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    • 6. 发明授权
    • Method of making a contact structure
    • 制作接触结构的方法
    • US6127257A
    • 2000-10-03
    • US154366
    • 1993-11-18
    • Faivel S. PintchovskiJohn R. YeargainPapu D. Maniar
    • Faivel S. PintchovskiJohn R. YeargainPapu D. Maniar
    • H01L21/768H01L23/522H01L23/532H01L21/4763
    • H01L21/7685H01L21/76852H01L21/76885H01L23/5226H01L2221/1078H01L23/53223H01L23/53257H01L2924/0002
    • An improved contact structure and process for forming an improved contact structure for a semiconductor device. A metal (14) is formed on a first metal layer (12) positioned on a substrate (10) The metal (14) is a Group VIIB or Group VIII metal or metal oxide and increases the electrically conductive surface area (25) of the first metal layer (12). In one embodiment, a Group VIIB or Group VIII metal layer is deposited onto the first metal layer and the Group VIIB or Group VIII metal layer is anisotropically etched to form sidewall spacers (24). An insulating layer (16) is deposited overlying the first conductive layer (12) and the sidewall spacers (24). A via opening (18) is formed in the insulation layer (16) to expose a portion of the electrically conductive surface area (25). A second metal layer (22) fills the opening (18) and forms a metallurgical contact to the first metal layer (12).
    • 用于形成用于半导体器件的改进的接触结构的改进的接触结构和工艺。 在位于基板(10)上的第一金属层(12)上形成金属(14)。金属(14)是VIIB族或VIII族金属或金属氧化物,并且增加了导电表面积(25) 第一金属层(12)。 在一个实施方案中,将第VIIB族或第VIII族金属层沉积到第一金属层上,并且第VIIB族或第VIII族金属层被各向异性蚀刻以形成侧壁间隔物(24)。 绝缘层(16)沉积在第一导电层(12)和侧壁间隔物(24)上。 在绝缘层(16)中形成通孔(18),以暴露导电表面区域(25)的一部分。 第二金属层(22)填充开口(18)并与第一金属层(12)形成冶金接触。
    • 7. 发明授权
    • Germanium silicate spin on glass semiconductor device and methods of
spin on glass synthesis and use
    • 玻璃硅酸盐旋涂玻璃半导体器件及玻璃合成和使用方法
    • US5910680A
    • 1999-06-08
    • US215170
    • 1994-03-21
    • Papu D. Maniar
    • Papu D. Maniar
    • H01L21/316H01L23/58
    • H01L21/316
    • A semiconductor device (11) has a spin on glass layer or region, and the spin on glass has a method of synthesis and use. The spin on glass composition is formed which comprises on the order of 0% to 20% by volume of tetraethylorthosilicate (TEOS), on the order of 0.01% to 20% by volume of tetraethylorthogermanate (TEOG), on the order of 0% to 1% by volume the equivalent of nitric acid (HNO.sub.3), on the order of 70% to 85% by volume of alcohol, and a remaining balance of the spin on glass composition being water. The spin on glass is applied to a semiconductor substrate and heated and/or densified to form the spin on glass layer or region.
    • 半导体器件(11)具有在玻璃层或区域上的自旋,并且玻璃上的旋涂具有合成和使用的方法。 形成旋涂玻璃组合物,其含量为约0〜20体积%的原硅酸四乙酯(TEOS),为约0.01-20体积%的四乙基原硅酸酯(TEOG),为0〜 相当于硝酸(HNO 3)1体积%,醇的体积百分数为70〜85体积%,玻璃组合物的旋转余量为水。 将玻璃上的旋涂施加到半导体衬底上并加热和/或致密化以在玻璃层或区域上形成自旋。
    • 8. 发明授权
    • Method for forming a via in a semiconductor device
    • 在半导体器件中形成通孔的方法
    • US5702981A
    • 1997-12-30
    • US536537
    • 1995-09-29
    • Papu D. ManiarRoc BlumenthalJeffrey L. KleinWei Wu
    • Papu D. ManiarRoc BlumenthalJeffrey L. KleinWei Wu
    • H01L21/768H01L21/44
    • H01L21/76802H01L21/76834Y10S438/97
    • A method for forming vias in a semiconductor device improves the resistance and reliability of contacts formed by use of an etch stop layer during the via formation process. An etch stop layer (40), preferably a silicon nitride or aluminum nitride layer, is deposited over conductive interconnect (34). A via (44) is etched in interlayer dielectric (42), stopping on etch stop layer (40). Etch stop layer (40) is then anisotropicly etched to expose the top of conductive interconnect (34), while maintaining a portion of the etch stop layer along a sidewall of the interconnect, and particularly along those sidewall portions which contain aluminum. A conductive plug (54) is then formed in the via, preferably using one or more barrier or glue layers (50). Formation of a tungsten plug using tungsten hexafluoride can then be performed without unwanted reactions between the tungsten source gas and the aluminum interconnect.
    • 用于在半导体器件中形成通孔的方法通过在通孔形成工艺期间通过使用蚀刻停止层来改善形成的触点的电阻和可靠性。 蚀刻停止层(40),优选氮化硅或氮化铝层,沉积在导电互连(34)上。 在层间电介质(42)中蚀刻通孔(44),停止在蚀刻停止层(40)上。 然后对蚀刻停止层(40)进行各向异性蚀刻以暴露导电互连(34)的顶部,同时沿着互连的侧壁,特别是沿着包含铝的侧壁部分保留蚀刻停止层的一部分。 然后,优选地使用一个或多个阻挡层或胶层(50)在通孔中形成导电插塞(54)。 然后可以进行使用六氟化钨形成钨塞,而不会在钨源气体和铝互连之间产生不必要的反应。