会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Method for manufacturing a fully self-adjusted bipolar transistor
    • 制造完全自调节双极晶体管的方法
    • US4829015A
    • 1989-05-09
    • US170897
    • 1988-03-21
    • Hans-Christian SchaberHans-Willi Meul
    • Hans-Christian SchaberHans-Willi Meul
    • H01L29/73H01L21/331H01L21/8222H01L29/732
    • H01L21/8222H01L29/7325Y10S148/01Y10S148/011Y10S148/017
    • A method for manufacturing a fully self-adjustsed bipolar transistor in which the emitter zone, the base zone, and the collector zone are aligned vertically in a silicon substrate; the collector is connected by means of a deeply extending terminal in the substrate, the inactive base zone is embedded in an insulating trench to separate the inactive base zone from the collector; the emitter terminal zone is composed of doped polycrystalline silicon and is separated from the inactive base zone by a silicon oxide layer. A fully self-adjusted bipolar transistor is produced wherein the emitter is self-adjusted relative to the base and the base is self-adjusted relative to the insulation. The number of method steps involving critical mask usage is low, and parasitic regions are minimized so that the switching speed of the component is increased. The transistor is used for integrated bipolar transistor circuits having high switching speeds.
    • 一种制造完全自调节的双极晶体管的方法,其中发射极区,基极区和集电区在硅衬底中垂直排列; 集电极通过在衬底中的深度延伸的端子连接,非活性基区被嵌入在绝缘沟槽中以将非活性基区与收集器分离; 发射极端子区由掺杂的多晶硅组成,并通过氧化硅层与非活性基极区分离。 制造完全自调节的双极晶体管,其中发射极相对于基底自我调节,并且基底相对于绝缘体自我调节。 涉及关键掩模使用的方法步骤的数量很少,寄生区域被最小化,使得部件的切换速度增加。 晶体管用于具有高开关速度的集成双极晶体管电路。
    • 5. 发明授权
    • Bipolar transistor with reduced base/collector capacitance
    • 具有降低的基极/集电极电容的双极晶体管
    • US5402002A
    • 1995-03-28
    • US737607
    • 1991-07-24
    • Thomas MeisterHans-Willi Meul
    • Thomas MeisterHans-Willi Meul
    • H01L29/73H01L21/331H01L21/8249H01L29/08H01L29/732H01L29/72
    • H01L29/66287H01L21/8249H01L29/0821H01L29/732
    • A bipolar transistor includes insulator structures defining an active transistor zone having a base, an emitter with a side facing away from the base, and a collector with a collector terminal having a side facing away from the base. The insulator structures are disposed on the sides of the emitter and the collector terminal facing away from the base, and the insulator structures limit current flow through the active transistor zone. A process for producing the bipolar transistor includes producing a collector by selective epitaxy on a zone of a substrate surrounded by insulators. A zone for the collector is defined with a spacer technique in the following steps: photolithographically producing a first opening in a first layer exposing a surface of a second layer; including at least one insulation layer in the second layer; producing spacers at edges of the first opening; and etching a second opening in the second layer defining the zone for the collector during selective back-etching of the spacers.
    • 双极晶体管包括限定具有基极的有源晶体管区域的绝缘体结构,具有背离基极的一侧的发射极和具有背离基极的一侧的集电极端子的集电极。 绝缘体结构设置在发射极和集电极端子背离基极的侧面上,绝缘体结构限制电流通过有源晶体管区域流动。 制造双极晶体管的工艺包括通过在由绝缘体包围的衬底的区域上进行选择性外延生产集电极。 采用隔离技术在以下步骤中限定用于收集器的区域:光刻地产生暴露第二层表面的第一层中的第一开口; 包括在所述第二层中的至少一个绝缘层; 在所述第一开口的边缘处产生间隔物; 以及在所述间隔物的选择性反向蚀刻期间蚀刻限定所述收集器区域的所述第二层中的第二开口。
    • 6. 发明授权
    • CMOS-compatible bipolar transistor with reduced collector/substrate
capacitance and process for producing the same
    • 具有降低的集电极/衬底电容的CMOS兼容双极晶体管及其制造方法
    • US5177582A
    • 1993-01-05
    • US754377
    • 1991-08-30
    • Thomas MeisterHans-Willi MeulHelmut KloseHermann Wendt
    • Thomas MeisterHans-Willi MeulHelmut KloseHermann Wendt
    • H01L21/8249H01L27/06H01L29/08H01L29/732
    • H01L29/0826H01L21/8249H01L27/0623H01L29/732
    • A bipolar transistor with a collector, a base and an emitter disposed in vertical succession includes a semiconductor substrate, insulating oxide zones disposed in the substrate for separating adjacent transistors, and a buried collector terminal layer at least partly disposed on the insulating oxide zones. An insulator structure laterally surrounding a collector. A subcollector is surrounded by the insulating oxide zones, has the same conductivity type with a lower impedance than the collector, is disposed under the collector and under the insulator structure, and is electrically connected to the collector. The insulator structure covers the buried collector terminal layer, laterally insulates the collector from the buried collector terminal layer, and has lateral surfaces extending inside the insulating oxide regions up to the subcollector. The buried collector terminal layer is in direct contact with the subcollector. The collector is electrically connected to the buried collector terminal layer only through the subcollector. The insulator structure has a contact hole extending to the buried collector terminal layer laterally of the active transistor zone, and a metallization filling the contact hole. A process for producing the bipolar transistor includes producing an insulator structure on a substrate for determining a location for a collector; and producing the collector by selective epitaxy only inside the insulator structure, for laterally insulating the collector with the insulator structure. An integrated circuit and method include such bipolar transistors and CMOS transistors.
    • 具有垂直相继布置的集电极,基极和发射极的双极晶体管包括半导体衬底,设置在衬底中用于分离相邻晶体管的绝缘氧化物区域和至少部分地设置在绝缘氧化物区域上的埋地集电极端子层。 横向围绕收集器的绝缘体结构。 子集电极被绝缘氧化物区围绕,具有与集电体相比具有较低阻抗的相同的导电类型,设置在集电器下方和绝缘体结构下方,并且与集电极电连接。 绝缘体结构覆盖埋地集电极端子层,使集电体与埋地集电极端子层横向绝缘,并且具有在绝缘氧化物区域内延伸直到子集电极的侧表面。 埋地集电极端子层与子集电极直接接触。 集电极仅通过子集电极电连接到埋地集电极端子层。 绝缘体结构具有在有源晶体管区域侧向延伸到集电极端子层的接触孔,以及填充接触孔的金属化。 制造双极晶体管的方法包括:在基板上制造用于确定集电体位置的绝缘体结构; 并且仅通过绝缘体结构内的选择性外延生产集电体,用于使绝缘体结构的集电体横向绝缘。 集成电路和方法包括这样的双极晶体管和CMOS晶体管。