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    • 3. 发明申请
    • METHODS OF FABRICATING COPLANAR WAVEGUIDE STRUCTURES
    • 制备共振波导结构的方法
    • US20090249610A1
    • 2009-10-08
    • US12061861
    • 2008-04-03
    • Hanyi DingEssam F. MinaGuoan WangWayne H. Woods
    • Hanyi DingEssam F. MinaGuoan WangWayne H. Woods
    • H01P11/00
    • H01P11/003H01P3/003Y10T29/49016Y10T29/49155Y10T29/49162
    • Methods for fabricating a coplanar waveguide structure. The method may include forming first and second ground conductors and a signal conductor in a coplanar arrangement between the first and second ground conductors, forming a first coplanar array of substantially parallel shield conductors above the signal conductor and the first and second ground conductors, and forming a second coplanar array of substantially parallel shield conductors below the signal conductor and the first and second ground conductors. The method further includes forming a first plurality of conductive bridges located laterally between the signal conductor and the first ground conductor, and forming a second plurality of conductive bridges located laterally between the signal conductor and the second ground conductor. Each of the first plurality of conductive bridges connects one of the shield conductors in the first array with one of the shield conductors in the second array. Each of the second plurality of conductive bridges connects one of the shield conductors in the first array with one of the shield conductors in the second array.
    • 制造共面波导结构的方法。 该方法可以包括在第一和第二接地导体之间的共面布置中形成第一和第二接地导体和信号导体,在信号导体和第一和第二接地导体之上形成基本上平行的屏蔽导体的第一共面阵列,并形成 在信号导体和第一和第二接地导体下面的基本上平行的屏蔽导体的第二共面阵列。 该方法还包括形成位于信号导体和第一接地导体之间横向定位的第一多个导电桥,以及形成位于信号导体和第二接地导体之间横向定位的第二多个导电桥。 第一多个导电桥中的每一个将第一阵列中的一个屏蔽导体与第二阵列中的屏蔽导体中的一个连接。 第二多个导电桥中的每一个将第一阵列中的一个屏蔽导体与第二阵列中的屏蔽导体中的一个连接。
    • 4. 发明授权
    • Methods of fabricating coplanar waveguide structures
    • 制造共面波导结构的方法
    • US08028406B2
    • 2011-10-04
    • US12061861
    • 2008-04-03
    • Hanyi DingEssam F. MinaGuoan WangWayne H. Woods
    • Hanyi DingEssam F. MinaGuoan WangWayne H. Woods
    • H05K3/10H01P11/00H01P3/00
    • H01P11/003H01P3/003Y10T29/49016Y10T29/49155Y10T29/49162
    • Methods for fabricating a coplanar waveguide structure. The method may include forming first and second ground conductors and a signal conductor in a coplanar arrangement between the first and second ground conductors, forming a first coplanar array of substantially parallel shield conductors above the signal conductor and the first and second ground conductors, and forming a second coplanar array of substantially parallel shield conductors below the signal conductor and the first and second ground conductors. The method further includes forming a first plurality of conductive bridges located laterally between the signal conductor and the first ground conductor, and forming a second plurality of conductive bridges located laterally between the signal conductor and the second ground conductor. Each of the first plurality of conductive bridges connects one of the shield conductors in the first array with one of the shield conductors in the second array. Each of the second plurality of conductive bridges connects one of the shield conductors in the first array with one of the shield conductors in the second array.
    • 制造共面波导结构的方法。 该方法可以包括在第一和第二接地导体之间的共面布置中形成第一和第二接地导体和信号导体,在信号导体和第一和第二接地导体之上形成基本上平行的屏蔽导体的第一共面阵列,并形成 在信号导体和第一和第二接地导体下面的基本上平行的屏蔽导体的第二共面阵列。 该方法还包括形成位于信号导体和第一接地导体之间横向定位的第一多个导电桥,以及形成位于信号导体和第二接地导体之间横向定位的第二多个导电桥。 第一多个导电桥中的每一个将第一阵列中的一个屏蔽导体与第二阵列中的屏蔽导体中的一个连接。 第二多个导电桥中的每一个将第一阵列中的一个屏蔽导体与第二阵列中的屏蔽导体中的一个连接。