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    • 5. 发明申请
    • Bit line dummy core-cell and method for producing a bit line dummy core-cell
    • 位线虚拟核心单元和产生位线虚拟核心单元的方法
    • US20080112245A1
    • 2008-05-15
    • US11586176
    • 2006-10-25
    • Martin OstermayrChristophe ChanussotVincent GouinAlexander Olbrich
    • Martin OstermayrChristophe ChanussotVincent GouinAlexander Olbrich
    • G11C11/00
    • G11C11/412G11C11/413
    • A bit line dummy core-cell comprises at least a first inverter and at least a second inverter which are cross coupled to form a bistable flip-flop. The first inverter comprises a first PMOS transistor and a first NMOS transistor connected in series by means of a first internal storage node between a high reference potential and a low reference potential. The second inverter comprises a second PMOS transistor and a second NMOS transistor connected in series by means of a second internal storage node. The source of the second PMOS transistor and the second internal storage node are connected to the low reference potential so that the first internal storage node always stores a logic high level. A first access transistor is coupled between a dummy bit line providing a self-timing signal and the first internal node storing the logical high level.
    • 位线虚拟核心单元包括交叉耦合以形成双稳态触发器的至少第一反相器和至少第二反相器。 第一反相器包括通过第一内部存储节点在高参考电位和低参考电位之间串联连接的第一PMOS晶体管和第一NMOS晶体管。 第二反相器包括通过第二内部存储节点串联连接的第二PMOS晶体管和第二NMOS晶体管。 第二PMOS晶体管和第二内部存储节点的源极连接到低参考电位,使得第一内部存储节点总是存储逻辑高电平。 第一存取晶体管耦合在提供自定时信号的伪位线和存储逻辑高电平的第一内部节点之间。
    • 9. 发明授权
    • SRAM memory cell having a dogleg shaped gate electrode structure
    • SRAM存储单元具有狗形栅电极结构
    • US08853791B2
    • 2014-10-07
    • US11593290
    • 2006-11-06
    • Uwe Paul SchroederMartin Ostermayr
    • Uwe Paul SchroederMartin Ostermayr
    • H01L27/07G11C11/412H01L27/11
    • H01L27/1104G11C11/412
    • A memory cell includes diffusion regions formed in a substrate. Each of the diffusion regions extends along a vertical direction in a layout view at a substrate level. A first gate electrode structure at a gate electrode level is generally dogleg shaped. The first gate electrode structure extends in an oblique direction, turns to a horizontal direction, extends over and crosses the diffusion regions in the horizontal direction. A first contact structure at a contact level is generally rectangular shaped in the layout view of the cell. The first contact structure electrically connects a first source/drain region of the first diffusion region to the first gate electrode structure and the first source/drain region of the second diffusion region. The first contact structure extends from the first source/drain region of the first diffusion region to the first source/drain region of the second diffusion region at the contact level.
    • 存储单元包括形成在基板中的扩散区域。 每个扩散区域在衬底层的布局图中沿垂直方向延伸。 门电极级的第一栅极电极结构通常是狗牙形。 第一栅电极结构沿倾斜方向延伸,向水平方向延伸,在水平方向上延伸并与扩散区交叉。 接触级的第一接触结构在电池的布局视图中通常为矩形。 第一接触结构将第一扩散区域的第一源极/漏极区域与第一扩散区域的第一栅极电极结构和第一源极/漏极区域电连接。 第一接触结构从第一扩散区的第一源极/漏极区域延伸到第二扩散区域的第一源极/漏极区域处于接触电平。
    • 10. 发明授权
    • Capacitors and methods of manufacture thereof
    • 电容器及其制造方法
    • US08546916B2
    • 2013-10-01
    • US12127576
    • 2008-05-27
    • Martin OstermayrRichard Lindsay
    • Martin OstermayrRichard Lindsay
    • H01L21/02
    • H01L28/91H01L27/11H01L27/1104H01L29/94
    • Semiconductor devices, capacitors, and methods of manufacture thereof are disclosed. In one embodiment, a method of fabricating a capacitor includes forming a first material over a workpiece, and patterning the first material, forming a first capacitor plate in a first region of the workpiece and forming a first element in a second region of the workpiece. A second material is formed over the workpiece and over the patterned first material. The second material is patterned, forming a capacitor dielectric and a second capacitor plate in the first region of the workpiece over the first capacitor plate and forming a second element in a third region of the workpiece.
    • 公开了半导体器件,电容器及其制造方法。 在一个实施例中,制造电容器的方法包括在工件上形成第一材料,并对第一材料进行构图,在工件的第一区域中形成第一电容器板,并在工件的第二区域中形成第一元件。 第二材料形成在工件上面和图案化的第一材料上。 图案化第二材料,在第一电容器板上的工件的第一区域中形成电容器电介质和第二电容器板,并在工件的第三区域中形成第二元件。