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1. 发明授权

US09006868B2 Encapsulation of an MEMS component and a method for producing said component 有权
标题翻译： MEMS部件的封装和用于制造所述部件的方法
公开(公告)号：US09006868B2
公开(公告)日：2015-04-14
申请号：US13976420
申请日：2011-11-18
申请人： Christian Bauer , Hans Krüger , Jürgen Portmann , Alois Stelzl
发明人： Christian Bauer , Hans Krüger , Jürgen Portmann , Alois Stelzl
IPC分类号： H01L23/552 , B81B7/00 , H03H3/02 , H03H9/10 , H01L23/29 , H01L21/56 , H01L25/065 , B81C1/00 , H01L23/31
CPC分类号： B81B7/0064 , B81C1/00333 , H01L21/561 , H01L23/29 , H01L23/3121 , H01L23/3142 , H01L23/552 , H01L25/0655 , H01L2224/16225 , H01L2924/1461 , H03H3/02 , H03H9/10 , H01L2924/00
摘要： The invention relates to a component and a method for producing said component. The component comprises a substrate (S), a chip (CH), a frame (MF), which is connected to the substrate (S) and on which the chip (CH) bears. A metallic closure layer (ML) encompasses the frame (MF), the substrate (S) and the chip (CH) such that a volume enclosed by the substrate (S), the chip (CH) and the frame (MF) is hermetically sealed.
摘要翻译：本发明涉及一种用于生产所述组分的组分和方法。该组件包括与衬底（S）连接并且芯片（CH）承载在其上的衬底（S），芯片（CH），框架（MF）。金属封闭层（ML）包围框架（MF），衬底（S）和芯片（CH），使得由衬底（S），芯片（CH）和框架（MF）包围的体积是气密的密封。

2. 发明授权

US07608789B2 Component arrangement provided with a carrier substrate 有权
标题翻译：组件布置设置有载体衬底
公开(公告)号：US07608789B2
公开(公告)日：2009-10-27
申请号：US11573610
申请日：2004-08-02
申请人： Hans Krüger , Alois Stelzl
发明人： Hans Krüger , Alois Stelzl
IPC分类号： H01L23/28
CPC分类号： H01L23/49822 , H01L23/3121 , H01L23/315 , H01L23/49894 , H01L23/564 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01079 , H01L2924/09701 , H01L2924/1461 , H01L2924/19041 , Y10T428/12375 , Y10T428/12486 , Y10T428/23 , Y10T428/24 , H01L2924/00 , H01L2224/0401
摘要： A component arrangement includes a carrier substrate having at least one component arranged thereon. The carrier substrate contains at least one layer of glass film and an intermediate layer, which is mounted on at least one side of the glass film. The component is covered and sealed by a cover layer mounted on the carrier substrate.
摘要翻译：元件布置包括其上布置有至少一个元件的载体基板。载体衬底包含至少一层玻璃膜和中间层，其安装在玻璃膜的至少一侧上。该组件由安装在载体基底上的覆盖层覆盖和密封。

3. 发明授权

US06528924B1 Electronic component, in particular a component operating with surface acoustic waves 有权
标题翻译：电子部件，特别是用表面声波操作的部件
公开(公告)号：US06528924B1
公开(公告)日：2003-03-04
申请号：US09198887
申请日：1998-11-24
申请人： Alois Stelzl , Hans Krüger , Wolfgang Pahl
发明人： Alois Stelzl , Hans Krüger , Wolfgang Pahl
IPC分类号： H01L4108
CPC分类号： H03H9/1085 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/16152 , H01L2924/3025 , H03H9/0585 , H03H9/059 , H03H9/1078 , H01L2924/00014
摘要： A SAW component has a component system that is mounted on a base plate such that it makes electrical contact with the base plate. A protective coating is provided on a component side of the component system that faces away from a connecting region between the component system and the base plate. The protective coating forms a seal, which is proof against environmental influences, for the component system toward the base plate.
摘要翻译： SAW元件具有安装在基板上以使其与基板电接触的部件系统。在组件系统的组件侧面上提供保护涂层，该组件侧面远离组件系统和基板之间的连接区域。保护涂层形成一个密封，这是防止环境影响的元件系统朝向底板的密封。

4. 发明申请

US20130341773A1 ENCAPSULATION OF AN MEMS COMPONENT AND A METHOD FOR PRODUCING SAID COMPONENT 有权
标题翻译： MEMS组件的封装和用于生产合格组件的方法
公开(公告)号：US20130341773A1
公开(公告)日：2013-12-26
申请号：US13976420
申请日：2011-11-18
申请人： Christian Bauer , Hans Krüger , Jürgen Portmann , Alois Stelzl
发明人： Christian Bauer , Hans Krüger , Jürgen Portmann , Alois Stelzl
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0064 , B81C1/00333 , H01L21/561 , H01L23/29 , H01L23/3121 , H01L23/3142 , H01L23/552 , H01L25/0655 , H01L2224/16225 , H01L2924/1461 , H03H3/02 , H03H9/10 , H01L2924/00
摘要： The invention relates to a component and a method for producing said component. The component comprises a substrate (S), a chip (CH), a frame (MF), which is connected to the substrate (S) and on which the chip (CH) bears. A metallic closure layer (ML) encompasses the frame (MF), the substrate (S) and the chip (CH) such that a volume enclosed by the substrate (S), the chip (CH) and the frame (MF) is hermetically sealed.
摘要翻译：本发明涉及一种用于生产所述组分的组分和方法。该组件包括与衬底（S）连接并且芯片（CH）承载在其上的衬底（S），芯片（CH），框架（MF）。金属封闭层（ML）包围框架（MF），衬底（S）和芯片（CH），使得由衬底（S），芯片（CH）和框架（MF）包围的体积是气密的密封。

5. 发明授权

US06519822B1 Method for producing an electronic component 有权
标题翻译：电子部件的制造方法
公开(公告)号：US06519822B1
公开(公告)日：2003-02-18
申请号：US09699321
申请日：2000-10-30
申请人： Alois Stelzl , Hans Krüger
发明人： Alois Stelzl , Hans Krüger
IPC分类号： H04R1700
CPC分类号： H03H9/1078 , Y10T29/42 , Y10T29/4913 , Y10T29/49146 , Y10T29/49171 , Y10T29/49172
摘要： A method for producing an electronic component includes placing an enclosed frame on a baseplate. A chip is provided to be fitted within the frame, forming a first given space between the chip and the baseplate and forming a second given space between the chip and the frame. The first given space is enclosed in a hermetically sealed manner by pressing a film onto the chip, except on a surface of the chip facing the baseplate, such that the film surrounds the chip and at least reaches the surface of the baseplate. The second given space is filled with a casting compound. The film is then removed at surface regions of the film being free of the casting compound. Finally, a cover composed of an electrically conductive material is applied on the chip, the casting compound and the frame.
摘要翻译：一种用于制造电子部件的方法包括将封闭的框架放置在基板上。芯片设置成装配在框架内，在芯片和底板之间形成第一个给定的空间，并在芯片和框架之间形成第二个给定的空间。第一给定空间通过将薄膜压在芯片上，除了面对基板的芯片的表面之外，以密封的方式封闭，使得薄膜包围芯片并且至少到达基板的表面。第二个给定的空间充满了一个浇注料。然后在不含铸塑料的膜的表面区域除去膜。最后，将由导电材料构成的盖子施加在芯片，铸造复合物和框架上。

6. 发明授权

US06310420B1 Electronic component in particular an saw component operating with surface acoustic waves and a method for its production 失效
标题翻译：电子部件，特别是用表面声波操作的锯组件及其制造方法
公开(公告)号：US06310420B1
公开(公告)日：2001-10-30
申请号：US09103158
申请日：1998-06-22
申请人： Wolfgang Pahl , Alois Stelzl , Hans Krüger
发明人： Wolfgang Pahl , Alois Stelzl , Hans Krüger
IPC分类号： H01L4108
CPC分类号： H03H9/1092
摘要： The SAW component has electrical structures which are encapsulated and sealed against environmental influences by a cap cover. Connecting pads of the electrical structures are exposed in a window of the cap cover and the pads are provided with a metallization. Solderable metallized areas are formed on the cap cover, and they are connected to the pad metallizations via through-plated holes.
摘要翻译： SAW组件具有电气结构，其被封装和密封以抵抗由盖罩的环境影响。电气结构的连接垫暴露在盖罩的窗口中，并且垫具有金属化。可焊接金属化区域形成在盖盖上，并且它们通过通孔连接到焊盘金属化。

7. 发明授权

US06909183B2 Substrate for an electric component and method for the production thereof 有权
标题翻译：电气部件用基板及其制造方法
公开(公告)号：US06909183B2
公开(公告)日：2005-06-21
申请号：US10470117
申请日：2002-01-21
申请人： Gregor Feiertag , Alois Stelzl , Hans Krüger
发明人： Gregor Feiertag , Alois Stelzl , Hans Krüger
IPC分类号： H01L23/12 , H01L21/60 , H01L23/498 , H03H3/08 , H03H9/10 , H03H9/145 , H03H9/25 , H05K1/03 , H05K1/11 , H01L23/48
CPC分类号： H03H9/059 , H01L23/49816 , H01L2224/16225 , H01L2924/00014 , H01L2924/09701 , H03H9/1078 , H03H9/1092 , H05K1/0306 , H05K1/114 , H05K2201/10674 , H01L2224/0401
摘要： For a component mounted with the flip-chip technique, in particular surface wave elements, it is proposed to use a low-shrinkage ceramic substrate over which (as needed) multi-layer metallizations are produced by metal deposition. The bumps can also be produced by self-aligning metal deposition.
摘要翻译：对于使用倒装芯片技术安装的部件，特别是表面波元件，建议使用低收缩陶瓷基板，通过金属沉积在其上产生（根据需要）多层金属化。也可以通过自对准金属沉积来生产凸块。

8. 发明授权

US06838739B2 Component with a label 有权
标题翻译：具有标签的组件
公开(公告)号：US06838739B2
公开(公告)日：2005-01-04
申请号：US10240872
申请日：2001-03-05
申请人： Alois Stelzl , Hans Krüger , Ernst Christi
发明人： Alois Stelzl , Hans Krüger , Ernst Christi
IPC分类号： H01L41/09 , G09F3/00 , G09F7/16 , H01L23/10 , H01L23/544 , H01L23/552 , H01L41/22 , H03H9/25 , H01L29/82 , H01L27/14 , H01L31/0232
CPC分类号： C23C28/021 , B41M5/24 , C23C28/023 , C23C28/028 , G09F3/00 , G09F7/165 , H01L23/10 , H01L23/544 , H01L23/552 , H01L2223/54473 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/0102 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/16235 , H01L2924/3025 , H01L2224/05599
摘要： For labeling a component provided with a metallic cover layer, it is proposed that at least one additional contrast layer is arranged over the cover layer. The contrast layer produces an optical contrast with the metallic cover layer and is capable of being eroded by a laser for producing a label.
摘要翻译：为了标记设置有金属覆盖层的部件，建议在覆盖层上方布置至少一个附加的对比层。对比层产生与金属覆盖层的光学对比度，并且能够被用于产生标签的激光器侵蚀。

9. 发明授权

US06555758B1 Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the like 有权
标题翻译：用于诸如SAW组件的电子部件的多个空白以及构建凸块，焊接框架，间隔件等的方法
公开(公告)号：US06555758B1
公开(公告)日：2003-04-29
申请号：US09716339
申请日：2000-11-20
申请人： Alois Stelzl , Hans Krüger , Karl Weidner , Manfred Wossler
发明人： Alois Stelzl , Hans Krüger , Karl Weidner , Manfred Wossler
IPC分类号： H05K116
CPC分类号： H05K3/403 , H01L21/4853 , H01L23/49805 , H01L23/49816 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/0102 , H01L2924/01032 , H01L2924/01033 , H01L2924/01043 , H01L2924/01057 , H01L2924/01068 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H03H3/00 , H05K1/0243 , H05K3/0052 , H05K3/242 , H05K3/245 , H05K3/3442 , H05K3/3473 , H05K3/42 , H05K2201/09181 , H05K2201/09481 , H05K2201/10083 , H05K2203/043 , H05K2203/1572 , H01L2224/81
摘要： The multiple blank can be diced into individual blanks for electronic components, in particular surface acoustic wave components. Each of the individual blanks is suitable for contact to be made with chips in the flip-chip technique and for contact to be made with the individual blanks in the SMD technique, using external connections. The multiple blank has, for each individual blank, metalized areas which are located on a network which is integrated between layers of the multiple blank and leads to a connecting terminal. Bumps are built up by depositing metal by electroplating on the metalized areas.
摘要翻译：多个空白可以切成单个空白的电子元件，特别是表面声波元件。每个单独的坯料适合于以倒装芯片技术制造的芯片进行接触，并且使用外部连接来使用SMD技术中的各个坯件进行接触。多个坯料对于每个单独的坯件具有位于网络上的金属化区域，该网络集成在多个坯件的层之间并通向连接端子。通过电镀在金属化区域上沉积金属来构建冲击波。

10. 发明授权

US06242842B1 Electrical component, in particular saw component operating with surface acoustic waves, and a method for its production 失效
标题翻译：电气部件，特别是用表面声波操作的锯组件及其制造方法
公开(公告)号：US06242842B1
公开(公告)日：2001-06-05
申请号：US09103166
申请日：1998-06-22
申请人： Wolfgang Pahl , Alois Stelzl , Hans Krüger
发明人： Wolfgang Pahl , Alois Stelzl , Hans Krüger
IPC分类号： H01L4108
CPC分类号： H03H9/1092 , H03H9/02913 , H03H9/0547 , H05K9/0039 , Y10T29/41 , Y10T29/42 , Y10T29/49016
摘要： The SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which may be reinforced with current-less or galvanic deposition.
摘要翻译： SAW元件在衬底上具有导电结构。帽盖封装并密封结构免受环境影响。 RF护罩放置在盖帽上。 RF屏蔽是由TiW，Cu或Ni和Au的材料层序列形成的金属化，其可以用无电流或电沉积来增强。

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