having a microcracking prevention layer on at least one side the microcracking prevention layer sufficient to prevent microcracks in a copper layer having a thickness of up to about 18 &mgr;m during at least 50,000,000 bending cycles and/or a copper layer having a thickness of up to about 35 &mgr;m during at least 20,000,000 bending cycles of the flexible laminate; and a second flexible polymeric film.
摘要翻译：在一个实施例中，本发明涉及柔性层压板，包括第一柔性聚合物膜; 在至少一侧具有防微裂纹层的铜层，所述显微裂纹防止层足以防止在至少50,000,000次弯曲循环期间具有高达约18μm厚度的铜层中的微裂纹，和/或厚度为在柔性层压板的至少20,000,000次弯曲循环期间高达约35μm; 和第二柔性聚合物膜。

2. 发明授权

US06296949B1 Copper coated polyimide with metallic protective layer 失效
标题翻译：铜涂层聚酰亚胺与金属保护层
公开(公告)号：US06296949B1
公开(公告)日：2001-10-02
申请号：US09397404
申请日：1999-09-16
申请人： Tad Bergstresser , Charles A. Poutasse
发明人： Tad Bergstresser , Charles A. Poutasse
IPC分类号： B32B302
CPC分类号： H05K3/007 , B32B15/08 , H05K1/0346 , H05K3/025 , H05K3/388 , H05K2201/0154 , H05K2203/0152 , Y10T428/12438 , Y10T428/12569
摘要： A component for use in manufacturing printed circuits, comprising: a laminate that in a finished printed circuit constitutes a functional element, the laminate comprised of: a film substrate formed of a first polymeric material; at least one layer of a flash metal applied to a first side of the film substrate, and at least one layer of copper on the at least one layer of a flash metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of flash metal; and a planar layer of metal that constitutes a discardable element, the layer of metal having an essentially uncontaminated surface that is inert to copper, the laminate being attached to the layer of metal at its borders to define a substantially uncontaminated central zone inwardly of the edges of the sheet that is unjoined at the interfaces.
摘要翻译：一种用于制造印刷电路的组件，包括：在成品印刷电路中构成功能元件的层压体，所述层压体包括：由第一聚合物材料形成的薄膜基材; 施加到薄膜基底的第一侧的至少一层闪光金属，以及至少一层闪光金属上的至少一层铜，所述铜层具有基本上未受污染的暴露表面，其背离至少一层闪光金属; 以及构成可抛弃元件的平面金属层，所述金属层具有对铜是惰性的基本上未受污染的表面，所述层压体在其边界处附着到所述金属层，以在所述边缘的内侧限定基本上未受污染的中心区域在接口处未连接的工作表。

3. 发明授权

US06268070B1 Laminate for multi-layer printed circuit 失效
标题翻译：层压板用于多层印刷电路
公开(公告)号：US06268070B1
公开(公告)日：2001-07-31
申请号：US09266951
申请日：1999-03-12
申请人： Tad Bergstresser , Charles A. Poutasse
发明人： Tad Bergstresser , Charles A. Poutasse
IPC分类号： B32B1508
CPC分类号： H05K3/4655 , H01L2924/0002 , H05K3/181 , H05K3/386 , H05K3/387 , H05K3/388 , H05K3/4652 , H05K2201/0195 , H05K2201/0344 , Y10T428/12542 , Y10T428/12556 , Y10T428/1291 , Y10T428/12917 , Y10T428/24917 , Y10T428/28 , Y10T428/31681 , H01L2924/00
摘要： A laminate for use as a surface laminate in a multi-layer printed circuit board. The laminate is comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate. At least one layer of copper is disposed on the layer of flash metal. An adhesive layer formed of a second polymeric material has a first surface that is attached to a second side of the film substrate.
摘要翻译：用作多层印刷电路板中的表面层压体的层压体。层压体由由第一聚合物材料形成的膜基材组成。将至少一层闪光金属施加到薄膜基板的第一侧。至少一层铜布置在闪光金属层上。由第二聚合物材料形成的粘合剂层具有附着到膜基材的第二面的第一表面。

4. 发明授权

US5629098A Epoxy adhesives and copper foils and copper clad laminates using same 失效
标题翻译：环氧粘合剂和铜箔和铜包覆层压板使用相同
公开(公告)号：US5629098A
公开(公告)日：1997-05-13
申请号：US549197
申请日：1995-10-27
申请人： Charles A. Poutasse , Katherine V. Sack , Andrea M. Kovacs , James R. Winchester
发明人： Charles A. Poutasse , Katherine V. Sack , Andrea M. Kovacs , James R. Winchester
IPC分类号： C08L63/00 , C08G59/18 , C08G59/20 , C09J7/02 , C09J163/00 , H05K1/03 , H05K3/02 , H05K3/38 , B32B17/06 , B32B15/20
CPC分类号： H05K3/384 , C08G59/18 , C09J163/00 , H05K3/386 , H05K2201/0239 , H05K2201/0355 , H05K2201/0358 , H05K2203/0315 , H05K2203/0723 , H05K3/022 , H05K3/385 , H05K3/389 , Y10T428/12076 , Y10T428/12181 , Y10T428/12347 , Y10T428/12493 , Y10T428/12569 , Y10T428/12681 , Y10T428/12687 , Y10T428/12694 , Y10T428/12903 , Y10T428/1291 , Y10T428/12917 , Y10T428/31522 , Y10T428/31529 , Y10T428/31678
摘要： This invention relates to an adhesive composition, comprising: (A) at least one multifunctional epoxy; and (B) the composition derived from (B-1) at least one difunctional epoxy resin and (B-2) at least one compound represented by the formulaR--(G).sub.n (1)wherein in Formula (I): R is an aromatic, alicyclic or heterocyclic group; G is a functional group selected from the group consisting of COOH, OH, SH, NH.sub.2, NHR.sup.1, (NHC(.dbd.NH)).sub.m NH.sub.2, R.sup.2 COOH, R.sup.2 OH, R.sup.2 SH, R.sup.2 NH.sub.2 and R.sup.2 NHR.sup.1, wherein R.sup.1 is a hydrocarbon group, R.sup.2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; and n is a number ranging from 3 up to the number of displaceable hydrogens on R; with the proviso that when at least one G is NH.sub.2 or R.sup.2 NH.sub.2, n is a number ranging from 2 up to the number of displaceable hydrogens on R, and when at least one G is (NHC(.dbd.NH)).sub.m NH.sub.2, n is a number ranging from 1 up to the number of displaceable hydrogens on R. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.
摘要翻译：本发明涉及粘合剂组合物，其包含：（A）至少一种多官能环氧基; 和（B）衍生自（B-1）至少一种双官能环氧树脂的组合物和（B-2）至少一种由式R-（G）n（1）表示的化合物，其中在式（I）中：R 是芳族，脂环族或杂环基; G是选自COOH，OH，SH，NH2，NHR1，（NHC（= NH））mNH2，R2COOH，R2OH，R2SH，R2NH2和R2NHR1的官能团，其中R1是烃基，R2是亚烷基或亚烷基，m是1至约4的数; 并且n是从3到R上的可置换氢的数目的数字; 条件是当至少一个G是NH 2或R 2 NH 2时，n是在R上的可移动氢数2之间的数目，当至少一个G是（NHC（= NH））m NH 2时，n是数目范围从1到可位移氢数R上。本发明还涉及具有粘附到其至少一侧的上述粘合剂组合物的铜箔以增强所述箔和电介质基底之间的粘附。本发明还涉及包含铜箔，电介质基底和包含上述粘合剂组合物的粘合促进层的层压体，所述粘合剂组合物设置在箔和衬底之间并粘附到箔和衬底上。

5. 发明授权

US5525433A Epoxy adhesives and copper foils and copper clad laminates using same 失效
标题翻译：环氧粘合剂和铜箔和铜包覆层压板使用相同
公开(公告)号：US5525433A
公开(公告)日：1996-06-11
申请号：US468655
申请日：1995-06-06
申请人： Charles A. Poutasse , Katherine V. Sack , Andrea M. Kovacs , James R. Winchester
发明人： Charles A. Poutasse , Katherine V. Sack , Andrea M. Kovacs , James R. Winchester
IPC分类号： C08L63/00 , C08G59/18 , C08G59/20 , C09J7/02 , C09J163/00 , H05K1/03 , H05K3/02 , H05K3/38 , B32B15/20 , C08F283/00
CPC分类号： H05K3/384 , C08G59/18 , C09J163/00 , H05K3/386 , H05K2201/0239 , H05K2201/0355 , H05K2201/0358 , H05K2203/0315 , H05K2203/0723 , H05K3/022 , H05K3/385 , H05K3/389 , Y10T428/12076 , Y10T428/12181 , Y10T428/12347 , Y10T428/12493 , Y10T428/12569 , Y10T428/12681 , Y10T428/12687 , Y10T428/12694 , Y10T428/12903 , Y10T428/1291 , Y10T428/12917 , Y10T428/31522 , Y10T428/31529 , Y10T428/31678
摘要： This invention relates to an adhesive composition, comprising: (A) at least one multifunctional epoxy; and (B) the composition derived from (B-1) at least one difunetional epoxy resin and (B-2) at least one compound represented by the formulaR--(G).sub.n (I)wherein in Formula (I): R is an aromatic, alicyclic or heterocyclic group; G is a functional group selected from the group consisting of COOH, OH, SH, NH.sub.2, NHR.sup.1, (NHC(.dbd.NH)).sub.m NH.sub.2, R.sup.2 COOH, R.sup.2 OH, R.sup.2 SH, R.sup.2 NH.sub.2 and R.sup.2 NHR.sup.1, wherein R.sup.1 is a hydrocarbon group, R.sup.2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; and n is a number ranging from 3 up to the number of displaceable hydrogens on R; with the proviso that when at least one G is NH.sub.2 or R.sup.2 NH.sub.2, n is a number ranging from 2 up to the number of displaceable hydrogens on R, and when at least one G is (NHC(.dbd.NH)).sub.m NH.sub.2, n is a number ranging from 1 up to the number of displaceable hydrogens on R. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.
摘要翻译：本发明涉及粘合剂组合物，其包含：（A）至少一种多官能环氧基; 和（B）衍生自（B-1）至少一种不饱和环氧树脂的组合物和（B-2）至少一种由式R-（G）n（I）表示的化合物，其中在式（I）中：R 是芳族，脂环族或杂环基; G是选自COOH，OH，SH，NH2，NHR1，（NHC（= NH））mNH2，R2COOH，R2OH，R2SH，R2NH2和R2NHR1的官能团，其中R1是烃基，R2是亚烷基或亚烷基，m是1至约4的数; 并且n是从3到R上的可置换氢的数目的数字; 条件是当至少一个G是NH 2或R 2 NH 2时，n是在R上的可移动氢数2之间的数目，当至少一个G是（NHC（= NH））m NH 2时，n是数目范围从1到可移位的氢数R上。本发明还涉及具有粘附到其至少一侧上的粘合剂组合物的铜箔，以增强所述箔和电介质基底之间的粘附。本发明还涉及包含铜箔，电介质基底和包含上述粘合剂组合物的粘合促进层的层压体，所述粘合剂组合物设置在箔和衬底之间并粘附到箔和衬底上。

6. 再颁专利

USRE39615E1 Adhesive compositions and copper foils and copper clad laminates using same 失效
标题翻译：粘合剂组合物和使用其的铜箔和铜包层压板
公开(公告)号：USRE39615E1
公开(公告)日：2007-05-08
申请号：US10617653
申请日：2002-10-17
申请人： Charles A. Poutasse
发明人： Charles A. Poutasse
IPC分类号： B23B3/00
CPC分类号： H05K3/386 , C08G59/02 , C08G59/06 , C08G59/40 , C08L61/04 , C09J163/00 , H05K3/022 , H05K3/384 , H05K3/385 , H05K3/389 , H05K2201/0239 , H05K2201/0355 , H05K2201/0358 , H05K2203/0315 , H05K2203/0723 , Y10S428/901 , Y10T428/24917 , Y10T428/30 , Y10T428/31511 , Y10T428/31525 , Y10T428/31529 , Y10T428/31678
摘要： The invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula wherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH2, NHR1, (NHC(═NH))mNH2, R2COOH, NR12, C(O)NHR1, R2NR12, R2OH, R2SH, R2NH2 and R2NHR1, wherein R1 is a hydrocarbon group, R2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R1, OR1 or SO2C6H4—NH2; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.
摘要翻译：本发明涉及粘合剂组合物，其包含：（A）至少一种酚醛树脂树脂; 和（B）通过使（B-1）至少一种双官能环氧树脂与（B-2）至少一种由下式表示的化合物反应制备的产物：其中在式（I）和（II）中：G，T和 Q独立地为选自COOH，OH，SH，NH 2，NHR 1，（NHC（-NH））m的官能团。 NH 2，NR 2 COOH，NR 1，SO 2，C（O）NHR 2， 1，R 2，R 2，R 2，R 2，OH，R 2，其中R 1，R 2，R 2，R 2，R 2， / SUP>是烃基，R 2是亚烷基或亚烷基，m是1至约4的数; T也可以是R 1，或者1或2或更高的C 1 H 4 > -NH 2 2; 并且Q也可以是H.本发明还涉及具有粘附到其至少一个侧面的上述粘合剂组合物的铜箔，以增强所述箔和电介质基底之间的粘附。本发明还涉及包含铜箔，电介质基底和包含上述粘合剂组合物的粘合促进层的层压体，所述粘合剂组合物设置在箔和衬底之间并粘附到箔和衬底上。

7. 发明授权

US5614324A Multi-layer structures containing a silane adhesion promoting layer 失效
标题翻译：含有硅烷粘合促进层的多层结构
公开(公告)号：US5614324A
公开(公告)日：1997-03-25
申请号：US505741
申请日：1995-07-24
申请人： Charles A. Poutasse , Richard L. Luthy
发明人： Charles A. Poutasse , Richard L. Luthy
IPC分类号： C08J5/24 , B32B7/10 , B32B9/00 , B32B15/08 , B32B15/088 , B32B27/00 , B32B27/04 , C08J5/12 , C08L79/08 , C09J5/02 , C09J183/00 , C09J183/02 , C09J183/04 , H05K1/03 , H05K3/38 , H05K3/46
CPC分类号： C08J5/124 , H05K3/389 , Y10T428/31663 , Y10T442/3415
摘要： A multi-layer structure utilized in the preparation of printed circuit boards comprises a metal foil layer, a prepreg layer containing a resin possessing carbon-carbon double bonds such as a polyimide, a polyester or a silicon-carbon resin, and an adhesion promoting layer of a non-epoxy group-containing hydrolyzable silane possessing a heterocyclic such as an imidazole or pyrrole; acryloxy, amide or a carbon-carbon double bond-containing group such as styryl.
摘要翻译：用于制备印刷电路板的多层结构包括金属箔层，含有聚碳酸酯，聚酯或硅碳树脂等碳 - 碳双键的树脂的预浸料层和粘合促进层具有咪唑或吡咯等杂环的非环氧基的可水解硅烷; 丙烯酰氧基，酰胺或含碳 - 碳双键的基团如苯乙烯基。

8. 发明授权

US6117536A Adhesion promoting layer for use with epoxy prepregs 失效
标题翻译：用于环氧预浸料的粘合促进层
公开(公告)号：US6117536A
公开(公告)日：2000-09-12
申请号：US151220
申请日：1998-09-10
申请人： Charles A. Poutasse
发明人： Charles A. Poutasse
IPC分类号： B32B5/28 , B32B15/08 , B32B27/04 , C08J5/24 , H05K3/38 , B32B9/04 , B32B27/38
CPC分类号： C08J5/24 , B32B15/08 , B32B27/04 , B32B5/28 , H05K3/389 , C08J2363/00 , Y10S428/901
摘要： The present invention relates to an adhesion promoting layer which exhibits high temperature stability and high peel strengths when used in a multi-layer structure for a printed circuit board. More specifically, the present invention relates to a multi-layer structure, containing a prepreg layer wherein the prepreg layer is made from an epoxy resin and a non-amine curing agent; and an adhesion promoting layer comprising a nitrogen containing silane compound. The present invention also relates to a multi-layer structure containing a metal foil layer; an epoxy prepreg layer wherein the epoxy prepreg layer is made from an epoxy resin and a non-amine curing agent comprising at least one of an acid, an anhydride, an alkoxide, a phenoxide, a polymeric thiol and a phenol; and an adhesion promoting layer comprising a nitrogen containing silane compound, wherein the adhesion promoting layer is between the metal foil layer and the epoxy prepreg layer.
摘要翻译：本发明涉及当用于印刷电路板的多层结构时表现出高温稳定性和高剥离强度的粘合促进层。更具体地说，本发明涉及包含预浸料层的多层结构，其中预浸料层由环氧树脂和非胺固化剂制成; 以及包含含氮硅烷化合物的粘附促进层。本发明还涉及包含金属箔层的多层结构; 环氧树脂预浸料层，其中所述环氧预浸料层由环氧树脂和包含酸，酸酐，醇盐，酚盐，聚合硫醇和苯酚中的至少一种的非胺固化剂制成; 以及包含含氮硅烷化合物的粘合促进层，其中所述粘附促进层在所述金属箔层和所述环氧预浸料层之间。

9. 发明授权

US06589381B2 Coatings for improved resin dust resistance 失效
标题翻译：涂料提高树脂防尘性能
公开(公告)号：US06589381B2
公开(公告)日：2003-07-08
申请号：US09829713
申请日：2001-04-10
申请人： Charles A. Poutasse , Michael A. Centanni
发明人： Charles A. Poutasse , Michael A. Centanni
IPC分类号： B32B3100
CPC分类号： H05K3/022 , H05K3/389 , Y10S428/901 , Y10T428/12493 , Y10T428/12507 , Y10T428/12514 , Y10T428/12535 , Y10T428/12736 , Y10T428/1476 , Y10T428/265 , Y10T428/31663
摘要： In one embodiment, the present invention relates to a method of increasing resin dust resistance of metal foil comprising contacting the metal foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film having a thickness from about 0.001 microns to about 1 micron on a surface of the metal foil. In another embodiment, the present invention relates to a method of treating metal foil comprising contacting a first side of the metal foil with a hydrocarbylsilane solution to form a resin dust resistant film on a surface of the metal foil, the hydrocarbylsilane solution comprising from about 0.01% to about 10% v/v of a hydrocarbylsilane; and laminating a second side of the metal foil to a prepreg.
摘要翻译：在一个实施方案中，本发明涉及提高金属箔的树脂防尘性的方法，包括使金属箔与惰性硅烷，钛酸酯或锆酸酯化合物接触以形成厚度为约0.001微米至约1的树脂防尘膜金属箔的表面上的微米。在另一个实施方案中，本发明涉及一种处理金属箔的方法，包括使金属箔的第一面与烃基硅烷溶液接触以在金属箔的表面上形成树脂防尘膜，所述烃基硅烷溶液包含约0.01 ％至约10％v / v的烃基硅烷; 并将金属箔的第二面层压到预浸料上。

10. 发明授权

US06299721B1 Coatings for improved resin dust resistance 失效
公开(公告)号：US06299721B1
公开(公告)日：2001-10-09
申请号：US09211283
申请日：1998-12-14
申请人： Charles A. Poutasse , Michael A. Centanni
发明人： Charles A. Poutasse , Michael A. Centanni
IPC分类号： B32B3100
CPC分类号： H05K3/022 , H05K3/389 , Y10S428/901 , Y10T428/12493 , Y10T428/12507 , Y10T428/12514 , Y10T428/12535 , Y10T428/12736 , Y10T428/1476 , Y10T428/265 , Y10T428/31663
摘要： In one embodiment, the present invention relates to a method of increasing resin dust resistance of metal foil comprising contacting the metal foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film having a thickness from about 0.001 microns to about 1 micron on a surface of the metal foil. In another embodiment, the present invention relates to a method of treating metal foil comprising contacting a first side of the metal foil with a hydrocarbylsilane solution to form a resin dust resistant film on a surface of the metal foil, the hydrocarbylsilane solution comprising from about 0.01% to about 10% v/v of a hydrocarbylsilane; and laminating a second side of the metal foil to a prepreg.

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